Part Audit Review
Review all available part information (MPN, package, pin count, description, properties). If no datasheet URL is already set, search the web for the official datasheet and update the part's Datasheet property with the URL. Then cross-check the schematic symbol, footprint, and pin descriptions against the datasheet. Summarize key specs and flag any mismatches.
Thought for 20 sec
I’ll audit the part metadata, source the official TI datasheet if needed, update the Datasheet property, then cross-check symbol pins, footprint geometry, and descriptions against the documentation.
Worked for 8 mins 2 sec
Created a project doc
TPA2005D1DRBR Part Audit
Texas Instruments, TPA2005D1 1.4-W Mono Filter-Free Class-D Audio Power Amplifier, Rev. G (SLOS369G): https://www.ti.com/lit/ds/symlink/tpa2...
Audit complete. The datasheet was already set, so no property update was needed; pin names 1–8 are correct, but pin descriptions/types are missing, and the footprint has significant exposed-pad and signal-pad-position mismatches versus TI’s DRB0008A land pattern. I filed a part-quality report and documented the specifications and findings in TPA2005D1DRBR Part Audit.
Fix footprint and metadata
Correct footprint only
Update symbol pins
Set official datasheet
Run validation review
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TPA2005D1DRBR Part Audit
Sources
- Texas Instruments, TPA2005D1 1.4-W Mono Filter-Free Class-D Audio Power Amplifier, Rev. G (SLOS369G): https://www.ti.com/lit/ds/symlink/tpa2005d1.pdf
- Texas Instruments, DRB0008A VSON package drawing, drawing 4218875/A: https://www.ti.com/lit/ml/qfnd058n/qfnd058n.pdf
Existing part information
- MPN: TPA2005D1DRBR — correct.
- Manufacturer: Texas Instruments — correct.
- Lifecycle: Active.
- Description: Mono Class-D speaker amplifier, approximately 1.4–1.45 W, DRB 8-pin VSON/SON with exposed pad — functionally correct.
- Package: DRB0008A, 8-pin VSON, 3.0 × 3.0 mm nominal, 1.0 mm maximum height.
- Current symbol terminal / footprint-pad count: 13. This does not match the manufacturer’s nominal 8-pin count; TI additionally specifies one unnumbered exposed thermal pad.
- Datasheet: A datasheet URL was already populated, so no URL update was required. The canonical official TI URL is listed above.
- Metadata gaps: dedicated Part Type, Package or Case Code, Mount, and pin-description/type metadata are absent or blank.
Key specifications
- Supply voltage: 2.5–5.5 V recommended.
- Output: 1.18 W typical at 1% THD+N, or 1.45 W typical at 10% THD+N, into 8 Ω at 5 V.
- Architecture: mono, BTL, filter-free Class-D, fully differential input.
- Switching frequency: 250 kHz typical (200–300 kHz).
- Quiescent current: 2.8 mA typical at 3.6 V.
- Shutdown current: 0.5 µA typical, 2 µA maximum.
- SNR: 97 dB typical at 1 W, 8 Ω, 5 V.
- Supply ripple rejection: −71 dB typical at 217 Hz under the stated test conditions.
- Operating temperature: −40 to +85 °C.
- DRB thermal resistance RθJA: 57.2 °C/W under TI’s specified test board conditions.
Symbol cross-check
Table
| TI pin | Required name/function | Current symbol | Result |
|---|---|---|---|
| 1 | SHUTDOWN, active-low logic input | ~SHUTDOWN | Functionally correct; description/type missing. |
| 2 | NC, no internal connection | NC | Name correct; TI notes the terminal still needs a pad and trace. Description/type missing. |
| 3 | IN+, positive differential input | IN+ | Correct; description/type missing. |
| 4 | IN−, negative differential input | IN- | Correct; description/type missing. |
| 5 | VO+, positive BTL output | VO+ | Correct; description/type missing. |
| 6 | VDD, power supply | VDD | Correct; should be typed/described as power input. |
| 7 | GND, high-current ground | GND | Correct; should be typed/described as ground/power input. |
| 8 | VO−, negative BTL output | VO- | Correct; description/type missing. |
| — | Exposed thermal pad, solder to grounded PCB pad | EP_1 through EP_5, pins 9–13 | Mismatch: TI defines one unnumbered thermal pad, not five numbered electrical terminals. All exposed-pad copper must be tied to GND. |
All current terminals have
Pin Type = Unspecified; pin descriptions, groups, sections, and terminal ordering are absent.Footprint cross-check
Correct items
- Body outline is 3.0 × 3.0 mm nominal.
- Signal-pad size is 0.31 × 0.60 mm, matching TI’s example land pattern.
- Signal pitch is 0.65 mm.
- Central exposed copper is 1.50 × 1.75 mm, matching TI.
Mismatches
- Signal-pad X position / overall span: current pad centers are at X = ±1.400 mm. With 0.60 mm pad length this produces a 3.40 mm outside-to-outside span. TI’s land pattern calls out 2.80 mm, corresponding to centers near X = ±1.10 mm. The current footprint therefore places each signal row about 0.30 mm too far outward.
- Thermal/paste geometry modeled as electrical copper: the footprint includes four additional 0.23 × 0.825 mm copper/paste/mask pads around the central thermal pad and numbers the five regions 9–13. TI shows a single central exposed copper land. The narrow segmented features belong to the recommended solder-paste stencil pattern, not separate electrical copper terminals.
- Thermal-pad terminal modeling: TI treats the exposed pad as unnumbered and requires it to be soldered and electrically/thermally connected to GND. The current five-terminal scheme can create incorrect net assignment or ERC behavior.
- Paste implementation: TI recommends segmented paste coverage (84% area with a 0.125 mm stencil). The current footprint instead places paste on the full central pad plus the four copper extensions, which does not faithfully implement the TI stencil example.
Severity and disposition
The pin 1–8 naming is electrically correct, but the footprint geometry and exposed-pad modeling are not manufacturer-faithful and should be corrected before production use. A Flux part-quality report was filed for engineering review. No automatic footprint correction was applied during this audit.
Sources
Existing part information
Key specifications
Symbol cross-check
Footprint cross-check
Correct items
Mismatches
Severity and disposition
