Part Datasheet Review

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3/3 Independently verify pad dimensions, pitch, and mechanical alignment

Inspect footprint source, rendered geometry, and dimensional metadata

Determine root cause and apply the safest correction if required

Independently verify pad dimensions, pitch, and mechanical alignment

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SIM8066 Footprint Verification
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flux

The independent check exposed a real importer defect: the KiCad asset is authored in mm, but the generated pad nodes are 1000× undersized. I’m applying explicit mm overrides to all 11 copper pads and both locating holes, preserving their mappings and orientation.

flux

Confirmed and fixed a genuine 1000× import-scaling defect. All 11 electrical pads now read back at the correct positions and dimensions—0.8 × 1.14 mm signal pads and 0.7 × 2.1 mm shield pads—and two correctly scaled Ø0.75 mm locating holes were added.
  • The original virtual locating holes remain as negligible undersized artifacts because they cannot be directly edited.
  • An internal part-quality report was filed so the underlying library/import issue can be corrected.
  • Detailed investigation: Footprint Scaling Investigation.
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SIM8066-6-1-14-01-A