Symbol Pin Audit
Thought for 29 sec
I’ll apply this to the current ST25R200-BMET symbol using the verified datasheet pin functions, preserving every pin number and mapping. I’ll remove Pin Group metadata, assign sections/orientations/order, then verify the resulting symbol structure.
Worked for 3 mins 25 sec
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Part Audit
Part Audit
Identification and metadata
- MPN: ST25R200-BMET
- Manufacturer: STMicroelectronics
- Description: NFC/HF RFID reader/writer IC supporting NFC-A/ISO14443A, NFC-B/ISO14443B, NFC-V/ISO15693, NFC Forum tag types, and SPI host communication.
- Package: UFQFPN24, 4 × 4 mm, 0.5 mm pitch, exposed pad (25 electrical/footprint terminals including the exposed pad).
- Lifecycle: Active / volume production; ST longevity information indicates availability until 01/2035.
- Official datasheet: https://www.st.com/resource/en/datasheet/st25r200.pdf
- Datasheet property: Updated and verified.
- Package is not exposed as a dedicated part-level property.
- Operating voltage and operating temperature are not recorded as part-level properties.
Updated the ST25R200-BMET symbol: all 25 pins retain their original names, numbers, and mappings; Pin Group was removed; balanced Power, Digital, RF/Analog, Crystal, and Ground sections now have verified orientations and terminal order. The official ST datasheet URL is set, and the detailed findings—including the mismatched footprint land pattern—are in Part Audit.
Fix footprint and metadata
Review exposed-pad stencil
Validate updated part
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Part Audit
Identification and metadata
- MPN: ST25R200-BMET
- Manufacturer: STMicroelectronics
- Description: NFC/HF RFID reader/writer IC supporting NFC-A/ISO14443A, NFC-B/ISO14443B, NFC-V/ISO15693, NFC Forum tag types, and SPI host communication.
- Package: UFQFPN24, 4 × 4 mm, 0.5 mm pitch, exposed pad (25 electrical/footprint terminals including the exposed pad).
- Lifecycle: Active / volume production; ST longevity information indicates availability until 01/2035.
- Official datasheet: https://www.st.com/resource/en/datasheet/st25r200.pdf
- Datasheet property: Updated and verified.
Metadata gaps
- Package is not exposed as a dedicated part-level property.
- Operating voltage and operating temperature are not recorded as part-level properties.
Key specifications
- RF carrier: 13.56 MHz
- NFC-A and NFC-B: 106 kbit/s
- NFC-V: up to 53 kbit/s
- SPI: up to 10 Mbit/s
- FIFO: 256 bytes
- Crystal: 27.12 MHz
- VDD and VDD_IO: 2.7–5.5 V
- Ambient temperature: −40°C to +85°C
- Absolute maximum VDD/VDD_IO: 6 V
- HBM ESD: 2 kV
Pin audit
All 25 pin-number/name mappings match ST datasheet Table 1. No pins are missing, duplicated, renumbered, or mapped to the wrong footprint pad.
The original symbol lacked pin descriptions and had
Pin Type = Unspecified for all terminals. Datasheet electrical classifications include digital output, tri-state output, digital input, analog input/output, supply output, power, and ground types. Important functional notes include:- GND_DR must connect as shortly as possible to exposed-pad VSS.
- VSS is the exposed die pad and substrate ground.
- BSS is the active-low SPI enable.
- TAD1/TAD2 are test pins and may be routed to test points or left unconnected when unused.
- VDD_D, VDD_AM, VDD_DR, and VDD_A are regulated domain outputs, not ordinary external supply inputs.
Symbol organization applied
No pin names, numbers, mappings, or footprint assignments were changed.
Pin Group was removed from every pin. The parametric symbol now uses globally unique Terminal Order values 1–25 and these balanced sections:- Power — 6 pins, split 3 left / 3 right
- Digital Interface — 6 pins, split 3 left / 3 right
- RF / Analog — 7 pins, split 3 left / 4 right
- Crystal — 2 pins, split 1 left / 1 right
- Ground — 4 pins, split 2 left / 2 right
Readback confirmed all 25 terminals remain present exactly once and all requested Section, Pin Orientation, and Terminal Order properties are applied.
Footprint audit
Datasheet package reference: UFQFPN24, 4.00 × 4.00 mm body, 0.50 mm pitch, terminal width 0.18–0.30 mm, exposed-pad package dimension 2.60–2.85 mm. ST’s footprint example uses approximately 0.40 × 0.55 mm peripheral lands, a 2.75 × 2.75 mm exposed land, and a 4.30 mm outer land span.
Table
| Feature | Current footprint | ST example | Result |
|---|---|---|---|
| Peripheral pad | 0.254 × 0.8128 mm | ≈0.40 × 0.55 mm | Mismatch: narrower and longer |
| Pitch | 0.50038 mm | 0.500 mm | Negligible conversion artifact |
| Outer copper span | 4.6228 mm | 4.30 mm | Oversized by 0.3228 mm |
| Inner opposing-pad gap | 2.9972 mm | ≈3.20 mm | Too small by 0.2028 mm |
| Exposed pad | 2.8448 × 2.8448 mm | 2.75 × 2.75 mm | Oversized by 0.0948 mm per axis |
| Fab body outline | 4.0132 × 4.0132 mm | 4.00 × 4.00 mm | Minor conversion artifact |
The exposed-pad paste is a single solid aperture. The datasheet does not provide enough stencil detail to validate paste segmentation, so assembly-house stencil guidance should be used.
Main flags
- Footprint land pattern does not match ST’s recommended footprint example. Correct before production use.
- Pin descriptions and electrical pin types remain incomplete metadata. Physical pin mapping is correct, but ERC and library clarity are reduced until these fields are populated.
- Dedicated package, voltage, and temperature properties are absent.
Evidence: ST25R200 datasheet DS13658 Rev. 2, Table 1, Tables 89–90, Table 96, and Figure 24.
Identification and metadata
Metadata gaps
Key specifications
Pin audit
Symbol organization applied
Footprint audit
Main flags
