Part Datasheet Review
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Part Datasheet Review — SIM8066-6-1-14-01-A
Date: 2026-07-21 Reviewed all available project/library part information for SIM8066-6-1-14-01-A against official GCT sources, then cross-ch...
Completed the part review and created the full report: Part Datasheet Review — SIM8066-6-1-14-01-A. The existing Datasheet URL was already set to GCT’s official product page, so I did not overwrite it.
Open items:
- Critical footprint readback issue: computed pad geometry appears 1000× too small versus the embedded KiCad footprint/datasheet dimensions.
- Pin descriptions are missing and all pin types are currently Unspecified.
- Library metadata has incorrect IC/logic classification artifacts.
Suggested next steps:
- Fix/verify the footprint scaling before manufacturing export.
- Add proper pin descriptions and electrical pin types.
- Clean up metadata: connector/electromechanical type, package, and manufacturer facet.
- Optionally set the Datasheet URL to the direct official GCT PDF instead of the product page.
Fix metadata and pins
Verify footprint scaling
Set direct PDF
Run validation checks
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Ask about this doc
Part Datasheet Review — SIM8066-6-1-14-01-A
Date: 2026-07-21
Scope
Reviewed all available project/library part information for SIM8066-6-1-14-01-A against official GCT sources, then cross-checked the schematic terminal representation, footprint/land pattern, pin labels, and pin descriptions.
Sources Used
- Existing project Datasheet URL property:
- Official GCT product page:
- Official GCT drawing PDF discovered from product page:
- Official GCT specification PDF discovered from product page:
- Datasheet extraction also resolved a direct drawing PDF instance:
The existing Datasheet URL property was already populated with an official GCT product page, so I did not change it. If a direct PDF link is preferred, the official GCT drawing/specification PDF URLs above are available.
Current Part Metadata in Flux
Table
| Field | Current value | Datasheet / source check |
|---|---|---|
| Project / Part name | SIM8066-6-1-14-01-A | Matches MPN. |
| Manufacturer Part Number | SIM8066-6-1-14-01-A | Matches GCT ordering code. |
| Manufacturer Name | GCT (GLOBAL CONNECTOR TECHNOLOGY) | Matches official source. |
| Description | Memory Card Connectors 1.44mm Nano SIM Conn w/Peg and Switch | Consistent with GCT: Nano SIM, push-push, SMT, 6 contacts, 1.44 mm profile, with locating peg and switch. |
| Designator Prefix | J | Appropriate for connector. |
| Pads / terminal count | 11 | Consistent with 6 SIM contacts + CD + 4 shell/GND solder contacts. Locating holes are mechanical pads in footprint, not schematic terminals. |
| Part Type | Electromechanical Components | Broadly acceptable, though Flux library search facet also reported Integrated Circuits / Logic AND type-specific values, which is incorrect metadata. |
| Datasheet URL | https://gct.co/connector/sim8066 | Official GCT product page. Direct official PDFs also found. |
| Package / mounting | Not explicitly set as a property | Datasheet: SMT/SMD nano SIM push-push connector, 1.44 mm profile, with locating pegs. |
Key Datasheet Specs
Table
| Spec | Value |
|---|---|
| Product family | 4FF Nano SIM |
| Connector style | Push-push |
| Number of SIM contacts | 6 |
| Card detect switch | With switch, normally closed |
| Switch behavior | Without card: GND and CD closed/shorted. Card inserted: GND and CD open. |
| Profile height | 1.44 mm |
| Locating peg option | With locating peg |
| Packing option | A = Tape & Reel, 1500 pcs/reel |
| Voltage rating | 30 V AC/DC |
| Current rating | 1.0 A AC/DC max |
| Contact resistance | 100 mΩ max |
| Insulation resistance | 1000 MΩ min at 500 VDC for 1 minute between adjacent terminals |
| Dielectric withstand | 500 VAC for 1 minute |
| Operating temperature | -40 °C to +85 °C |
| Durability | 5,000 cycles |
| Solder temperature | Peak 255 °C (+5/-0 °C), 5 seconds max |
| Contact material | Copper alloy |
| Insulator / housing | High-temperature thermoplastic / high-temp plastic UL94V-0, black |
| Shell | Stainless steel |
| Contact plating | Gold flash over nickel |
Pin / Terminal Cross-Check
Table
| Datasheet contact | Function | Flux schematic designator | Flux pin number property | Result |
|---|---|---|---|---|
| C1 | VCC / SIM power | VCC | C1 | Matches. |
| C2 | RST / reset | RST | C2 | Matches. |
| C3 | CLK / clock | CLK | C3 | Matches. |
| C5 | GND | GND_1 | C5 | Matches functionally, but designator is generic GND_1 rather than C5/GND. |
| C6 | VPP | VPP | C6 | Matches. Note: VPP is often NC in modem designs, but the contact exists. |
| C7 | I/O / data | I/O | C7 | Matches. |
| CD | Card detect | CD1 | CD1 | Function matches, but datasheet/drawing labels this contact as CD, not CD1. |
| G1 | Shell/ground solder contact | GND_2 | G1 | Matches as shell/GND. |
| G2 | Shell/ground solder contact | GND_3 | G2 | Matches as shell/GND. |
| G3 | Shell/ground solder contact | GND_4 | G3 | Matches as shell/GND. |
| G4 | Shell/ground solder contact | GND_5 | G4 | Matches as shell/GND. |
Symbol / pin-description observations
- The schematic representation is built from 11 terminal components rather than a single connector symbol body. This can be valid for a part-project terminal definition, but it is not a conventional single-symbol connector drawing.
- Pin Number properties are present and generally match the datasheet.
- Pin Type is Unspecified for every terminal. Suggested types: VCC = Power In, C5/G1-G4 = Ground or Passive, RST/CLK = Input/Signal, I/O = Bi-Directional, VPP = Passive/Signal or NC depending usage, CD = Passive/Switch signal.
- Pin Description properties are missing. The datasheet functions should be added as terminal descriptions.
- CD is represented as CD1. Because the GCT drawing labels the switch terminal CD, this is a naming mismatch unless Flux requires unique numeric designators.
Footprint / Land Pattern Cross-Check
Datasheet expectations
- Recommended PCB layout is metric, viewed from component side, tolerance ±0.05 mm.
- Pads are SMT/SMD on the component side / top copper layer.
- Signal pad left-to-right order on PCB layout: C3, C7, C2, C6, C1, C5, CD.
- Six SIM signal pads use 1.27 mm center pitch; 0.80 mm is a spacing callout, not pitch.
- CD is offset relative to the six SIM contacts; extraction confirms 0.95 mm is associated with CD spacing/offset, not the repeated SIM pitch.
- Signal solder pad width is called out as 0.45 mm in the drawing extraction, while the imported KiCad footprint uses 0.800 mm × 1.140 mm pads. The visual drawing should be checked before changing this because OCR/leader-line extraction may confuse pad-width versus spacing callouts.
- Component outline: 13.00 mm × 12.00 mm.
- Two locating holes: Ø0.75 mm.
- Four shell/GND solder areas.
Embedded KiCad footprint payload observed in Flux
Table
| Feature | Embedded KiCad footprint value | Datasheet consistency |
|---|---|---|
| Signal pad labels/order | C3, C7, C2, C6, C1, C5, CD | Matches drawing order. |
| Signal pad center positions | C3 -4.830, C7 -3.560, C2 -2.290, C6 -1.020, C1 0.250, C5 1.520, CD 2.470 mm at y = -7.370 mm | Six SIM contacts have 1.27 mm pitch; CD offset is 0.95 mm from C5. This matches the extracted layout relationship. |
| Signal pad size | 0.800 mm × 1.140 mm | Y dimension matches 1.14 mm callout; X dimension needs visual drawing confirmation because extraction also reported 0.45 mm signal pad width. |
| Shell/GND pads | G1/G2/G3/G4, size 0.700 mm × 2.100 mm | Count and placement concept match; exact dimensions need visual drawing confirmation due OCR ambiguity. |
| Locating holes | MH1, MH2, Ø0.75 mm | Matches datasheet hole diameter. |
| Fabrication outline | 12.29 mm × 13.72 mm from ±6.145 and ±6.86 mm | Close to body/outline callouts but not identical to 13.00 mm × 12.00 mm; may represent connector body/fab outline rather than courtyard. Needs visual confirmation. |
| Courtyard | ±7.85 mm by -8.94/+8.16 mm | Larger than body, reasonable as courtyard. |
Critical footprint issue in Flux computed layout nodes
The embedded KiCad footprint payload is in mm-scale coordinates, but the computed Flux pad nodes read back as values 1000× smaller, for example:
Table
| Pad | Embedded KiCad value | Computed Flux pad readback |
|---|---|---|
| C1/VCC pad size | 0.800 mm × 1.140 mm | 0.0008 mm × 0.00114 mm |
| C1/VCC position | (0.250, -7.370) mm | approximately (0.00025, +0.00737) mm |
| MH1 hole size | Ø0.75 mm | 0.00075 mm |
This appears to be a severe unit-scaling/readback mismatch in the Flux PCB node representation. If the manufacturing export uses the computed nodes rather than the embedded KiCad payload, the footprint would be unusably small. This has been filed as a part-quality issue internally.
Mismatches / Issues Flagged
- Critical: footprint computed pad geometry appears scaled 1000× too small compared with the embedded KiCad footprint and official mm datasheet dimensions.
- Pin descriptions are missing for every schematic terminal.
- Pin types are all Unspecified; they should be classified by electrical role.
- CD naming mismatch: datasheet labels card-detect terminal as CD; Flux schematic uses CD1 and Pin Number CD1.
- Metadata inconsistency in library search: the part is indexed/faceted as Integrated Circuits and has unrelated type-specific values like Logic AND, while the project property says Electromechanical Components. It should be a connector/electromechanical part.
- Manufacturer facet inconsistency: library search reports manufacturer as Other even though the project property correctly says GCT (GLOBAL CONNECTOR TECHNOLOGY).
- Package property not explicitly populated; datasheet calls it SMT/SMD nano SIM push-push connector, 1.44 mm profile, with locating pegs.
- Footprint pad width ambiguity: imported KiCad signal pads are 0.800 mm wide, while OCR/drawing extraction also returned a 0.45 mm signal pad width callout. This should be visually checked against the official drawing before changing copper.
Recommended Fixes
- Verify whether Flux manufacturing export uses the embedded KiCad footprint payload or the computed pad nodes. If computed nodes drive export, fix the 1000× footprint scaling before using this part.
- Add terminal Pin Description properties:
- C1: SIM VCC / card power
- C2: SIM reset
- C3: SIM clock
- C5: SIM ground
- C6: SIM VPP / programming voltage, often NC in modern designs
- C7: SIM data I/O
- CD: Card detect, normally closed to GND with no card, open when inserted
- G1–G4: Shell/ground solder contacts
- Update Pin Type properties from Unspecified to appropriate electrical roles.
- Consider renaming CD1 / Pin Number CD1 to CD if Flux allows it without breaking uniqueness.
- Correct library metadata/type facets to connector/electromechanical and remove unrelated IC/logic values.
- Optionally change the Datasheet URL from the GCT product page to one of the official direct PDF links, or add the PDF as a machine datasheet URL if that workflow is available.
Scope
Sources Used
Current Part Metadata in Flux
Key Datasheet Specs
Pin / Terminal Cross-Check
Symbol / pin-description observations
Footprint / Land Pattern Cross-Check
Datasheet expectations
Embedded KiCad footprint payload observed in Flux
Critical footprint issue in Flux computed layout nodes
Mismatches / Issues Flagged
Recommended Fixes
