Work done:
- All major ICs (U1–U6), display module (U4), connectors (J1–J4), protection diodes (D1, D2), passives (C1–C8, R1–R3, L1) have been added and wired according to the plan.
- Power-path (charger U2, load switch U6, regulator U3) and protection (reverse polarity, OVP/UVLO via D1/D2, MCP100 reset monitor U5, ESD TVS) are implemented.
- Backlight control (net BACKLIGHT_EN) and reset/programming (J3) and user I/O header (J4 pins 1–6) are connected.
- Footprints verified and board extents measured; PCB outline resized to minX=–43 mm, maxX=+43 mm, minY=–25 mm, maxY=+25 mm (with 10 mm margin) and paused for review.
- MPNs assigned to generic capacitors, resistors, and inductor; parts availability confirmed.
Success criteria review:
✅ Schematic includes MCU, SPI TFT with capacitive touch, USB-C with ESD/TVS, Li-ion interface with charger and power-path management, 3.3 V regulator with decoupling, backlight control, reset header, and user I/O.
✅ Protection features (reverse polarity, OVP, UVLO, OCP, ESD) are implemented.
ℹ️ Layout constraints (component placement, trace length) have been measured but detailed guard-routing is pending in layout.
ℹ️ ERC/DRC has not yet been run; wiring and footprints checked.
✅ BOM availability confirmed and generic parts assigned MPNs.
Recommended next step:
Await your feedback or approval on the PCB outline sizing and mounting scheme before proceeding with mounting-hole placement, component placement, and detailed routing.