SIM-ST-MFF2 Audit

adrian95

adrian95

flux

Audit the current SIM-ST-MFF2 part project completely. Inspect all available part information including MPN, manufacturer, package, pin/pad count, description, and all properties. Check whether the Datasheet property is populated; if absent or invalid, find the official manufacturer datasheet on the web and update the part's Datasheet property to the direct official URL. Read the authoritative datasheet and cross-check: (1) schematic symbol pin numbers/names/functions/types and pin descriptions, (2) footprint pad count, numbering, positions, dimensions, pitch, outline/orientation/markings, and package match, and (3) metadata/description/properties. Extract a concise list of key specifications. Make only the requested Datasheet-property mutation; do not alter symbol or footprint even if mismatches are found. Report exact evidence, all mismatches or ambiguities, and whether the part is safe to use as-is. Done criteria: full metadata inventory, official datasheet URL set if needed, complete 9-pad pin/pad mapping review, footprint/package comparison, and clear mismatch list.
Created a project doc

SIM-ST-MFF2 Part Audit

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Audit date: 2026-07-27 Project: SIM-ST-MFF2

flux

Audit completed and documented in SIM-ST-MFF2 Part Audit. The part is not production-safe as-is due to an undocumented ninth EPAD, unspecified pin types/descriptions, and an unverifiable land/stencil pattern; the populated, readable Datasheet property was left unchanged because no exact official Hologram-hosted URL exists for this discontinued MPN.
Fix metadata issues
Remove EPAD ambiguity
Find exact footprint
Update datasheet source
Review corrected part
I/O
Pin Number
3
GND
Pin Number
1
NC
Pin Number
2
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SIM-ST-MFF2

SIM-ST-MFF2 thumbnail
Global Embedded IoT eSIM (MFF2) – Embedded MFF2 eSIM for IoT devices, asset tracking, telematics, smart meters, industrial automation, connected products, and embedded cellular applications. Supports global 2G, 3G, and 4G LTE IoT connectivity through the Hologram cellular network, providing secure machine-to-machine (M2M) communication without the need for a removable SIM card. Features a compact MFF2 (5 × 6 × 0.82 mm) solder-down form factor, remote provisioning and activation, global roaming support, developer-friendly APIs, and compatibility with LTE, LTE-M, NB-IoT, 3G, and 2G networks (network availability depends on region and carrier). Designed for high-reliability embedded applications, it operates from 1.6 V to 5.5 V and is available in an industrial temperature range of −40°C to +105°C for rugged IoT deployments.
#Hologram #SIMSTMFF2 #EmbeddedSIM #eSIM #MFF2 #IoTSIM #CellularIoT #LTEM #NBIoT #AssetTracking #IndustrialIoT #EmbeddedSystems

Properties

SIM-ST-MFF2

Hologram, Inc.

Integrated Circuit

mm.digikey.com/Volume0/opasdata/d220001/medias/docus/778/SIM_DS_170107_v2.pdf

U

parametric-v1

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