Review all available part information (MPN, packag...
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The project already has an ST official datasheet URL set, so I’ll use that for the cross-check and won’t change the Datasheet property.
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Created a project doc
STTS22HTR Part Review
Date: 2026-07-07 Official datasheet already present in project metadata:
Completed the STTS22HTR review. The official ST datasheet was already set, and the MPN, pin numbering, and UDFN-6L footprint concept match the datasheet.
Open items flagged:
- Pin Type values are all
Unspecified. - Pin Description properties are missing.
Package or Case Code = UDFN-6Lis not explicitly set.ALERT_/_INTis functionally correct but stylistically differs from datasheetALERT / INT.
Detailed specs and mismatch notes are in STTS22HTR Part Review.
Fix metadata and verify
Fix flagged metadata
Run ERC/DRC
Verify footprint dimensions
Check manufacturing export
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STTS22HTR Part Review
Date: 2026-07-07
Source reviewed
Official datasheet already present in project metadata:
- Datasheet URL: https://www.st.com/resource/en/datasheet/stts22h.pdf
- Datasheet: STMicroelectronics STTS22H, DS12606 Rev 8, March 2026
No Datasheet property update was required.
Existing project metadata
- Project / part name: STTS22HTR
- Manufacturer Part Number: STTS22HTR
- Manufacturer Name: STMicroelectronics
- Description: Low-voltage, ultra-low-power, 0.5 degree C accuracy I2C/SMBus 3.0 temperature sensor
- Part Type: Sensors
- Designator Prefix: IC
- Published part UID: 2fa2e0c0-192a-4e55-88f5-01903ca302c2
- Schematic terminals / pads: 7 total: SCL, ALERT_/_INT, VDD, ADDR, GND, SDA, EP
Key datasheet specs
- Function: digital temperature sensor with 2-wire I2C/SMBus 3.0 interface
- Order code: STTS22HTR
- Package: UDFN-6L, 2.0 mm x 2.0 mm x 0.50 mm, 6 leads with exposed pad down
- Supply voltage: 1.5 V to 3.6 V recommended
- Absolute maximum VDD: -0.3 V to 4.8 V
- Operating temperature: -40 C to +125 C
- Temperature accuracy: max +/-0.5 C from -10 C to +60 C; max +/-1.0 C from -40 C to +125 C
- Interface: I2C/SMBus 3.0, up to 1 MHz serial clock
- Output data: 16-bit temperature data
- Current: 1.75 uA one-shot mode; 2.0 uA at 1 Hz ODR with AVG[1:0] = 3; 120 uA typ / 180 uA max during sensor measurements; 0.5 uA power-down
- Address options via ADDR pin:
- ADDR = VDD: 7-bit 0x38, datasheet 8-bit write/read 0x70/0x71
- ADDR = 15 kOhm +/-5% pull-up: 7-bit 0x3C, datasheet 8-bit write/read 0x78/0x79
- ADDR = 56 kOhm +/-5% pull-up: 7-bit 0x3E, datasheet 8-bit write/read 0x7C/0x7D
- ADDR = GND: 7-bit 0x3F, datasheet 8-bit write/read 0x7E/0x7F
- WHOAMI register: address 0x01, default A0h
Pin cross-check
Table
| Datasheet pin | Datasheet name | Datasheet function | Project terminal | Result |
|---|---|---|---|---|
| 1 | SCL | SMBus/I2C serial interface clock | SCL, Pin Number 1 | Match |
| 2 | ALERT / INT | Open-drain interrupt output; supports SMBus Alert (ARA) | ALERT_/_INT, Pin Number 2 | Function/name match; formatting differs |
| 3 | VDD | Power supply VDD | VDD, Pin Number 3 | Match |
| 4 | Addr | SMBus/I2C address selection at power-up | ADDR, Pin Number 4 | Match |
| 5 | GND | 0 V supply | GND, Pin Number 5 | Match |
| 6 | SDA | SMBus/I2C serial data line | SDA, Pin Number 6 | Match |
| Exposed pad | Exposed pad down | Improves temperature match with surrounding environment | EP, Pin Number 7 | Reasonable footprint pad, but no pin description/type set |
Footprint cross-check
Project footprint asset:
SON65P200X200X55-7N-D.kicad_mod, described as UDFN-6L.Footprint pad geometry from project asset:
- Pads 1-6: 0.30 mm x 0.80 mm, 0.65 mm pitch, three pads per side
- Pad 7 / EP: 0.75 mm x 1.55 mm center exposed pad
- Fab outline: 2.0 mm x 2.0 mm body with pin-1 chamfer
- Courtyard: approximately 3.25 mm x 2.55 mm
- 3D model:
STTS22HTR.stp
Datasheet package / land pattern information extracted:
- Package: UDFN-6L, 2.0 mm x 2.0 mm x 0.50 mm, exposed pad down
- Package body: 2.0 mm length +/-0.05, 2.0 mm width +/-0.05, 0.55 mm max height
- Lead pitch: 0.65 mm
- Lead geometry callouts include 0.25 mm +/-0.05 and 0.4 mm +/-0.1 for the 6 leads
- Exposed pad / central land callout: 1.45 mm +/-0.1 in package drawing
- Land pattern extracted callouts include 1.45, 1.78, 0.65, 0.7, and 0.27 mm
- Solder mask opening extracted callouts include 1.77, 0.47, 2.68, 0.9, 0.88, and 1.65 mm
Footprint result: broadly consistent with a 2.0 x 2.0 mm, 0.65 mm pitch UDFN-6L with exposed pad. The project footprint’s 0.30 mm x 0.80 mm lead pads and 0.75 mm x 1.55 mm EP pad are plausible against the extracted datasheet land pattern values, though the datasheet OCR did not provide a fully labeled dimension table for every land-pattern feature. Critical manufacturing release should still verify directly against Figure 10 / Figure 11 in the PDF.
Mismatches / issues flagged
- Schematic terminal Pin Type values are all
Unspecified; datasheet-backed types should be set for better ERC/search quality:- SCL: Input or Digital / I2C clock
- SDA: Bi-Directional / I2C data
- ALERT_/_INT: Open-drain output
- VDD: Power In
- GND: Ground
- ADDR: Input
- EP: Passive or thermal/mechanical pad, typically tied according to the recommended footprint/application practice if specified elsewhere
- Pin Description properties are absent from the terminals; the datasheet pin functions should be added.
- ALERT_/_INT name is functionally correct, but differs stylistically from the datasheet spelling
ALERT / INT. - The datasheet has 6 electrical leads plus an exposed pad; the project exposes this as a 7th schematic terminal/pad
EP. That is reasonable for layout/control, but it should have a clear description and type. - The project metadata does not explicitly include
Package or Case Code = UDFN-6L; adding it would improve BOM/search clarity. - Project
Part TypeisSensors; the datasheet-specific classification is more precisely a digital temperature sensor.
Overall conclusion
The part identity, datasheet URL, pin numbering, and UDFN-6L footprint concept match the STMicroelectronics datasheet. The main cleanup needed is metadata enrichment: add pin descriptions, assign proper pin types, optionally add the package case code, and optionally normalize the ALERT/INT label formatting.
Source reviewed
Existing project metadata
Key datasheet specs
Pin cross-check
Footprint cross-check
Mismatches / issues flagged
Overall conclusion
