Part Datasheet Audit

Review all available part information (MPN, package, pin count, description, properties). If no datasheet URL is already set, search the web for the official datasheet and update the part's Datasheet property with the URL. Then cross-check the schematic symbol, footprint, and pin descriptions against the datasheet. Summarize key specs and flag any mismatches.

Thought for 5 sec

flux

I’ll audit the part metadata and existing assets, locate the official ST datasheet if needed, update the Datasheet property, then cross-check symbol pins, footprint, and descriptions against the manufacturer documentation.

Worked for 3 mins 45 sec

Created a project doc

Part Datasheet Audit

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Part Datasheet Audit Scope and source

Audited the current part project for ST25R3916B-AQET against the official STMicroelectronics datasheet:

Official datasheet: https://www.st.com/resource/en/datasheet/st25r3916b.pdf
Document: DS13541 Rev 11, March 2026
Product status in datasheet: production data

Existing part metadata Ordering-code interpretation

ST25: NFC/RFID devices
R: NFC/HF reader
3916B: full-feature NFC reader
A: -40 °C to +105 °C ambient range
QE: 32-pin UFQFPN, 5 x 5 x 0.55 mm, non-wettable flanks
T: tape-and-reel

Symbol and terminal audit

The symbol contains all 32 numbered pins plus terminal 33 for the exposed ground pad. Most pin names and numbers match Table 2 of the datasheet.

flux

Audit complete. The existing Datasheet URL is already the official STMicroelectronics datasheet, so no property update was needed.

Key issues found:

TAD1/TAD2 are swapped between pins 2 and 25.
AQET is UFQFPN32, not WLCSP/36-UFBGA.
Footprint pads differ from ST’s recommended land pattern.
All pin types are unspecified and pin descriptions are missing.
“Logic Function: AND” is incorrect.

Full specifications and comparisons are in Part Datasheet Audit. I also filed an internal part-quality report.

Fix metadata and pins

Rebuild official footprint

Verify 3D model

Correct classifications

Files

Pins

Symbol

Layout

3D View

Part Datasheet Audit

Scope and source

Audited the current part project for ST25R3916B-AQET against the official STMicroelectronics datasheet:

Official datasheet: https://www.st.com/resource/en/datasheet/st25r3916b.pdf
Document: DS13541 Rev 11, March 2026
Product status in datasheet: production data

Existing part metadata

Table

Field	Current value	Datasheet cross-check	Result
Manufacturer part number	ST25R3916B-AQET	Exact ordering code is valid	Pass
Manufacturer	STMicroelectronics	STMicroelectronics	Pass
Datasheet URL	Official ST URL above	Correct official URL	Pass; no update required
Description	RFID Reader/Transponder IC, 13.56 MHz, FeliCa, ISO 14443, ISO 15693, MIFARE, NFC, I2C, SPI, 2.6-5.5 V, 36-UFBGA, WLCSP	AQET is a 32-pin UFQFPN, 5 x 5 x 0.55 mm, non-wettable flanks	Fail: package wording is wrong
Package or Case Code	WLCSP	Ordering suffix QE means UFQFPN32	Fail
Terminal count	33	32 perimeter leads plus exposed thermal/ground pad	Pass if terminal 33 represents the exposed pad; package itself is called 32-pin
Part Type	Integrated Circuits / Logic	NFC/HF reader IC with analog front end and digital protocol engine	Weak classification
Logic function	AND	Not applicable	Fail / irrelevant property

Ordering-code interpretation

ST25: NFC/RFID devices
R: NFC/HF reader
3916B: full-feature NFC reader
A: -40 °C to +105 °C ambient range
QE: 32-pin UFQFPN, 5 x 5 x 0.55 mm, non-wettable flanks
T: tape-and-reel

Symbol and terminal audit

The symbol contains all 32 numbered pins plus terminal 33 for the exposed ground pad. Most pin names and numbers match Table 2 of the datasheet.

Definite pin-number mismatch

Table

Symbol terminal	Current pin number	Correct pin number	Datasheet function
TAD1	25	2	Analog output, test output 2
TAD2	2	25	Analog I/O, test output 1

TAD1 and TAD2 are swapped. Because footprint pads are associated through these terminals, the named footprint pads are also mapped incorrectly even though the raw footprint has numbered pads 2 and 25.

Pin names

All other numbered pin names match the datasheet. Two combined interface labels are acceptable aliases but are not the exact primary datasheet names:

Pin 30: current SCLK/SCL; datasheet primary name SCLK, function SPI clock / I2C clock.
Pin 32: current MISO/SDA; datasheet primary name MISO, function SPI output / I2C bidirectional data.

Pin types and descriptions

Every terminal currently has Pin Type: Unspecified and no populated Pin Description. This does not match the datasheet's electrical types and removes useful ERC semantics.

Recommended types from Table 2:

Table

Pins	Recommended type
1, 6, 8, 10, 12, 14, 16, 21, 26, 33	Power
2, 3, 4, 7, 9, 11, 13, 15, 17, 18, 19	Analog output
5	Analog/digital input
20, 29, 30, 31	Digital input
22, 23	Analog input
24, 25	Analog bidirectional
27, 28	Digital output
32	Digital output/tri-state for SPI and bidirectional data for I2C

Descriptions should be populated from Table 2, particularly for regulated outputs (VDD_D, VDD_A, VDD_RF, VDD_AM), external supply inputs (VDD, VDD_TX, VDD_IO, VDD_DR), RF pins, and interface-mode pins.

Footprint audit

Correct characteristics

32 perimeter pads plus exposed pad 33.
5.0 mm square body outline.
0.50 mm lead pitch.
Pin-1 indicator and conventional counterclockwise numbering are present.
Footprint includes a central exposed pad tied to terminal 33/GND.

Geometry mismatches against ST's footprint example

Table

Feature	Current footprint	ST example	Result
Perimeter copper pad	0.30 x 0.85 mm	0.25 x 0.65 mm	Mismatch; current pads are wider and longer
Exposed pad	3.60 x 3.60 mm	3.50 x 3.50 mm	Mismatch; current pad is larger
Lead pitch	0.50 mm	0.50 mm	Pass
Body	5.0 x 5.0 mm	5.0 x 5.0 mm	Pass

The current footprint resembles a generic QFN land pattern rather than ST's current Rev 11 UFQFPN32 example (A0B8_EP-3.5x3.5mm_UFQFPN32_FP_V1). The oversized pads may still solder, but they are not a datasheet match and should be reviewed before release. The exposed-pad paste is currently one solid 3.6 mm square aperture; segmented paste apertures are generally preferable for voiding and paste-volume control, though the exact paste strategy is a manufacturing decision rather than a pinout requirement.

Package identity mismatch

The footprint asset is named QFN50P500X500X60-33N-D, which is dimensionally close to UFQFPN32, but the part property says WLCSP and the description says 36-UFBGA/WLCSP. AQET must be represented as UFQFPN32 with non-wettable flanks.

3D model

A STEP model is attached and placed at the footprint origin with no rotation or scale override. The available project data did not expose measurable model extents, so exact body size, seating height, and pin-1 orientation could not be independently verified. It should visually match a 5 x 5 mm body with nominal 0.55 mm height.

Key specifications

Table

Parameter	Datasheet value
Function	High-performance NFC/HF RFID reader with reader/writer, card emulation, and active/passive peer-to-peer modes
Carrier frequency	13.56 MHz
Crystal	27.12 MHz
Supply, VDD and VDD_TX	2.6 to 5.5 V over -40 to +105 °C under stated regulator setting; 2.4 to 5.5 V over -20 to +105 °C
VDD/VDD_TX absolute maximum	-0.3 to 6.0 V
VDD_IO absolute maximum	-0.3 to 6.0 V
Ambient range for AQET	-40 to +105 °C
Junction range/max	-40 to +125 °C
NFC-A / ISO 14443A	Up to 848 kbit/s
NFC-B / ISO 14443B	Up to 848 kbit/s
NFC-F / FeliCa	Up to 424 kbit/s
NFC-V / ISO 15693	Up to 53 kbit/s
SPI	Up to 10 Mbit/s
I2C	400 kbit/s Fast-mode, 1 Mbit/s Fast-mode Plus, 3.4 Mbit/s High-speed mode
FIFO	512 bytes
RFO driver resistance	1.7 ohm typical, 4 ohm maximum at stated test condition
Power-down current	As low as 0.5 uA typical at 2.4 V and low junction temperature
Wake-up logic/RC current	1.8 uA typical at 2.4 V or 3 uA typical at 5.5 V at low junction temperature
Package	UFQFPN32, 5 x 5 x 0.55 mm nominal, 0.50 mm pitch, non-wettable flanks, exposed pad

Severity summary

Critical

TAD1 and TAD2 pin numbers are swapped (pins 2 and 25).
Package metadata is wrong: AQET is UFQFPN32, not WLCSP/UFBGA.

High

Footprint land pattern does not match the official ST example: perimeter pads and exposed pad are oversized.
All terminal electrical types are unspecified, weakening ERC and allowing invalid connections.

Medium

Pin descriptions are absent.
Part classification as Logic / AND is incorrect or irrelevant.
Description calls the device a reader/transponder and lists the wrong package; a more accurate description is “high-performance NFC/HF RFID reader IC.”

Recommended corrections

Swap TAD1/TAD2 pin assignments: TAD1 = pin 2, TAD2 = pin 25.
Change package metadata to UFQFPN32 (5 x 5 x 0.55 mm, 0.5 mm pitch, exposed pad, non-wettable flanks).
Correct the description and remove WLCSP/UFBGA wording for this ordering code.
Rebuild or override the land pattern to the ST Rev 11 footprint example: 0.25 x 0.65 mm perimeter pads and 3.50 x 3.50 mm exposed pad, then verify paste and solder-mask rules.
Populate pin types and descriptions from datasheet Table 2.
Remove the Logic Function: AND classification and classify the part as an NFC/HF reader IC.
Verify the STEP body dimensions, seating, and pin-1 orientation in 3D.

Scope and source
Existing part metadata
Ordering-code interpretation
Symbol and terminal audit
Definite pin-number mismatch
Pin names
Pin types and descriptions
Footprint audit
Correct characteristics
Geometry mismatches against ST's footprint example
Package identity mismatch
3D model
Key specifications
Severity summary
Critical
High
Medium
Recommended corrections