The TMS320F280049CPZQR is a 32-bit real-time microcontroller from Texas Instruments' C2000 Piccolo family, purpose-built for high-performance digital power control, motor control, and other real-time embedded control applications. The device is centered around TI's C28x digital signal processing core, a fixed- and floating-point architecture specifically optimized for the kind of fast, deterministic mathematical computation required in closed-loop control systems such as motor drives, digital power supplies, solar inverters, and electric vehicle subsystems. This particular part number represents the "C" variant within the TMS320F28004x family, which grants access to an integrated Configurable Logic Block, a flexible programmable logic resource that allows engineers to implement custom digital logic functions directly on-chip, such as specialized PWM waveform shaping, custom protocol interfaces, or glue logic that would otherwise require an external FPGA or discrete logic devices. This variant also provides access to a secure ROM library containing TI's InstaSPIN-FOC technology, a field-oriented motor control solution that significantly simplifies the development of sensorless motor control algorithms by handling much of the underlying control theory and tuning complexity in pre-validated, secure firmware. Beyond its core processing capabilities, the device integrates an extensive set of control-oriented peripherals that are characteristic of the C2000 platform, including high-resolution pulse-width modulation outputs, enhanced capture modules, and a multi-channel sigma-delta filter module that enables isolated current and voltage sensing across an isolation barrier without requiring a separate digital isolator and decoder chip. A dedicated Control Law Accelerator runs in parallel with the main processing core, offloading time-critical control loop calculations so that the main core remains free to handle communication, supervisory logic, and other system-level tasks, which is particularly valuable in systems running multiple simultaneous control loops. Connectivity on the device is supported through a broad set of industry-standard communication interfaces, allowing it to interface with a wide range of external sensors, communication networks, and host systems without requiring additional bridge components. The device also supports TI's Fast Serial Interface, a high-speed, robust communication protocol intended to simplify board-to-board and module-to-module communication in multi-controller systems, an increasingly common need in distributed power and motor control architectures. This part is qualified to automotive electronics reliability standards, making it suitable for deployment in vehicle power electronics, traction inverters, onboard chargers, and other automotive systems where component robustness, extended temperature operation, and rigorous quality screening are required. The device also supports TI's functional safety documentation framework, providing the architectural transparency and failure mode analysis resources needed by system designers building safety-critical control systems around the device. It is housed in a surface-mount package suited to dense power electronics board layouts and is supplied in tape-and-reel packaging for automated assembly. Spec Sheet Identification Part Number: TMS320F280049CPZQR Device Family: C2000 Piccolo, TMS320F28004x Manufacturer: Texas Instruments Variant: "C" type — with Configurable Logic Block and secure ROM/InstaSPIN-FOC access Functional Classification Device Type: 32-bit real-time microcontroller Core Architecture: C28x digital signal processing core Math Acceleration: Floating-Point Unit and Trigonometric Math Unit for control-loop computation Parallel Control Processing: Integrated Control Law Accelerator Programmable Logic: Configurable Logic Block (CLB) for custom digital logic functions Motor Control Library: Secure ROM with InstaSPIN-FOC sensorless field-oriented control Memory Program Memory Type: Embedded flash memory Memory Architecture: Supports field reprogramming for firmware updates and calibration data storage Control & Analog Peripherals PWM Capability: Frequency-independent, high-resolution PWM outputs Capture Module: Enhanced capture (eCAP) peripheral Isolated Sensing: Multi-channel sigma-delta filter module (SDFM) for isolated current/voltage sensing Analog Integration: Integrated high-speed analog-to-digital converters and internal digital-to-analog converters Programmable Gain: Integrated programmable gain amplifiers Communication Interfaces Standard Interfaces: SPI, SCI, I2C, LIN, and CAN connectivity Power Management Bus: Fully compliant PMBus support High-Speed Module Interface: Fast Serial Interface (FSI) for board-to-board and module-to-module communication Target Applications Application Domains: Industrial motor drives, solar inverters, digital power supplies, electric vehicle and transportation systems, sensing and signal processing Environmental & Qualification Automotive Qualification: AEC-Q100 qualified Functional Safety Support: Documentation and architecture support for functional safety-compliant system design Lifecycle Status: Active production Package Package Type: Surface-mount quad flat package style (LQFP) Mounting: Surface mount technology (SMT) Packaging Format Supply Format: Tape-and-reel, per part suffix designation #TMS320F280049 #C2000 #Piccolo #TexasInstruments #DigitalSignalController #RealTimeMCU #MotorControl #DigitalPowerControl #InstaSPINFOC #FieldOrientedControl #ConfigurableLogicBlock #AECQ100 #AutomotiveMCU #PowerElectronics #EmbeddedSystems #LQFP #SurfaceMount #SemiconductorIC #EngineeringSpec #ComponentLibrary #CommonPartsLibrary

dsPIC dsPIC™ 33CK, Functional Safety (FuSa) Microcontroller IC 16-Bit 100MHz 128KB (128K x 8) FLASH 48-UQFN (6x6) 28/36/48/64/80-Pin Digital Signal Controllers with High-Resolution PWM and CAN Flexible Data (CAN FD) perating Conditions • 3.0V to 3.6V, -40°C to +125°C, DC to 100 MIPS • 3.0V to 3.6V, -40°C to +150°C, DC to 70 MIPS Core: 16-Bit dsPIC33CK CPU • 32-256 Kbytes of Program Flash with ECC and 8-24K RAM • Fast 6-Cycle Divide • LiveUpdate • Code Efficient (C and Assembly) Architecture • 40-Bit Wide Accumulators • Single-Cycle (MAC/MPY) with Dual Data Fetch • Single-Cycle, Mixed-Sign MUL Plus Hardware Divide • 32-Bit Multiply Support • Four Sets of Interrupt Context Saving Registers which Include Accumulator and STATUS for Fast Interrupt Handling • Zero Overhead Looping • RAM Memory Built-In Self-Test (MBIST) Clock Management • Internal Oscillator • Programmable PLLs and Oscillator Clock Sources • Reference Clock Output • Fail-Safe Clock Monitor (FSCM) • Fast Wake-up and Start-up • Backup Internal Oscillator Power Management • Low-Power Management Modes (Sleep, Idle, Doze) • Integrated Power-on Reset and Brown-out Reset High-Speed PWM • Eight PWM Pairs • Up to 250 ps PWM Resolution • Dead Time for Rising and Falling Edges • Dead-Time Compensation • Clock Chopping for High-Frequency Operation • PWM Support for: - DC/DC, AC/DC, inverters, PFC, lighting - BLDC, PMSM, ACIM, SRM motors • Fault and Current Limit Inputs • Flexible Trigger Configuration for ADC Triggering Timers/Output Compare/Input Capture • One General Purpose Timer • Peripheral Trigger Generator (PTG): - Up to 15 trigger sources to other peripheral modules - CPU independent state machine-based instruction sequencer • Nine MCCP/SCCP modules which Include Timer, Capture/Compare and PWM: - One MCCP - Eight SCCPs - 16 or 32-bit time base - 16 or 32-bit capture - 4-deep capture buffer • Fully Asynchronous Operation, Available in Sleep Modes

22 (20 + 2 Power) Position Connector Header, Outer Shroud Contacts Surface Mount Gold The BM24-20DP/2-0.35V(51) is a board-to-board and board-to-FPC header connector manufactured by Hirose Electric. It belongs to the BM24 series, a family of fine-pitch hybrid power and signal connectors designed for applications that require both data signaling and supplementary power delivery within the same compact interconnect, eliminating the need for a separate dedicated power connector alongside the signal interface. The connector functions as the plug (header) half of a mating pair, intended to mate with a corresponding BM24 receptacle to join two printed circuit boards, or a printed circuit board and a flexible printed circuit, in a low-profile board-to-board arrangement. This part number designates a configuration with a defined signal contact count supplemented by additional dedicated power contacts, reflecting the series' hybrid design philosophy in which the majority of positions handle signal or data lines while a smaller subset of positions is reserved for carrying higher current to support onboard power rails. This arrangement is particularly useful in compact consumer devices such as smartphones, wearables, and camera modules, where both data interfaces and local power distribution must be routed across a board-to-board junction without dedicating separate connectors to each function. The series is positioned by Hirose as supporting high-speed signaling standards including USB interfaces, making it suitable for applications that combine high-speed data transmission with power delivery in a single compact connector footprint. The connector's fine contact pitch and low mated height make it well suited to thin, space-constrained form factors where minimizing both footprint area and stack height is a priority. As with other Hirose board-to-board offerings, the connector is non-polarized in its base mechanical design, and it is supplied on embossed carrier tape for automated pick-and-place assembly, with construction compliant to RoHS material restrictions. Mechanically, the header is built to withstand the repeated mating cycles typical of consumer electronics manufacturing, rework, and field service, while maintaining stable, low-resistance contact across both its signal and power contact paths under realistic vibration and thermal conditions. As a header-style connector, it is intended to be soldered directly to a host PCB, with its mating receptacle counterpart soldered to the opposing board or FPC, allowing the assemblies to be joined and separated as needed throughout the product lifecycle. Spec Sheet Identification Part Number: BM24-20DP/2-0.35V(51) Series: BM24 Connector Style: Hybrid power/signal board-to-board and board-to-FPC connector Connector Type / Configuration Type: Header (plug) Gender: Male Orientation: Straight, surface mount Contact Arrangement: Hybrid configuration combining signal contacts and dedicated power contacts Polarization: Non-polarized Electrical Ratings Applicable High-Speed Protocols: USB2.0, USB3.0, USB3.1 (series capability) Transmission Rate: High-speed, multi-gigabit class (series capability) Power Contacts: Dedicated higher-current contacts integrated alongside signal contacts Mechanical Specifications Contact Pitch: Fine pitch Mounting Pitch: Matches contact pitch Mated Height: Low-profile Mounting Method: Surface mount technology (SMT) Mating Cycles: Rated for repeated mate/unmate cycles typical of consumer electronics assembly and rework Contact & Material Properties Contact Plating (Mating Area): Gold Insulator Material: High-temperature engineering resin suitable for SMT reflow Environmental Ratings RoHS Compliance: Yes Packaging Packaging Format: Embossed carrier tape, reel format Packaging Code Meaning: Suffix denotes embossed tape packaging at a standard reel quantity Mating Compatibility Mates With: Corresponding BM24 series receptacle connector Application Note: Intended for hybrid power and signal board-to-board or board-to-FPC interconnection in compact consumer electronics #BM24 #Hirose #HiroseElectric #BoardToBoard #BoardToFPC #HybridConnector #PowerAndSignal #Connector #SMTConnector #FinePitchConnector #USB #HighSpeedConnector #ConsumerElectronics #PCBDesign #HardwareEngineering #ConnectorDatasheet #EngineeringSpec #RoHSCompliant #ComponentLibrary #CommonPartsLibrary

20 Position Connector Header, Center Strip Contacts Surface Mount Gold DF30FC-20DP-0.4V(81) is a 20-position, 0.4 mm pitch, surface-mount (SMT) board-to-board mezzanine connector from the Hirose DF30 series. It is the plug/header (DP) side of the connector pair and is designed for ultra-low-profile, high-density PCB stacking applications commonly found in compact embedded systems, cameras, wireless modules, industrial electronics, and portable devices. The connector features gold-plated contacts for reliable electrical performance and supports a mating height of approximately 0.9 mm when paired with the corresponding receptacle. 20 contacts / positions 0.4 mm fine pitch for high-density designs Board-to-board (mezzanine) connector Surface-mount (SMT) mounting Ultra-low mating height (~0.9 mm) Gold-plated contacts for improved reliability Straight orientation Compact footprint for space-constrained applications Rated for approximately 50 mating cycles Operating temperature range: -35°C to +85°C RoHS compliant Typical Applications Embedded computing modules Camera and imaging systems Industrial control equipment IoT devices Portable electronics Wireless communication modules #Hirose #DF30Series #BoardToBoardConnector #MezzanineConnector #SMTConnector #HighDensityConnector #0p4mmPitch #EmbeddedSystems #IoT #ElectronicsDesign #PCBDesign #CompactElectronics #ConnectorSolutions

225k ~ 1.4M Modem PSK 32-QFN (5x5) The DCB1M is a device for multiplex communication over noisy power lines, at speed up to 1.4Mbit/s. The DCB1M is based on the DC-BUS™ technology for network communication between modules sharing a common DC or AC powerline. The device avoids complex cabling, saves weight, and simplifies installation. The DCB1M supports UART, SPI, DMX512, RDM, and I 2C protocols, enabling the user to meet this application protocol. Sleep mode allows low power consumption when the device is not used. A QFN32 5x5 mm package provides a small PCB footprint The DCB1M is beneficial for many applications ranging from LED, Aerospace, Automotive, Industrial, and even Toys. Features • Noise robust UART, SPI, DMX512, RDM, and I2C transceiver over DC powerline. • Bitrate up to 1.4Mbit/s over the powerline. • Multiple networks may operate over a single powerline. • 251 selectable carrier frequencies (5MHz to 30MHz). • Built-in CSMA/CA (powerline arbitration) mechanism. • Operates as Multi-master Transceiver in a multiplex network. • Channel interference detection. • Communicates over a wide range of DC voltages. • Power management (Sleep modes) for low power consumption.

26 MHz ±10ppm Crystal 9pF 40 Ohms 4-SMD, No Lead # TSX-3225 26.0000MF09Z-AC0 ## General Description The TSX-3225 26.0000MF09Z-AC0 is a high-precision surface-mount quartz crystal manufactured by Seiko Epson Corporation. It is designed to provide a stable and accurate clock reference for microcontrollers, wireless communication modules, RF transceivers, processors, and other digital electronic systems. The crystal utilizes advanced quartz resonator technology to deliver reliable frequency generation with excellent stability, low phase noise, and long-term performance. Its compact package and low-profile construction make it suitable for space-constrained applications including Internet of Things devices, industrial control systems, wireless sensors, communication equipment, consumer electronics, and embedded computing platforms. ## Key Features ### Frequency Characteristics * Precision quartz crystal resonator * Stable frequency generation * Excellent frequency accuracy * Low frequency drift * Reliable long-term frequency stability * Suitable for clock generation and timing applications ### Electrical Characteristics * Low equivalent series resistance * Reliable oscillator startup performance * Stable operation with low-power oscillator circuits * Optimized for microcontroller and RF applications * Consistent electrical characteristics across operating conditions ### Mechanical Characteristics * Surface-mount package construction * Compact footprint design * Low-profile structure * Automated assembly compatible * Reflow soldering compatible * Suitable for high-density PCB layouts ### Timing Performance * Accurate clock reference generation * Low phase noise characteristics * Stable timing performance * Reliable synchronization capability * Suitable for communication and processing systems ### Material Construction * High-quality quartz resonator element * Hermetically sealed package construction * Industrial-grade materials * RoHS-compliant design * Lead-free compatible manufacturing ### Environmental Characteristics * Long operational service life * Reliable operation under industrial conditions * Resistant to environmental stress * Stable performance across operating temperature ranges * High reliability for continuous operation ### Application Areas * Microcontroller Systems * Wireless Communication Modules * Bluetooth Devices * Wi-Fi Equipment * RF Transceivers * Internet of Things Devices * Industrial Automation Systems * Embedded Controllers * Consumer Electronics * Data Communication Equipment * Smart Sensors * Portable Electronic Products ### Compliance * RoHS Compliant * Lead-Free Compatible * Industrial-Grade Frequency Control Component ## Manufacturer Seiko Epson Corporation ## Product Family TSX Series Surface-Mount Quartz Crystals #TSX3225 #260000MF09ZAC0 #EpsonCrystal #QuartzCrystal #SMDCrystal #CrystalOscillator #FrequencyControl #ClockSource #EmbeddedSystems #WirelessElectronics #RFDesign #Microcontroller #IoTDevices #IndustrialElectronics #ElectronicsEngineering