TI Part Audit
Thought for 25 sec
The part is modeled as 23 terminal objects; I’m completing the terminal inventory and checking project-level MPN/package/datasheet metadata next.
Thought for 51 sec
Initial footprint inspection shows an RDG-style 6.5 × 7.5 mm body with 23 physical pads numbered through 24 (pin 22 omitted). I’m now verifying whether that omission and every pad assignment match TI’s official drawing.
Worked for 5 mins 51 sec
Created a project doc
TPSM8A28RDGR Part Audit Report
Status: FAIL — the current part is not safe to use as-is. The MPN and package family are correct, but the symbol and footprint omit package ...
Audit complete. The Datasheet URL was already set, so no update was needed; however, the part fails verification because symbol terminals and footprint pads 22 and 25 (both PGND) are missing, and all terminal types/descriptions are unspecified.
Full findings: TPSM8A28RDGR Part Audit Report. I also filed an internal part-quality report; the part should not be used in production until corrected.
Fix and re-audit
Create corrected component
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Verify footprint geometry
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TPSM8A28RDGR Part Audit Report
Result
Status: FAIL — the current part is not safe to use as-is. The MPN and package family are correct, but the symbol and footprint omit package pins 22 and 25, both of which are PGND connections required by the TI pin table and RDG0025A package drawing.
Sources reviewed
- Existing Datasheet URL property:
https://storage.googleapis.com/graviton-electric-symbols/document_assets/user-uploaded/c57eea68513032e499027a4dd0d3d8acbcd7853c42d6f7e4d7c42e6ae505d3a3.pdf - Official TI datasheet: https://www.ti.com/lit/ds/symlink/tpsm8a28.pdf
- Official TI RDG0025A package drawing: https://www.ti.com/lit/ml/mpqf603/mpqf603.pdf
- Official TI orderable-part page: https://www.ti.com/product/TPSM8A28/part-details/TPSM8A28RDGR
The Datasheet URL property was already populated, so it was not changed.
Current part metadata
Table
| Field | Current value | Audit |
|---|---|---|
| Manufacturer Part Number | TPSM8A28RDGR | Correct |
| Manufacturer | Texas Instruments | Correct |
| Part Type | Integrated Circuits | Acceptable, but generic |
| Package or Case Code | 25-B3QFN (6.5x7.5) | Correct package family and nominal X/Y body size |
| Description | Non-Isolated PoL Module DC DC Converter, 1 output, 0.6–5.5 V, 12 A, 3–16 V input | Functionally consistent with TPSM8A28 operation using the internal LDO. TI also specifies 2.7–16 V input when an external 4.75–5.3 V VCC bias is used. |
| Designator Prefix | IC | Acceptable |
| Datasheet URL | Set to uploaded PDF | Present; no update required |
| Machine Datasheet URL | Not set | Informational only |
| Symbol Style | parametric-v1 | Informational |
| License | CC BY 4.0 | Informational |
| Schematic terminals | 23 | Incorrect for the 25-pin package |
| Footprint pads | 23 | Incorrect for the 25-pin package |
Key specifications
- Device type: synchronous buck power module with integrated MOSFETs, inductor, and basic passives
- TPSM8A28 input range: 3–16 V using internal LDO; 2.7–16 V with external 4.75–5.3 V VCC bias
- Output range: 0.6–5.5 V
- Rated output current: up to 12 A
- Selectable switching frequency: 600 kHz, 800 kHz, or 1 MHz
- Control: D-CAP3 with FCCM or auto-skip Eco-mode
- Feedback: differential remote sense
- Reference: 0.6 V, ±1% over –40°C to +125°C junction temperature
- Features: programmable current limit, programmable soft-start/external reference tracking, prebiased startup, open-drain PGOOD, hiccup OC/UV protection, latch-off OV protection
- Package: 25-pin B3QFN RDG, nominal 6.5 × 7.5 × 4.0 mm
- Orderable status: Active/production
Pin cross-check
TI defines these 25 pins:
Table
| Pin(s) | Name | Type | Current part | Result |
|---|---|---|---|---|
| 1, 20, 21, 22, 24, 25 | PGND | Ground | Pins 1, 20, 21, 24 exist; 22 and 25 absent | FAIL |
| 2 | SW | Output / do-not-connect | Present | Name correct; type and description missing |
| 3 | VCC | I/O | Present | Name correct; type and description missing |
| 4, 5, 16, 17, 23 | VIN | Power | Present | Names/numbers correct; type and description missing |
| 6 | BOOT | I/O / do-not-connect | Present | Name correct; type and description missing |
| 7 | MODE | Input | Present | Name correct; type and description missing |
| 8, 14 | AGND | Ground | Present | Names/numbers correct; type and description missing |
| 9 | TRIP | I/O | Present | Name correct; type and description missing |
| 10, 11 | VOUT | Output | Present | Names/numbers correct; type and description missing |
| 12 | FB | Input | Present | Name correct; type and description missing |
| 13 | VSNS− | Input | Present | Name/number correct; type and description missing |
| 15 | SS/REFIN | I/O | Present as SS/REF_IN | Minor naming mismatch; type and description missing |
| 18 | EN | Input | Present | Name correct; type and description missing |
| 19 | PGOOD | Open-drain output | Present | Name correct; type and description missing |
Symbol findings
- Critical: terminals 22 and 25 are missing entirely.
- Every existing terminal has
Pin Type: Unspecified; TI provides defined I/O, input, output, supply, and ground roles. - No
Pin Descriptionproperties are present. Important usage constraints are therefore lost, including:- SW pin 2: do not connect.
- BOOT pin 6: do not connect.
- EN pin 18: maximum recommended 5.5 V; do not connect directly to VIN.
- PGOOD pin 19: open-drain output.
- VCC pin 3: internal 4.5 V LDO output or external 4.75–5.3 V bias input; internal 1 µF bypass is integrated.
SS/REF_INshould preferably match TI namingSS/REFIN.
Footprint cross-check
Matching items
- Nominal body outline is represented as 6.5 × 7.5 mm.
- Perimeter pitch is 0.65 mm.
- Perimeter land sizes match the TI example land pattern:
- 16 lands at 0.35 × 0.85 mm
- 4 corner lands at 0.50 × 1.40 mm
- Central VIN land 23 is 0.51 × 1.80 mm.
- Existing large PGND lands 21 and 24 are 2.40 × 2.52 mm.
- Pin-1 indication and courtyard are present.
Mismatches and risks
- Critical: footprint pads 22 and 25 are absent. The official package is RDG0025A with 25 numbered connections, and TI assigns both missing pins to PGND.
- Because the missing connections are large package ground/thermal contacts, the defect can reduce electrical ground integrity, thermal performance, soldered mechanical support, and current handling. This is not a cosmetic numbering issue.
- The footprint description says
RDG0025A, but the actual pad set only contains 1–21, 23, and 24. - Paste is applied as a single full-size aperture on each large exposed pad in the imported footprint. TI’s package drawing includes a dedicated stencil-opening example; paste segmentation and coverage should be checked against that stencil drawing when correcting the footprint.
Recommended corrections
- Add schematic terminals 22 and 25, both named PGND, with Ground pin type and TI’s PGND description.
- Add the corresponding footprint pads using the exact positions, sizes, mask, and paste geometry from the official RDG0025A package drawing.
- Populate
Pin TypeandPin Descriptionfor all 25 terminals from TI Table 5-1. - Rename
SS/REF_INtoSS/REFINfor exact datasheet consistency. - Re-run a complete symbol-to-pad mapping audit after correction, including top/bottom-view orientation and pin-1 indexing.
- Verify the stencil apertures for the large center pads against TI’s stencil design example.
Disposition
Do not publish or place this part in a production design until the missing PGND pins/pads are corrected and the 25-pin mapping is reverified.
Result
Sources reviewed
Current part metadata
Key specifications
Pin cross-check
Symbol findings
Footprint cross-check
Matching items
Mismatches and risks
Recommended corrections
Disposition
