Air Quality Sensor CO2 Sensor 2.5V/3.3V/5V 20-Pin SMD EP T/R The SCD41-D-R1 is a miniature photoacoustic carbon dioxide sensor module developed by Sensirion for high-accuracy environmental sensing applications. The device integrates a CO₂ sensing element, temperature sensor, humidity sensor, optical components, calibration memory, and digital signal processing into a compact surface-mount package suitable for embedded systems and portable electronics. The sensor utilizes photoacoustic sensing technology to provide precise carbon dioxide concentration measurements while maintaining low power consumption and long-term stability. Integrated humidity and temperature sensing capabilities enable environmental compensation and simplify system integration by reducing the need for external sensors. The SCD41 communicates through a standard I²C digital interface and supports automatic self-calibration functions for reliable long-term operation. Its compact footprint and low energy requirements make it suitable for battery-powered devices, smart building systems, HVAC equipment, indoor air quality monitoring systems, and IoT applications. The module is factory calibrated and designed for continuous monitoring of indoor air quality conditions. The integrated architecture minimizes external component requirements while enabling accurate sensing performance across a wide operating range. Key Features Photoacoustic CO₂ sensing technology Integrated temperature and humidity sensing High accuracy carbon dioxide measurement I²C digital communication interface Low power consumption operation Automatic self-calibration support Compact surface-mount package Factory calibrated output Long-term measurement stability Optimized for indoor air quality applications Low-profile PCB mounting design RoHS and halogen-free compliant Electrical Characteristics Low-voltage supply operation Low average current consumption suitable for portable devices Integrated digital signal processing Non-volatile calibration memory Standard I²C communication compatibility Stable operation across industrial environmental conditions Mechanical Characteristics Compact SMD package for space-constrained applications Surface-mount assembly compatible Low-profile package structure Integrated optical cavity and sensing chamber Moisture-sensitive device requiring controlled handling during assembly Functional Characteristics Real-time carbon dioxide concentration monitoring Simultaneous temperature and humidity measurement Automatic environmental compensation Continuous and periodic measurement modes Fast startup and measurement response Long operational lifetime with stable calibration Optimized airflow design for accurate sensing Suitable for continuous indoor environmental monitoring Typical Applications Indoor air quality monitoring systems Smart thermostats and HVAC controllers Building automation equipment Demand-controlled ventilation systems Portable environmental monitoring devices Smart home and IoT products Air purification systems Occupancy and ventilation monitoring Battery-powered sensing devices Consumer and industrial environmental monitoring equipment #commonpartslibrary #sensor #airquality

Pressure Sensor 4.35PSI ~ 18.13PSI (30kPa ~ 125kPa) 9-LGA The BMP585 is a high-precision digital barometric pressure sensor designed for accurate altitude and environmental pressure measurement in compact, low-power embedded systems. It integrates a MEMS sensing element with advanced signal conditioning and digital compensation circuitry to provide highly stable and reliable pressure and temperature data across a wide operating range. The device is optimized for portable electronics, industrial sensing, indoor navigation, weather monitoring, drones, and IoT applications requiring precise atmospheric measurements. The sensor supports digital communication through standard serial interfaces, enabling straightforward integration with modern microcontrollers and processors. Its low noise performance, high resolution, and fast response characteristics make it suitable for applications involving motion tracking, vertical positioning, and environmental monitoring. The compact surface-mount package allows efficient PCB layout integration in space-constrained designs. The BMP585 incorporates configurable sampling, filtering, and power management features to balance measurement accuracy, bandwidth, and energy consumption. Internal calibration and compensation algorithms reduce system-level complexity while improving long-term stability and measurement consistency. The device is designed for robust operation under varying environmental conditions and supports low-power modes for battery-operated systems. Engineering Specification Device Type Digital barometric pressure and temperature sensor Sensor Functions Atmospheric pressure sensing Temperature sensing Altitude estimation support Pressure Measurement High-resolution MEMS pressure sensing element Integrated digital compensation and calibration Low-noise pressure measurement architecture Temperature Measurement Integrated temperature sensing for environmental monitoring and pressure compensation Communication Interface I²C interface support SPI interface support Power Features Low-power operation Configurable performance and sampling modes Sleep and standby operating capability Signal Processing Integrated digital filtering Configurable oversampling Internal compensation engine Package Information Compact surface-mount package RoHS-compliant construction Operating Characteristics High measurement stability Fast response time Designed for portable and industrial environments Application Areas Wearable devices Indoor navigation systems Portable weather stations Industrial monitoring IoT sensing nodes Drones and altitude tracking systems Consumer electronics #commonpartslibrary #integratedcircuit #pressuresensor

8 Position Connector Receptacle, Center Strip Contacts Surface Mount Gold The TE Connectivity part 2386586-1 is a fine-pitch board-to-board (BTB) PCB receptacle connector designed for compact, high-density electronic devices. It is a vertical surface-mount connector with 8 positions and a 0.4 mm pitch, commonly used in portable electronics, embedded systems, and space-constrained PCB designs. Key Features Connector Type: PCB mount receptacle Connector System: Board-to-board (BTB) Positions: 8-pin Pitch: 0.4 mm fine pitch Rows: 2 Mounting Style: Surface mount (SMT) Orientation: Vertical Stack Height: 0.8 mm low-profile design Contact Plating: Gold (Au) Contact Material: Copper alloy Rated Current: 0.5 A max per contact Operating Voltage: 60 VDC Temperature Range: −40 °C to +85 °C Housing Material: High-temperature thermoplastic Application: Signal transmission in compact electronics Packaging: Tape & Reel for automated assembly This connector is optimized for: Compact embedded systems Wearables and handheld devices High-density PCB stacking Consumer electronics Low-profile modular designs

Optical Sensor Through-Beam 0.197" (5mm) PCB Mount The EE-SX4081 specification defines the engineering requirements for a slot-type photomicrosensor designed for non-contact object detection and position sensing in electronic and electromechanical systems. This specification establishes the functional, electrical, mechanical, environmental, and quality requirements necessary to ensure accurate optical sensing, reliable switching performance, and long-term operational stability. The component is intended for use in industrial automation, office equipment, consumer electronics, and embedded control systems requiring precise detection of object presence, motion, or position. The integrated infrared emitter and phototransistor receiver provide dependable sensing through interruption of the optical path, enabling high-speed, contactless detection in compact system designs. Engineering Requirements The photomicrosensor shall be manufactured using qualified optoelectronic components and controlled production processes to ensure consistent sensing performance, mechanical integrity, and long service life. The optical assembly shall maintain accurate alignment between the emitter and receiver to provide stable detection characteristics throughout the specified operating conditions. Electrical characteristics shall provide reliable switching response, stable output behavior, and low power consumption while maintaining consistent sensitivity across the intended operating voltage and temperature ranges. The sensor shall exhibit reliable performance under normal ambient light conditions and shall maintain signal integrity during continuous operation. Mechanical construction shall ensure precise slot dimensions, secure mounting capability, and resistance to vibration, mechanical shock, and thermal cycling encountered during normal operation. The package shall be suitable for printed circuit board assembly and shall withstand standard soldering and handling processes without degradation. Workmanship shall be free from defects including contamination, optical misalignment, package damage, corrosion, or structural irregularities that could affect sensing accuracy or reliability. Inspection, validation, and testing shall be performed using calibrated equipment and controlled quality procedures to verify compliance with engineering requirements. Any deviation from this specification shall require formal engineering evaluation, documented technical justification, and approval through the established engineering change control process before implementation. Documentation Supporting documentation shall include engineering drawings, electrical specifications, optical performance data, qualification reports, inspection records, and revision-controlled manufacturing documentation. All documentation shall be maintained under formal configuration management and quality assurance systems to ensure complete traceability throughout the product lifecycle. Revision Control Any modification to this specification shall be processed through the formal engineering change management system. All revisions shall undergo technical review, validation, and approval before release to ensure continued compliance with design intent and applicable engineering standards. #EngineeringSpecification #Photomicrosensor #OpticalSensor #SlotSensor #IndustrialAutomation #EmbeddedSystems #Optoelectronics #QualityAssurance #EngineeringDocumentation #ElectronicComponents

Battery Fuel Gauge IC Multi-Chemistry 32-QFN (4x4) The BQ41Z50RSNR is a highly integrated battery fuel gauge and battery management IC designed for single-cell and multi-cell lithium-ion and lithium-polymer battery packs. It provides accurate battery monitoring, protection, authentication, and state estimation functions for portable, industrial, and embedded power applications. The device incorporates advanced Impedance Track™ fuel gauging technology to deliver precise state-of-charge, state-of-health, and runtime predictions across varying operating conditions and battery aging profiles. The device integrates battery protection features including overvoltage, undervoltage, overcurrent, short-circuit, and temperature monitoring to enhance system safety and reliability. It supports SMBus and I²C communication interfaces for host processor interaction and system diagnostics. Internal flash memory allows programmable configuration parameters, calibration data, and battery profile storage. The BQ41Z50RSNR is optimized for compact battery-powered systems requiring accurate fuel gauging, low power consumption, and robust battery protection capabilities. Typical applications include notebooks, handheld devices, industrial instruments, portable medical equipment, smart battery packs, and embedded rechargeable systems. Engineering Specification Device Type Battery Fuel Gauge and Battery Management IC Battery Chemistry Support Lithium-Ion and Lithium-Polymer Cell Configuration Supports multi-cell battery pack configurations Fuel Gauging Technology Impedance Track™ battery fuel gauging Integrated Functions Battery monitoring State-of-charge estimation State-of-health estimation Remaining runtime prediction Battery protection Cell balancing support Authentication support Temperature monitoring Data logging and diagnostics Protection Features Overvoltage protection Undervoltage protection Overcurrent protection Short-circuit protection Charge and discharge protection Thermal protection Communication Interface SMBus compatible I²C compatible interface Non-Volatile Memory Integrated flash memory for configuration and battery profile storage Measurement Functions Battery voltage measurement Current measurement Temperature sensing Capacity tracking Cycle count monitoring Operating Voltage Designed for rechargeable battery pack applications Power Consumption Low-power operation optimized for portable devices Package Type QFN package Mounting Type Surface-mount device Operating Temperature Range Industrial operating temperature range suitable for portable and embedded applications Typical Applications Smart battery packs Portable electronics Industrial handheld equipment Medical portable devices Rechargeable embedded systems Battery-powered instrumentation #commonpartslibrary #integratedcircuit #powermanagement

16 Position Receptacle Connector 0.100" (2.54mm) Through Hole, Right Angle Tin The SSQ-108-02-T-D-RA is a dual-row, right-angle female socket connector manufactured by Samtec. It is designed for board-to-board or wire-to-board interconnections in through-hole mounting applications. This connector features a 2.54 mm pitch with high-reliability contact systems, making it suitable for prototyping, embedded systems, and industrial electronics. The right-angle configuration enables horizontal mating, optimizing space in compact PCB layouts. Key Features Dual-row female socket strip Right-angle orientation for horizontal mating Standard 2.54 mm pitch spacing Through-hole mounting for secure PCB attachment High-reliability phosphor bronze contacts Gold-plated contact area for improved conductivity and corrosion resistance Black thermoplastic housing (UL94V-0 rated) Mechanical Specifications Number of Positions: 16 (2 × 8 configuration) Pitch: 2.54 mm Row Spacing: 2.54 mm Mounting Type: Through-hole Orientation: Right-angle Contact Type: Female socket Mating Post Length Compatibility: Standard 0.64 mm square posts Electrical Specifications Current Rating: Typically up to 3 A per contact Voltage Rating: Typically up to 500 VAC Contact Resistance: Low contact resistance for signal integrity Insulation Resistance: High insulation resistance Material Specifications Contact Material: Phosphor bronze Contact Plating: Gold over nickel Housing Material: Thermoplastic (UL94V-0 compliant) Environmental Specifications Operating Temperature Range: Suitable for industrial temperature ranges RoHS Compliant: Yes Lead-Free: Yes Applications PCB interconnect systems Embedded and control systems Prototyping and development boards Industrial and consumer electronics #commonpartslibrary #connector

17 Position FFC, FPC Connector Contacts, Bottom 0.020" (0.50mm) Surface Mount, Right Angle The F300-1B7H1-11017-E100 is a board-to-board / mezzanine connector designed for high-density interconnections in compact electronic assemblies. It is typically used in applications requiring reliable signal transmission between stacked PCBs, offering precise alignment, robust mechanical retention, and consistent electrical performance. This type of connector is commonly found in industrial electronics, embedded systems, communication devices, and compact consumer electronics where space-saving and high pin-count connectivity are critical. Key Features High-density board-to-board connection Compact form factor for space-constrained designs Reliable contact system for stable signal integrity Precision alignment for accurate mating Durable construction for repeated mating cycles Suitable for high-speed and low-power signal transmission Electrical Characteristics Rated Voltage: Typically 30–100 V (application dependent) Current Rating: Typically 0.3–1.0 A per contact Contact Resistance: Low (typically < 50 mΩ) Insulation Resistance: High (≥ 100 MΩ) Dielectric Withstanding Voltage: ~250–500 VAC Mechanical Characteristics Mounting Type: Surface Mount (SMT) Mating Type: Board-to-board / mezzanine Contact Configuration: High pin-count array Pitch: Typically fine pitch (e.g., 0.3 mm – 0.8 mm range) Mating Cycles: 30–100 cycles (typical) Housing Material: High-temperature thermoplastic Contact Material: Copper alloy with gold plating Environmental Characteristics Operating Temperature Range: -40°C to +85°C (typical) RoHS Compliant: Yes Moisture Sensitivity Level: Standard SMT classification Applications Embedded systems Industrial control electronics Communication devices Portable and compact consumer electronics PCB stacking architectures Packaging Supplied in tape and reel for automated SMT assembly Notes Exact electrical and mechanical values may vary depending on manufacturer specifications and variant configuration Recommended to verify mating connector compatibility and stack height before design implementation Follow manufacturer PCB footprint guidelines for optimal performance #commonpartslibrary #connector

332 kOhms ±0.1% 0.063W, 1/16W Chip Resistor 0603 (1608 Metric) Anti-Sulfur, Automotive AEC-Q200 Thin Film The RGT1608P-3323-B-T5 is a surface-mount thick film chip resistor designed for general-purpose electronic applications. It features a compact 0603 (1608 metric) package, offering stable electrical performance, high reliability, and suitability for automated assembly. This resistor is commonly used in signal conditioning, voltage division, and current limiting circuits across consumer and industrial electronics. Key Features Compact 0603 (1608 metric) SMD package Thick film resistor technology High reliability and stability Suitable for reflow soldering RoHS compliant and lead-free Electrical Characteristics Resistance Value: 332 kΩ Resistance Tolerance: ±0.1% (B) Temperature Coefficient: ±25 ppm/°C (typical for precision grade) Rated Power: 0.1 W (1/10 W) Maximum Working Voltage: 75 V Maximum Overload Voltage: 150 V Mechanical Characteristics Package Size: 0603 (1608 Metric) Length: 1.6 mm Width: 0.8 mm Height: ~0.45 mm Environmental Specifications Operating Temperature Range: -55°C to +155°C Moisture Sensitivity Level: MSL 1 Thermal Shock: Complies with standard IEC test methods Packaging Information Packaging Type: Tape and Reel (T5) Reel Quantity: Typically 5,000 pieces per reel Applications Precision analog circuits Voltage dividers Signal processing Industrial control systems Consumer electronics #CommonPartsLibrary #Resistor #CRCW0603

4.7 µH Unshielded Drum Core, Wirewound Inductor 62 A 0.95mOhm Max Vertical, 2 PC Pin The IHDM1008BCEV4R7M30 is a surface-mount power inductor designed for energy storage and filtering in switching power supplies and DC-DC converter circuits. It provides stable inductance characteristics under varying current conditions, making it suitable for applications requiring efficient power conversion and noise suppression. The device is constructed using a magnetically shielded structure to minimize electromagnetic interference and ensure reliable operation in densely populated circuit environments. Its design supports high current handling capability while maintaining low core losses, contributing to overall system efficiency. Functional Overview The inductor stores energy in its magnetic field when current flows through it and releases that energy when the current changes. This behavior is essential for smoothing current in switching regulators and maintaining stable voltage levels in power circuits. Its low resistance winding helps reduce power loss, while the magnetic shielding limits flux leakage, improving performance in sensitive electronic systems. The component is optimized for high-frequency operation typically found in modern power management designs. Electrical Characteristics The device provides a fixed inductance value with stable performance across a range of operating currents. It supports relatively high saturation current levels, allowing it to function effectively in power circuits without significant degradation of inductance. Low direct current resistance contributes to improved efficiency and reduced heat generation. The inductor is designed to maintain consistent electrical behavior across typical operating temperatures and frequencies used in switching applications. Interface Requirements The component features standard surface-mount terminals for direct placement onto printed circuit boards. Proper soldering and pad design are required to ensure mechanical stability and optimal electrical performance. Placement considerations should include minimizing loop area and proximity to switching elements to reduce noise and maximize efficiency. Operating Conditions The inductor is intended for operation across a wide temperature range suitable for consumer and industrial electronics. It is capable of maintaining performance under continuous load conditions and varying thermal environments. Adequate thermal management and airflow may be necessary in high-current applications to prevent excessive temperature rise. Protection and Reliability Features The device is constructed with durable materials to ensure long-term reliability under electrical and thermal stress. Its magnetically shielded design reduces susceptibility to external interference and limits emissions that could affect nearby components. It is designed to withstand standard handling and soldering processes associated with surface-mount assembly. Packaging and Integration The IHDM1008BCEV4R7M30 is provided in a compact surface-mount package optimized for automated assembly processes. Its form factor allows efficient use of board space while supporting high-performance power designs. The package design ensures secure mounting and consistent electrical contact in high-density circuit layouts. Applications Typical applications include DC-DC converters, voltage regulator modules, power management circuits, filtering stages, and energy storage elements in portable devices, industrial equipment, and communication systems. #commonpartslibrary #inductors

2A 150KHz 40V Buck DC to DC Converter The XL1509-5.0E1 is a fixed frequency PWM buck step-down DC-DC converter capable of driving a load with high efficiency, low ripple, and excellent line and load regulation. It is manufactured by XLSEMI and belongs to the XL1509 product family, a series of fixed-output and adjustable-output step-down switching regulator ICs designed to simplify the design of compact, efficient DC power conversion stages in a wide range of embedded, industrial, and consumer electronics applications. The "5.0" designation in the part number specifies that this variant produces a fixed regulated output voltage of five volts, making it directly suited to powering five-volt logic, microcontrollers, sensors, communication modules, and other standard digital subsystems from higher-voltage DC rails without requiring a linear regulator and its inherent power dissipation penalty. Unikeyic Electronics The XL1509 requires a minimum number of external components, making it simple to use, and includes internal frequency compensation and a fixed-frequency oscillator. The PWM control circuit is able to adjust the duty ratio linearly from zero to one hundred percent. This internal compensation architecture removes the burden of control loop design from the system engineer, which is a common point of complexity in discrete buck converter designs, and allows the device to be implemented with a straightforward application circuit consisting of an input capacitor, an output inductor, a freewheeling Schottky diode, and an output capacitor, without requiring additional feedback network components in the fixed-output version. Unikeyic Electronics The device operates across a wide input voltage range, accepting input rails ranging from just above the output voltage all the way up to the high end of the input range, making it compatible with a variety of common source voltages including twelve-volt, twenty-four-volt, and other industrial bus rails frequently encountered in embedded and industrial power system designs. This wide input range also makes it suitable for battery-powered applications where the supply voltage varies considerably across the battery discharge cycle, as the converter maintains a regulated output throughout the input voltage window. The fixed switching frequency is set internally at a value that represents a practical tradeoff between external component size and switching loss, allowing the use of standard commodity inductors and electrolytic or ceramic output capacitors without requiring unusually large or small values. An enable function and an overcurrent protection function are built inside. When a secondary current limit condition occurs, the operating frequency is reduced to a lower switching frequency, which limits the energy delivered per cycle and prevents damage to the power switch and external components during sustained overload events. This dual-level current protection approach provides both instantaneous peak current limiting and sustained overload protection, improving the robustness of designs built around the device in applications where load transients or fault conditions may cause temporary overcurrent conditions. Unikeyic Electronics The device is housed in a standard eight-pin small-outline integrated circuit surface-mount package, making it compatible with automated pick-and-place and reflow soldering assembly processes and suitable for compact power supply layouts on densely populated PCBs. Spec Sheet Identification Part Number: XL1509-5.0E1 Device Family: XL1509 Buck DC-DC Converter Series Manufacturer: XLSEMI Part Number Decode XL1509: Base device family 5.0: Fixed output voltage — five volts E1: Tape-and-reel packaging variant Functional Classification Device Type: Fixed-frequency PWM step-down buck DC-DC converter IC Topology: Non-synchronous buck converter with internal power switch Output Configuration: Single output, fixed voltage Regulation Method: Fixed-frequency PWM with internal compensation Electrical Characteristics Input Voltage Range: Wide input range, compatible with common industrial and consumer DC bus voltages Output Voltage: Fixed regulated output at five volts Output Current: Continuous rated current class suitable for moderate embedded system loads Switching Frequency: Fixed internal oscillator, mid-frequency class Duty Cycle Range: Adjustable from zero to maximum, internally controlled Minimum Dropout Voltage: Low dropout class Output Ripple: Low ripple characteristic with appropriate external filter components Control & Protection Features Enable Function: Built-in enable control input for power sequencing and shutdown Overcurrent Protection: Integrated primary current limit with frequency fold-back secondary protection Internal Compensation: Built-in frequency compensation, no external compensation network required Feedback: Internal reference for fixed output voltage regulation External Components Required Input Capacitor: Required for input decoupling Output Inductor: Required, standard commodity value Freewheeling Diode: External Schottky diode required Output Capacitor: Required for output filtering Environmental & Qualification Operating Temperature Range: Industrial range, below zero to elevated ambient RoHS Compliance: Yes, Halogen-Free Package Package Type: SOIC-8 (SOP-8) Mounting Method: Surface mount technology (SMT) Packaging Format Supply Format: Tape-and-reel Reel Quantity: Standard production reel quantity Available Variants in XL1509 Family XL1509-3.3E1: Fixed output at regulated lower voltage XL1509-5.0E1: Fixed output at five volts (this device) XL1509-12E1: Fixed output at twelve volts XL1509-ADJE1: Adjustable output version #XL1509 #XL15095 #XLSEMI #BuckConverter #StepDownConverter #DCDCConverter #PWMConverter #SwitchingRegulator #PowerManagement #EmbeddedPower #FixedOutputConverter #FiveVoltRegulator #IndustrialPower #SOIC8 #SurfaceMount #LowRipple #HighEfficiency #SemiconductorIC #EngineeringSpec #ComponentLibrary #CommonPartsLibrary #RoHSCompliant #PCBDesign

3.5x3.7×1.9 mm, 0.25 W intelligent externally controlled surface-mount device (SMD) type LED SK6812MINIRGBW-NW-P6 is a smart, addressable RGBW LED that integrates red, green, blue, and neutral white (NW) LEDs with a built-in control IC in a compact SMD package. Each LED acts as an individually addressable pixel, allowing precise color and brightness control through a single-wire digital interface. It is commonly used in RGBW lighting effects, backlighting, gaming peripherals, custom keyboards, LED displays, wearables, and decorative lighting applications. Key Features Individually addressable RGB + Neutral White (RGBW) LED Built-in intelligent control IC and constant-current driver Single-wire serial communication interface 32-bit color data (RGBW control) Cascadable design for long LED chains Integrated signal reshaping for reliable data transmission Operating voltage: 3.5V to 5.5V Typical data transmission rate: 800 kbps 256-level grayscale PWM dimming per channel Compact 3.7 mm × 3.5 mm SMD-6 package Built-in power-on reset circuit Wide operating temperature range: -40°C to +85°C Suitable for animations, indicators, displays, and smart lighting applications. #SK6812MINIRGBW #SK6812 #RGBWLED #AddressableLED #SmartLED #NeutralWhiteLED #DigitalLED #PixelLED #LEDLighting #EmbeddedSystems #PCBDesign #IoT #Electronics #LEDDisplay #LightingControl

Connector Header Through Hole 10 position 0.224" (5.70mm) 172065-0010 is a Mega-Fit® vertical PCB header from Molex, designed for high-current wire-to-board power connections. It features a dual-row, 10-circuit, through-hole configuration with a 5.70 mm pitch, making it suitable for industrial equipment, power supplies, automotive electronics, and other applications requiring reliable, high-density power distribution. The connector incorporates a polarized, shrouded housing and locking mechanism to ensure secure mating and prevent incorrect insertion. Key Features 10-position (2×5) vertical PCB header 5.70 mm pitch Mega-Fit® connector system Through-hole mounting for strong mechanical retention Supports up to 23 A per circuit Rated up to 600 VAC/DC 0.38 µm (15 µin) gold-plated mating contacts Tin-plated PCB termination Shrouded and polarized design with positive locking Operating temperature: -40°C to +120°C UL 94 V-0 rated housing material Compatible with Molex Mega-Fit receptacle housings for wire-to-board power applications. #CommonPartsLibrary #Molex #MegaFit #PowerConnector #PCBHeader #WireToBoard #ThroughHole #HighCurrent #IndustrialElectronics #PowerDistribution #Connector

Automotive High-Side Load Switch IC – Single-channel high-side load switch optimized for automotive power distribution, ADAS, infotainment, body electronics, industrial control, and embedded power management. Operates from a 1.5 V to 5.5 V control supply and switches 0.8 V to 5.5 V load voltages, delivering up to 3 A continuous output current with an ultra-low 19 mΩ (typical) ON resistance for minimal power loss. Features controlled slew-rate switching to reduce inrush current, integrated quick output discharge (QOD), fixed current limiting, thermal shutdown, reverse current blocking (when disabled), and low quiescent current for efficient operation. Qualified to AEC-Q100 Grade 1, it operates over a −40°C to +125°C ambient temperature range and is housed in a compact 6-pin SOT-23 Thin (TSOT-23-6) package. #TexasInstruments #TPS22995HQDDCRQ1 #TPS22995 #LoadSwitch #HighSideSwitch #PowerDistribution #PowerManagement #CurrentLimiting #AutomotiveElectronics #AECQ100 #SOT236 #EmbeddedSystems

8 Position Card Connector Micro SIM Surface Mount, Right Angle Gold ## Engineering Specification ## General Description The **693022010811** is a Würth Elektronik **WR-CRD Micro SIM card connector** designed for compact electronic devices requiring secure SIM card retention and reliable board-level electrical connection. It is intended for surface-mount printed circuit board assembly and is suitable for communication modules, wireless devices, embedded systems, IoT hardware, and networking equipment. The connector uses a hinged lid mechanism to hold the Micro SIM card in place during operation. ## Device Identification Manufacturer Part Number: **693022010811** Manufacturer: **Würth Elektronik** Product Series: **WR-CRD** Device Category: **Connector and Interconnect Component** Device Type: **Micro SIM Card Connector** Connector Style: **Hinge Type** Mounting Type: **Surface Mount, Right Angle** ## Functional Description The device functions as a board-mounted Micro SIM card interface. It provides mechanical retention and electrical contact between the SIM card and the host printed circuit board. The hinged lid design allows the SIM card to be placed into the connector and secured during operation, helping maintain contact stability in compact electronic assemblies. ## Mechanical Description The connector is designed with a low-profile surface-mount construction suitable for space-constrained PCB layouts. It uses a hinged card-retention mechanism and is intended for horizontal or right-angle card installation. The mechanical structure supports reliable insertion, retention, and removal of the Micro SIM card during normal use. ## Electrical Description The connector is intended for signal-level SIM card interface applications. It provides multiple gold-plated contact positions for stable electrical connection between the SIM card and the host circuit. The device should be used within the manufacturer’s specified voltage, current, contact resistance, and insulation limits. ## Material and Contact Description The connector uses copper alloy contacts with gold plating for reliable signal transfer and corrosion resistance. The housing and mechanical retention structure are designed for surface-mount assembly and repeated card handling within the rated operating conditions. ## Mounting and Assembly Description The component is suitable for automated surface-mount PCB assembly. Proper land pattern design, soldering profile control, and mechanical clearance should be followed according to the manufacturer’s recommended layout and assembly guidance. The PCB design should provide stable grounding, correct pad alignment, and adequate clearance for SIM card insertion and lid operation. ## Application Suitability The **693022010811** is suitable for cellular communication devices, IoT modules, wireless routers, embedded modems, tracking systems, smart meters, industrial communication equipment, portable electronics, and other products requiring a Micro SIM card interface. ## Design Considerations The connector should be placed in an accessible area of the PCB to allow SIM card installation and removal. Designers should avoid excessive mechanical stress on the hinged lid, improper solder joint loading, contamination of the contact area, and operation beyond the specified environmental and electrical ratings. ## Hashtags #commonpartslibrary #connector #simconnector #microsimconnector #wurthelektronik #wrcrd #cardconnector #memoryconnector #interconnect #pcbconnector #surfacemount #rightangleconnector #smtcomponent #goldplatedcontacts #embeddedhardware #iotdevices #wirelessmodules #communicationdevices #networkingequipment #pcbdesign #hardwaredesign #electronicscomponents #electronicparts #componentlibrary #engineeringparts #electronicsengineering

7.2 µH Shielded Drum Core, Wirewound Inductor 7.9 A 12.8mOhm Max Nonstandard # 7447798720 ## General Description The 7447798720 is a high-performance power inductor manufactured by Würth Elektronik as part of the WE-MAPI series. It is designed for energy storage, filtering, and power conversion applications in modern switching power supplies and DC-DC converter circuits. The component features a magnetically shielded construction that minimizes electromagnetic interference while maintaining excellent current handling capability and low power losses. Its compact surface-mount design and robust mechanical structure make it suitable for industrial automation equipment, telecommunications systems, embedded electronics, automotive-support applications, consumer devices, and high-efficiency power management systems. The inductor is optimized for use in applications requiring stable inductance, low DC resistance, and reliable performance under varying load conditions. ## Key Features ### Magnetic Characteristics * Magnetically shielded construction * Stable inductance performance * High-current handling capability * Low magnetic flux leakage * Optimized energy storage capability * Suitable for high-frequency switching applications ### Electrical Characteristics * Low DC resistance * High efficiency operation * Low core losses * Stable electrical performance * Excellent current saturation behavior * Reliable operation in power conversion circuits ### Mechanical Characteristics * Surface-mount package * Compact footprint * Robust mechanical construction * Automated assembly compatible * High-density PCB design support ### Material Construction * Metal alloy core technology * Shielded magnetic structure * High-temperature materials * RoHS-compliant construction * Lead-free compatible design ### Thermal Characteristics * Efficient heat dissipation * Stable operation under continuous load * Suitable for demanding power applications * Reliable performance across industrial operating conditions ### Environmental Characteristics * Industrial-grade reliability * Long operational service life * Resistance to mechanical stress * Suitable for harsh electronic operating environments ### Application Areas * DC-DC Converters * Switching Power Supplies * Point-of-Load Regulators * Industrial Automation Equipment * Telecommunications Systems * Embedded Electronics * Power Distribution Modules * Consumer Electronics * Energy Management Systems * Battery-Powered Devices * Motor Control Systems * Power Filtering Applications ### Compliance * RoHS Compliant * Lead-Free Compatible * Industrial-Grade Power Inductor Solution ## Manufacturer Würth Elektronik ## Product Family WE-MAPI Molded Power Inductor Series #7447798720 #WurthElektronik #WEMAPI #PowerInductor #ShieldedInductor #SMDInductor #PowerElectronics #DCDCConverter #SwitchingPowerSupply #EmbeddedSystems #IndustrialElectronics #PowerManagement #PCBDesign #ElectronicsEngineering #EnergyStorage

10 µH Shielded Molded Inductor 3.9A 69.5mOhm Max 1616 (4040 Metric) The XGL4030-103MEC is a shielded surface-mount power inductor from the XGL4030 series by Coilcraft. It uses a molded composite core construction designed for high-current DC/DC converters, power management circuits, automotive electronics, and industrial applications. The component offers ultra-low DC resistance (DCR), low AC losses, and soft saturation characteristics for improved efficiency and thermal performance in compact designs. Key Features 10 µH inductance with ±20% tolerance Shielded molded inductor construction Low DCR: 69.5 mΩ max High current capability: 3.1 A saturation current 3.9 A RMS current Composite metal core for low core losses Compact 4.0 mm × 4.0 mm SMD package Wide operating temperature range: –40°C to +165°C AEC-Q200 qualified for automotive applications RoHS compliant and halogen-free Optimized for switching regulators and power conversion systems #CommonPartsLibrary #Inductor #XGL4030

Charger IC Lithium Ion/Polymer 16-WQFN (3x3) The BQ25302RTER is a highly integrated single-cell lithium-ion and lithium-polymer battery charger and power-path management IC developed by Texas Instruments. The device is optimized for compact portable and wearable applications requiring efficient battery charging from USB or low-voltage DC power sources. It integrates a switching charger, power-path management, system voltage regulation, battery FET, and protection features into a compact package suitable for space-constrained designs. The device supports programmable charging current and voltage regulation while maintaining high power conversion efficiency through its switching charger architecture. Integrated power-path management allows the system load to operate simultaneously while charging the battery, improving system reliability and startup behavior when the battery is deeply discharged or absent. The BQ25302RTER includes input current limiting, thermal regulation, battery temperature monitoring support, and multiple safety timers to ensure safe charging operation. The charger automatically manages preconditioning, fast charging, charge termination, and recharge cycles for lithium-based battery chemistries. The device also supports USB-compliant input operation and includes configurable features through an I2C-compatible interface. Its compact WQFN package and high integration level reduce external component count and PCB area, making it suitable for wearable electronics, portable medical devices, IoT products, handheld instruments, wireless accessories, and battery-powered embedded systems. Electrical Characteristics Input operating voltage supports standard USB and low-voltage DC input sources suitable for portable electronics applications. Supports single-cell lithium-ion and lithium-polymer battery charging with programmable charge voltage regulation. Integrated high-efficiency switching charger architecture minimizes power dissipation and improves thermal performance compared to linear chargers. Programmable fast-charge current supports flexible battery capacity scaling and application-specific charging requirements. Integrated power-path management allows simultaneous battery charging and system power delivery. Includes programmable input current limiting to support USB current compliance and adapter protection. Automatic charge cycle management includes precharge, fast charge, termination, and recharge operation. Supports battery temperature qualification using external thermistor monitoring. Integrated thermal regulation dynamically reduces charge current during high-temperature operating conditions. Low quiescent current operation improves standby battery life in portable products. Protection Features Integrated overvoltage protection for input power safety. Battery overcurrent and short-circuit protection enhance system reliability. Thermal shutdown circuitry protects the device during excessive junction temperature conditions. Safety timers monitor charging duration and prevent abnormal charging operation. Input current limiting protects USB ports and weak power adapters from overload conditions. Undervoltage lockout prevents improper operation during insufficient input supply conditions. Interface and Control I2C-compatible serial interface enables configuration and monitoring of charger parameters. Status reporting supports system-level battery and charging management. Programmable charging parameters allow firmware-controlled optimization for different battery chemistries and capacities. Interrupt and status functions support embedded power management architectures. Package Information Supplied in a compact WQFN package optimized for portable and space-constrained PCB layouts. Package design supports efficient thermal dissipation and automated surface-mount assembly processes. RoHS-compliant and suitable for modern lead-free manufacturing requirements. Typical Applications Wearable electronics Wireless earbuds and audio accessories Portable medical devices IoT and embedded battery-powered systems Handheld consumer electronics Portable instrumentation Rechargeable sensor modules Compact USB-powered battery charging systems #CommonPartsLibrary #IntegratedCircuit #PowerManagement #battery charger

50 Position Connector Receptacle, Center Strip Contacts Surface Mount Gold The DF40HC series connector is a high-density, low-profile board-to-board interconnect solution designed for compact electronic assemblies requiring reliable signal integrity and mechanical robustness. This connector is intended for parallel board stacking applications where space constraints demand minimal height and fine contact pitch. It provides secure mating with precise alignment features and is optimized for high-speed signal transmission in advanced electronic systems such as portable devices, embedded modules, and industrial electronics. Mechanical Characteristics The connector features a slim, rectangular form factor suitable for high-density PCB layouts. It incorporates a fine-pitch contact arrangement to maximize signal routing efficiency within a limited footprint. The housing is constructed from high-temperature thermoplastic material to support standard reflow soldering processes. Contacts are designed to ensure consistent normal force, enabling stable electrical connection under vibration and mechanical stress. The mating interface includes polarization features to prevent incorrect insertion and to guide proper alignment during assembly. Electrical Characteristics The connector is engineered to support reliable signal transmission across multiple contact points with low contact resistance and stable impedance characteristics. It is suitable for both signal and low-power applications. Contact plating is optimized to maintain conductivity and minimize wear over repeated mating cycles. The design supports high-speed data transfer by reducing crosstalk and maintaining signal integrity across adjacent contacts. Environmental Characteristics The component is designed to operate within standard industrial temperature ranges and is compatible with lead-free reflow soldering processes. Materials used in construction comply with common environmental and regulatory standards for electronic components. The connector maintains performance under typical environmental stresses such as humidity, temperature variation, and mechanical vibration. Materials and Finishes The insulating housing is manufactured from a high-performance thermoplastic with appropriate flammability rating. Contacts are formed from copper alloy and plated with a noble metal finish over a suitable underlayer to ensure durability, corrosion resistance, and consistent electrical performance. Application Notes This connector is intended for use in applications requiring compact stacking of printed circuit boards with reliable electrical interconnection. Proper PCB layout, including pad design and solder mask considerations, is essential to ensure optimal performance. Care should be taken during handling and assembly to avoid damage to fine-pitch contacts. Designers should follow recommended land patterns and assembly guidelines provided by the manufacturer to achieve consistent solder joints and mechanical stability. #commonpartslibrary #connector #receptacle #surfacemount

10 µH Shielded Molded Inductor 15.5 A 14.75mOhm Max Nonstandard The XAL1010-103MED specification defines the engineering requirements for a shielded power inductor designed for high-efficiency energy storage and power conversion applications. This specification establishes the functional, electrical, mechanical, thermal, environmental, and quality requirements necessary to ensure stable inductance characteristics, efficient current handling, and long-term operational reliability in power electronic systems. The component is intended for use in DC-DC converters, voltage regulators, power management circuits, industrial control equipment, automotive electronics, and embedded systems requiring compact, high-current inductive components. The magnetically shielded construction minimizes electromagnetic interference while supporting efficient energy transfer and stable performance in high-frequency switching applications. Engineering Requirements The power inductor shall be manufactured using high-quality magnetic core materials and precision-wound conductors to ensure consistent inductance, low core losses, and reliable current-carrying capability. The construction shall maintain stable electrical performance under specified operating voltage, current, frequency, and temperature conditions. Electrical characteristics shall provide accurate inductance values, low direct current resistance, high saturation current capability, and low electromagnetic emissions. The component shall maintain stable performance during continuous operation, transient loading, and thermal cycling without significant degradation of inductance or efficiency. Thermal performance shall support effective heat dissipation and continuous operation within the specified temperature range while maintaining structural integrity and electrical characteristics. The shielded construction shall minimize magnetic field leakage and improve electromagnetic compatibility within densely populated electronic assemblies. Mechanical construction shall be suitable for surface-mount assembly and compatible with automated manufacturing processes. The component shall withstand solder reflow, vibration, mechanical shock, and handling without deformation or degradation of electrical performance. Workmanship shall be free from defects including cracks, contamination, core damage, winding irregularities, or structural inconsistencies. Inspection, validation, and testing shall be conducted using calibrated equipment and controlled quality procedures to verify compliance with all applicable engineering and manufacturing requirements. Any deviation from this specification shall require formal engineering evaluation, documented technical justification, and approval through the established engineering change control process. Documentation Supporting documentation shall include engineering drawings, electrical specifications, magnetic characterization data, thermal performance reports, qualification records, inspection reports, material declarations, and revision-controlled manufacturing documentation. All documentation shall be maintained under formal configuration management and quality assurance systems to ensure complete product traceability. Revision Control Any modification to this specification shall be managed through the formal engineering change management process. All revisions shall undergo technical review, validation, and approval before implementation to ensure continued compliance with design intent and applicable engineering standards. #EngineeringSpecification #PowerInductor #ShieldedInductor #PowerElectronics #DCDCConverter #PowerManagement #Magnetics #IndustrialElectronics #QualityAssurance #EngineeringDocumentation #CommonPartsLibrary #Inductor #XAL1010

9.1A 4.7uH ±20% 15.15A 19.9mΩ SMD,11.5x10mm Fixed Inductors The AAPS1040M4R7A belongs to the AAPS series of molded power inductors, designed for high-current DC-DC converters and power management applications. It features a magnetically shielded construction, helping reduce electromagnetic interference (EMI) while maintaining stable inductance. Key Characteristics Component Type: Fixed power inductor Inductance: 4.7 µH Tolerance: typically ±20% Construction: Molded / shielded (low EMI noise) Mounting Type: Surface-mount (SMD) Package Size: approx. 10 × 10 mm footprint (1040 size) DC Resistance (DCR): ~19.9 mΩ (max) Rated Current (Irms): ~9.1 A Saturation Current (Isat): ~15.15A Function This inductor is used to: Store energy in magnetic form Smooth current in switching regulators Filter noise in power circuits Stabilize voltage in DC-DC converters Commonly found in: Buck / boost converters Power supplies Battery-powered systems Embedded electronics #commonpartslibrary #inductor #coil

Isolated Module DC DC Converter 2 Output 15V -15V 170mA, 170mA 4.5V - 9V Input The REC5-0515DRW/H6/C/SMD-R specification defines the engineering requirements for an isolated DC-DC converter module designed for regulated power conversion in compact electronic systems. This specification establishes the functional, electrical, mechanical, environmental, and quality requirements necessary to ensure stable voltage conversion, reliable isolation, and long-term operational performance. The device is intended for use in embedded systems, industrial control equipment, communication modules, and distributed power architectures where isolated power rails are required. It provides regulated output power from a DC input source while maintaining galvanic isolation between input and output stages to enhance system safety and signal integrity. Engineering Requirements The power module shall be manufactured using controlled electronic assembly processes and high-reliability components to ensure stable conversion efficiency and consistent output regulation. The internal architecture shall support isolated power transfer with stable performance under defined load and environmental conditions. Electrical characteristics shall ensure stable output regulation, low output ripple, and reliable transient response during load variation. The device shall maintain consistent performance across its intended operating temperature range and input voltage variation conditions. Isolation performance shall ensure electrical separation between input and output circuits to protect downstream electronics and maintain system safety requirements. The module shall withstand electrical stress conditions defined by applicable safety and reliability standards. Thermal performance shall support continuous operation without degradation of output regulation or reliability under rated operating conditions. The device shall be suitable for PCB mounting and shall maintain structural integrity during soldering and long-term operation. Workmanship shall be free from defects such as contamination, cracks, soldering defects, or structural irregularities that could affect electrical performance or mechanical reliability. Manufacturing and inspection shall be performed using controlled processes and calibrated equipment. Any deviation from this specification shall require formal engineering review, documented justification, and approval through established engineering change control procedures. Documentation Supporting documentation shall include datasheets, electrical performance reports, isolation certification data, qualification test records, inspection reports, and revision-controlled manufacturing documentation. All documentation shall be maintained under formal configuration management and quality assurance systems. Revision Control All changes to this specification shall be managed through the formal engineering change control system. Each revision shall undergo technical validation and approval prior to release to ensure continued compliance with design intent and applicable standards. #EngineeringSpecification #DCDCConverter #PowerModule #IsolatedPower #PowerElectronics #EmbeddedSystems #IndustrialElectronics #PowerSupply #QualityAssurance #EngineeringDocumentation

LED Lighting Driver ICs LED Lighting Drivers 4-Channel RGBW Driver, I2C, 1.5x1.5mm TDFN The KTD2027BEWE-TR is a highly integrated, low-power RGB LED driver designed for portable and battery-powered applications. It features a compact WLCSP package and provides precise current control for up to three LED channels. The device includes an I²C-compatible interface, enabling flexible control of brightness, color mixing, and lighting effects. Integrated features such as programmable current sinks, dimming control, and built-in protection mechanisms make it suitable for indicators, backlighting, and decorative lighting in consumer electronics. Key Features Triple-channel constant current LED driver (RGB support) I²C-compatible digital interface Independent brightness control per channel Programmable current up to ~24 mA per channel Built-in PWM dimming and pattern generation Low quiescent current for power-sensitive applications Wide input voltage range Thermal shutdown and overcurrent protection Small WLCSP package (suitable for compact designs) Applications Mobile devices and wearables Status indicators and notification LEDs Backlighting and decorative lighting IoT and portable electronics Absolute Maximum Ratings Supply Voltage (VDD): −0.3 V to +6.0 V Logic Input Voltage: −0.3 V to VDD + 0.3 V Operating Temperature Range: −40°C to +85°C Storage Temperature Range: −55°C to +150°C Recommended Operating Conditions Supply Voltage (VDD): 1.8 V to 5.5 V LED Forward Voltage: Dependent on external LEDs Ambient Temperature: −40°C to +85°C Electrical Characteristics (Typical) Supply Current (Idle): < 1 µA (shutdown mode) Channel Current Accuracy: ±5% (typical) Maximum Output Current: ~24 mA per channel I²C Clock Frequency: Up to 400 kHz (Fast Mode) Functional Description The KTD2027BEWE-TR operates as a constant-current sink driver for RGB LEDs. Each channel can be independently programmed via the I²C interface to control brightness and enable dynamic lighting effects. Internal PWM generators allow smooth dimming without requiring continuous microcontroller intervention. The device also integrates protection features such as thermal shutdown and current limiting to ensure reliable operation. Pin Configuration (Typical WLCSP) VDD – Power supply GND – Ground SDA – I²C data line SCL – I²C clock line LED1 – Current sink output (Red) LED2 – Current sink output (Green) LED3 – Current sink output (Blue) Package Information Package Type: WLCSP (Wafer-Level Chip Scale Package) Mounting: Surface mount Tape & Reel: Yes (TR suffix) Ordering Information KTD2027BEWE-TR: Tape and reel packaging for automated assembly #commonpartslibrary #integratedcircuit #leddriver

10 µH Unshielded Wirewound Inductor 1.13 A 340mOhm Max 1210 (3225 Metric) PCA1V3230-100-R is a precision electronic component intended for use in signal conditioning and control applications. It is designed to provide stable performance under varying environmental and electrical conditions, making it suitable for integration into industrial, commercial, and instrumentation systems. The component emphasizes reliability, consistency, and compatibility with standard circuit architectures, supporting both analog and mixed-signal designs. Functional Overview The component operates as a passive electrical element that contributes to circuit tuning, filtering, or impedance control depending on application context. It is engineered to maintain consistent electrical characteristics across its operating range, ensuring predictable system behavior. Its construction supports low noise contribution and stable response over time. Electrical Characteristics The device is manufactured to meet tight tolerance requirements and exhibits stable electrical behavior under normal operating conditions. It supports typical voltage and current levels associated with low-power electronic circuits and is suitable for precision applications where signal integrity is critical. Performance is maintained across a defined temperature range with minimal drift. Mechanical Characteristics The component is housed in a compact form factor compatible with standard mounting techniques used in modern electronic assemblies. Its physical structure is optimized for durability and ease of handling during automated and manual assembly processes. Materials used in construction are selected for thermal stability and resistance to environmental stress. Environmental and Reliability Considerations The device is designed to operate reliably under typical environmental conditions encountered in electronic equipment. It demonstrates resistance to temperature variation, humidity, and mechanical stress within specified limits. Long-term stability and performance consistency are key design attributes, supporting extended service life. Applications Typical applications include signal filtering, voltage division, timing circuits, and general-purpose electronic design where precision and stability are required. It is suitable for use in consumer electronics, industrial control systems, communication devices, and instrumentation equipment. Compliance and Standards The component is manufactured in accordance with relevant industry standards for quality and environmental compliance. It is suitable for use in systems requiring adherence to common regulatory and safety guidelines. #commonpartslibrary #inductor #fixed