MAX98357A Series 5.5V 3.2W PCM Input Class D Audio Power Amplifier - TQFN-16 The MAX98357A/MAX98357B is an easy-to-use, low-cost, digital pulse-code modulation (PCM) input Class D amplifier that provides industry-leading Class AB audio performance with Class D efficiency. The digital audio interface automatically recognizes up to 35 different PCM and TDM clocking schemes which eliminates the need for I2C programming. Operation is further simplified by eliminating the need for an external MCLK signal that is typically used for PCM communication. Simply supply power, LRCLK, BCLK, and digital audio to generate audio! Furthermore, a novel pinout allows customers to use the cost-effective WLP package with no need for expensive vias (refer to Application Note 6643: Optimize Cost, Size, and Performance with MAX98357 WLP for more information). The digital audio interface is highly flexible with the MAX98357A supporting I2S data and the MAX98357B supporting left-justified data. Both ICs support 8 channel time division multiplexed (TDM) data. The digital audio interface accepts specified sample rates between 8kHz and 96kHz for all supported data formats. The ICs can be configured to produce a left channel, right channel, or (left/2 + right/2) output from the stereo input data. The ICs operate using 16/24/32-bit data for I2S and left-justified modes as well as 16-bit or 32-bit data using TDM mode. The ICs eliminate the need for the external MCLK signal that is typically used for PCM communication. This reduces EMI and possible board coupling issues in addition to reducing the size and pin count of the ICs. The ICs also feature a very high wideband jitter tolerance (12ns typ) on BCLK and LRCLK to provide robust operation. Active emissions-limiting, edge-rate limiting, and overshoot control circuitry greatly reduce EMI. A filterless spread-spectrum modulation scheme eliminates the need for output filtering found in traditional Class D devices and reduces the component count of the solution. The ICs are available in 9-pin WLP (1.345mm x 1.435mm x 0.64mm) and 16-pin TQFN (3mm x 3mm x 0.75mm) packages and are specified over the -40°C to +85°C temperature range. ● Single-Supply Operation (2.5V to 5.5V) ● 3.2W Output Power into 4Ω at 5V ● 2.4mA Quiescent Current ● 92% Efficiency (RL = 8Ω, POUT = 1W) ● 22.8μVRMS Output Noise (AV = 15dB) ● Low 0.013% THD+N at 1kHz ● No MCLK Required ● Sample Rates of 8kHz to 96kHz ● Supports Left, Right, or (Left/2 + Right/2) Output ● Sophisticated Edge Rate Control Enables Filterless Class D Outputs ● 77dB PSRR at 1kHz ● Low RF Susceptibility Rejects TDMA Noise from GSM Radios ● Extensive Click-and-Pop Reduction Circuitry ● Robust Short-Circuit and Thermal Protection ● Available in Space-Saving Packages: 1.345mm x 1.435mm WLP (0.4mm Pitch) and 3mm x 3mm TQFN ● Solution Size with Single Bypass Capacitor is 4.32mm2 Applications ● Single Li-ion Cell/5V Devices ● Smart Speakers ● Notebook Computers ● IoT Devices ● Gaming Devices (Audio and Haptics) ● Smartphones ● Tablets ● Cameras #commonpartslibrary #integratedcircuit #linearamplifier #mono

Connector Header Through Hole 18 position 0.100" (2.54mm) # TSW-118-07-G-S ## General Description The TSW-118-07-G-S is a through-hole board-to-board and wire-to-board interconnect header manufactured by Samtec. It belongs to the TSW series of standard terminal strip headers designed for reliable signal transmission in electronic assemblies, embedded systems, industrial controls, telecommunications equipment, instrumentation, and general-purpose printed circuit board applications. The component features precision-machined contacts, robust mechanical construction, and compatibility with a wide range of mating connectors. Its design supports secure electrical connections while maintaining excellent durability during repeated mating cycles and long-term operation in demanding environments. ## Key Features ### Mechanical Characteristics * Through-hole mounting configuration * Single-row terminal strip header design * Straight vertical orientation * Precision-machined contact system * High-reliability board-level interconnection ### Contact System * Gold-plated contact surface * Enhanced conductivity and signal integrity * Corrosion-resistant contact finish * Suitable for repeated insertion and removal cycles ### Electrical Characteristics * Low contact resistance * Reliable signal transmission * Suitable for low-power and signal-level applications * Stable electrical performance across operating conditions ### Material Construction * High-temperature thermoplastic insulator * Durable metallic contact structure * RoHS-compliant materials * Lead-free manufacturing compatibility ### Environmental Characteristics * Industrial-grade operating capability * Resistant to mechanical wear during mating cycles * Suitable for automated and manual assembly processes ### Application Areas * Embedded Systems * Microcontroller Development Boards * Industrial Automation Equipment * Telecommunications Hardware * Test and Measurement Instruments * Medical Electronics * Data Acquisition Systems * Prototyping Platforms * Consumer Electronic Devices * PCB Interconnection Applications ### Compliance * RoHS Compliant * Lead-Free Compatible * Industry-standard connector footprint ## Manufacturer Samtec Inc. ## Product Family TSW Series Terminal Strip Headers #Samtec #TSW11807GS #TerminalStripHeader #PCBConnector #BoardToBoardConnector #WireToBoardConnector #ElectronicsComponents #EmbeddedSystems #IndustrialElectronics #InterconnectSolutions #ThroughHoleConnector #ElectronicDesign #HardwareEngineering #PCBAssembly #CommonPartsLibrary #Connector #Header #TSW pin header 1x18 2.54mm

This single-channel 5V relay expansion board, designed for seamless integration with the Seeed Studio XIAO series, brings robust performance and versatility to your projects. Featuring the HF32FA-G relay, it delivers reliable switching capabilities for a variety of applications, from IoT solutions to home automation systems.

USB-C (USB TYPE-C) Receptacle Connector 24 Position Panel Mount, Through Hole, Right Angle The MUSBRM1C1M0 is a ruggedized USB Type-C receptacle connector designed for high-reliability data and power connectivity in industrial, embedded, transportation, and harsh-environment applications. The connector features a reversible USB Type-C interface that supports modern high-speed communication protocols while providing robust mechanical durability and secure board-level attachment. Its reinforced construction helps withstand vibration, shock, and repeated mating cycles, making it suitable for demanding applications where reliability and long service life are critical. The device is commonly used in industrial controllers, communication equipment, medical devices, consumer electronics, and next-generation embedded systems requiring compact and versatile connectivity. Engineering Specifications Manufacturer: Amphenol Communications Solutions Part Number: MUSBRM1C1M0 Connector Type: USB Type-C Receptacle Interface Standard: Universal Serial Bus Type-C Connector Gender: Receptacle Mounting Style: Surface Mount Orientation: Right Angle Contact Configuration: USB Type-C Multi-Function Interface Data Support: High-Speed Data Transmission Power Delivery Support: Compatible with USB Power Delivery Architectures Shielding: Integrated EMI Shielding Contact Material: Copper Alloy Contact Finish: Gold-Plated Contact Interface Housing Material: High-Strength Metal Shield Construction Durability: High Mating Cycle Life Environmental Performance: Designed for Industrial Applications Operating Temperature Range: Industrial Grade RoHS Compliant: Yes Applications: Embedded Systems, Industrial Automation, Consumer Electronics, Communication Equipment, Medical Devices, IoT Products, Portable Electronics, Data Acquisition Systems Key Features Reversible USB Type-C connection interface Ruggedized mechanical construction High-speed data communication capability Secure PCB mounting design Enhanced resistance to vibration and mechanical stress Integrated shielding for improved electromagnetic compatibility Compact footprint for space-constrained designs Supports modern USB power and data architectures Long operational lifespan with high insertion cycle durability Suitable for industrial and commercial electronic systems #MUSBRM1C1M0 #Amphenol #USBTypeC #USBConnector #TypeCReceptacle #HighSpeedConnectivity #PowerDelivery #IndustrialElectronics #EmbeddedSystems #CommunicationEquipment #IoTDevices #ConsumerElectronics #PCBDesign #ElectronicComponents #SurfaceMount #DataTransmission #USBPD #IndustrialAutomation #MedicalElectronics #ConnectorTechnology

15 µH Shielded Drum Core, Wirewound Inductor 3.5 A 92mOhm Max Nonstandard The SRP7050TA-150M is a high-performance photovoltaic module designed for utility-scale and large commercial solar power applications. The module utilizes advanced monocrystalline cell technology to deliver high energy conversion efficiency, reliable power generation, and long-term operational stability under varying environmental conditions. Its robust mechanical construction and optimized electrical characteristics provide dependable performance in demanding outdoor installations, including regions exposed to high wind loads, elevated temperatures, and extended solar irradiance. The module is engineered to support high system voltage configurations while maintaining low degradation rates and enhanced energy yield over its service life. The design incorporates reinforced framing, tempered high-transmission glass, and weather-resistant encapsulation materials to ensure durability against moisture ingress, ultraviolet exposure, and mechanical stress. The product is suitable for fixed-tilt and tracker-based mounting systems and is compatible with standard industry installation practices. Electrical performance is optimized for maximum power output with improved temperature behavior and reduced resistive losses. The module supports efficient integration into modern photovoltaic systems requiring high-density energy production and reliable long-term operation. Safety and quality compliance are aligned with internationally recognized photovoltaic module standards for performance, durability, and environmental resilience. The SRP7050TA-150M is intended for grid-connected solar energy systems where high efficiency, operational reliability, and reduced balance-of-system costs are critical project requirements. #commonpartslibrary #inductor

Touchscreen Controller 2 Wire Capacitive I2C Interface 20-VQFN (3x3) The MTCH2120-V/REB specification defines the engineering requirements for a capacitive touch sensing controller integrated circuit designed for human-machine interface applications in embedded electronic systems. This specification establishes the functional, electrical, mechanical, environmental, and quality requirements necessary to ensure accurate touch detection, stable system performance, and reliable operation across consumer, industrial, and embedded environments. The device is intended for use in applications requiring touch-based user input such as control panels, interface buttons, and capacitive sensing surfaces. It provides robust sensing performance with immunity to noise and environmental variation, enabling reliable detection of touch events in compact and low-power electronic designs. Engineering Requirements The integrated circuit shall be manufactured using qualified semiconductor fabrication processes to ensure consistent sensing performance, low power consumption, and long-term operational stability. The device shall support reliable capacitive touch detection under defined electrical and environmental conditions without degradation of sensitivity or accuracy. The sensing architecture shall provide stable touch event detection with immunity to electrical noise, environmental interference, and parasitic capacitance variations. The system shall maintain consistent performance across intended operating conditions including temperature variation and supply voltage fluctuation. Electrical characteristics shall ensure stable digital communication, accurate sensing response, and reliable operation during startup, normal operation, and power transitions. The device shall maintain functional integrity during dynamic system conditions without false triggering or loss of sensitivity. Mechanical and package construction shall be suitable for surface-mount assembly and shall ensure robustness during soldering, handling, and long-term operation. Workmanship shall be free from defects such as contamination, cracks, bonding issues, or structural inconsistencies that could impact electrical or mechanical reliability. Inspection, validation, and testing shall be performed using controlled procedures and calibrated equipment to ensure compliance with all applicable engineering and quality requirements. Any deviation from this specification shall require formal engineering review, documented justification, and approval through established change control processes. Documentation Supporting documentation shall include official datasheets, reference design materials, electrical characterization reports, qualification data, inspection records, and revision-controlled manufacturing documentation. All documentation shall be maintained under formal configuration management and quality assurance systems to ensure traceability and consistency. Revision Control All modifications to this specification shall be managed through formal engineering change control procedures. Each revision shall undergo technical evaluation, validation, and approval prior to implementation to ensure continued compliance with design intent and applicable standards. #EngineeringSpecification #CapacitiveTouch #HMI #MicrochipTechnology #EmbeddedSystems #UserInterface #SensorIC #LowPowerDesign #ElectronicsDesign #QualityAssurance #EngineeringDocumentation