SIM-ST-MFF2 Audit

adrian95

adrian95

flux

Audit the current SIM-ST-MFF2 part project completely. Inspect all available part information including MPN, manufacturer, package, pin/pad count, description, and all properties. Check whether the Datasheet property is populated; if absent or invalid, find the official manufacturer datasheet on the web and update the part's Datasheet property to the direct official URL. Read the authoritative datasheet and cross-check: (1) schematic symbol pin numbers/names/functions/types and pin descriptions, (2) footprint pad count, numbering, positions, dimensions, pitch, outline/orientation/markings, and package match, and (3) metadata/description/properties. Extract a concise list of key specifications. Make only the requested Datasheet-property mutation; do not alter symbol or footprint even if mismatches are found. Report exact evidence, all mismatches or ambiguities, and whether the part is safe to use as-is. Done criteria: full metadata inventory, official datasheet URL set if needed, complete 9-pad pin/pad mapping review, footprint/package comparison, and clear mismatch list.
Created a project doc

SIM-ST-MFF2 Part Audit

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Audit date: 2026-07-27 Project: SIM-ST-MFF2

flux

Audit completed and documented in SIM-ST-MFF2 Part Audit. The part is not production-safe as-is due to an undocumented ninth EPAD, unspecified pin types/descriptions, and an unverifiable land/stencil pattern; the populated, readable Datasheet property was left unchanged because no exact official Hologram-hosted URL exists for this discontinued MPN.
Fix metadata issues
Remove EPAD ambiguity
Find exact footprint
Update datasheet source
Review corrected part
NC
Pin Number
4
VCC
Pin Number
8
CLK
Pin Number
6
I/O
Pin Number
3
RST
Pin Number
7
NC
Pin Number
5
GND
Pin Number
1
NC
Pin Number
2
EPAD
Pin Number
9

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SIM-ST-MFF2 Part Audit
Audit date: 2026-07-27
Project: SIM-ST-MFF2
Part UID: 526c2ed4-0833-4ab7-a12c-791c59b3ad5d
Verdict
Not safe to use as-is for a new production design without resolving the exposed-pad and land-pattern ambiguity. The eight functional contacts match the available legacy SIM datasheet and the footprint body/pad arrangement is mechanically plausible for MFF2/QFN8. However, the symbol and footprint add a ninth EPAD terminal that is not defined by the authoritative eight-pin table, all symbol electrical types and pin descriptions are unset, and the legacy datasheet does not provide a dimensioned recommended PCB land pattern with which to validate pad sizes. The exact MPN is also discontinued/legacy.
Metadata inventory

Table

FieldCurrent project valueAudit finding
Project/part nameSIM-ST-MFF2Matches distributor-listed Hologram MPN.
Manufacturer Part NumberSIM-ST-MFF2Exact match to DigiKey legacy listing.
Manufacturer NameHologram, Inc.Matches DigiKey listing.
Part TypeIntegrated CircuitAcceptable broad classification; a more specific eSIM/UICC classification is not present.
Designator PrefixUReasonable for a soldered embedded SIM IC/module.
Symbol Styleparametric-v1Populated.
Datasheet URLhttps://storage.googleapis.com/graviton-electric-symbols/document_assets/user-uploaded/482c48cca496d2df334afc2e235308a781ccc8e956a2b297fde223e15b85fffd.pdfPopulated and readable. It contains the same legacy SIM technical content linked by DigiKey, but the stored URL is a Flux-hosted upload, not a direct Hologram URL. No exact official Hologram-hosted SIM-ST-MFF2 PDF could be located.
DescriptionLong project description describing Hologram global embedded IoT eSIM, 2G/3G/4G LTE, MFF2, remote provisioning, 1.6–5.5 V, −40 to +105 °CMostly consistent with the industrial-grade option in the legacy datasheet. It overgeneralizes the temperature/voltage as if every unit has industrial-grade Starchip silicon; the same document also describes a Samsung standard-grade option at −25 to +85 °C and nominal 1.6/3/5 V.
Published statePublished partConfirmed.
Terminal count9Eight functional perimeter contacts plus project-defined center EPAD.
Footprint pad count9Eight perimeter pads plus one large center pad.
Package/formatFootprint asset SIM-ST-MFF2.kicad_mod; value text SIM-ST-MFF2_HOL; 3D model SIM-ST-MFF2_HOL.stepIntended MFF2/QFN8 embedded package.
No BOM instance metadata exists because this is a part project. Project summary reports 9 terminal components, 0 nets, and 13 PCB layout nodes.
Datasheet evidence and URL decision
Exact legacy-part evidence
DigiKey identifies:
  • Manufacturer: Hologram, Inc.
  • MPN: SIM-ST-MFF2
  • Description: GLOBAL IOT EMBEDDED SIM CHIP
  • Detailed type: 2G, 3G, 4G LTE IoT eSIM (MFF2)
  • Size: 5 mm × 6 mm × 0.82 mm
  • Packaging: tape and reel
  • Status: discontinued
  • Datasheet target: https://mm.digikey.com/Volume0/opasdata/d220001/medias/docus/778/SIM_DS_170107_v2.pdf
The current Flux Datasheet property resolves to readable legacy SIM technical data with the same pinout, MFF2/QFN8 format, silicon options, and operating ranges. It is therefore not absent or broken.
Hologram's official datasheet hub is:
https://docs.hologram.io/guides/sims/hologram-iot-sim-datasheets
The hub no longer lists an exact SIM-ST-MFF2 PDF. Its official legacy G1 embedded PDF is:
https://cdn1.hologram.io/docs/datasheets/2024_Global_G1_Embedded_SIM_Datasheet.pdf
That document applies to newer/different part numbers (G1-DFN8; past numbers GL1-MMF2 [as printed/extracted] and SIM-E-MFF2-GL), not explicitly to SIM-ST-MFF2, and specifies different silicon/temperature details. Substituting it as the Datasheet property would incorrectly claim exact applicability.
Datasheet mutation result: unattempted/not required. The existing property is populated and readable, while no exact direct official Hologram URL for this discontinued MPN was found. The property was deliberately left unchanged rather than replacing it with a non-exact official document.
Authoritative key specifications
From the legacy SIM datasheet linked for the exact MPN:
  • Embedded form factor: MFF2 (QFN8)
  • Standard: ETSI TS 102.671 standardized format
  • Nominal body: 6 × 5 mm
  • Height: 0.75–0.82 mm
  • Mounting: soldered to PCB; tray/reel/box transportation
  • Networks/applications: 2G/3G/4G/LTE, SIM/USIM/ISIM/HPSIM, Release 8 content, OTA remote file/applet management
  • Industrial option: Starchip SCM392G, 1.6–5.5 V, −40 to +105 °C, 136K/256K memory, minimum 200 million read/write cycles, 25-year retention, JESD22-B103 vibration
  • Standard option: Samsung S3FS9FG, 1.6 V / 3 V / 5 V, −25 to +85 °C, 340K/440K memory, minimum 500K read/write cycles, 25-year retention
  • Pinout: 1 GND, 2 NC, 3 I/O, 4 NC, 5 NC, 6 CLK, 7 RST, 8 VCC
The datasheet does not provide a conventional absolute-maximum table or a dimensioned recommended PCB land pattern in extractable content.
Complete symbol pin review

Table

PinCurrent nameDatasheet functionExpected electrical typeCurrent electrical typeCurrent descriptionResult
1GNDGroundGround / power returnUnspecifiedBlankNumber/name correct; type and description missing.
2NCNo connectNot ConnectedUnspecifiedBlankNumber/name correct; type and description missing.
3I/OBidirectional SIM dataBi-Directional / DigitalUnspecifiedBlankNumber/name correct; type and description missing.
4NCNo connectNot ConnectedUnspecifiedBlankNumber/name correct; type and description missing.
5NCNo connectNot ConnectedUnspecifiedBlankNumber/name correct; type and description missing.
6CLKClock input from hostInput / DigitalUnspecifiedBlankNumber/name correct; type and description missing.
7RSTReset input from hostInput / DigitalUnspecifiedBlankNumber/name correct; type and description missing.
8VCCSIM supply inputPower InUnspecifiedBlankNumber/name correct; type and description missing.
9EPADNot present in the datasheet's eight-pin tableAmbiguous; must be vendor-defined before connectionUnspecifiedBlankUndocumented extra terminal.
All nine symbol pins also have blank Section, Pin Group, orientation metadata, and terminal order. The rendered positions place pins 1–4 on the left and 5–9 on the right; this is legible but does not itself establish package orientation.
Complete footprint pad mapping
Raw footprint source (SIM-ST-MFF2.kicad_mod) is used below because it preserves exact units and numbering.

Table

PadMapped terminalCenter position (mm)Copper size (mm)Datasheet mappingResult
1GND(−2.545202, −1.905)0.6096 × 0.4064Pin 1 GNDCorrect mapping.
2NC(−2.545202, −0.635)0.6096 × 0.4064Pin 2 NCCorrect mapping.
3I/O(−2.545202, +0.635)0.6096 × 0.4064Pin 3 I/OCorrect mapping.
4NC(−2.545202, +1.905)0.6096 × 0.4064Pin 4 NCCorrect mapping.
5NC(+2.545202, +1.905)0.6096 × 0.4064Pin 5 NCCorrect mapping.
6CLK(+2.545202, +0.635)0.6096 × 0.4064Pin 6 CLKCorrect mapping.
7RST(+2.545202, −0.635)0.6096 × 0.4064Pin 7 RSTCorrect mapping.
8VCC(+2.545202, −1.905)0.6096 × 0.4064Pin 8 VCCCorrect mapping.
9EPAD(0, 0)3.6068 × 3.7084Not documented in eight-pin tableAmbiguous extra pad.
Geometry derived from footprint
  • Vertical pitch within each row: 1.27 mm
  • Horizontal center-to-center row spacing: 5.090404 mm
  • Perimeter pad dimensions: 0.6096 × 0.4064 mm
  • Center pad dimensions: 3.6068 × 3.7084 mm
  • Fabrication body outline: from ±2.9972 mm in X and ±2.5019 mm in Y = 5.9944 × 5.0038 mm
  • Courtyard: approximately 6.5024 × 5.5118 mm
  • Silkscreen pin-1 marker: circle left of pad 1 at approximately (−3.5866, −1.905)
  • Fabrication orientation mark: semicircular notch centered on the lower body edge
  • All pads include F.Cu, F.Paste, and F.Mask
Package comparison
  • Body match: footprint fab body 5.9944 × 5.0038 mm, effectively matching the datasheet's nominal 6 × 5 mm MFF2 body.
  • Orientation/numbering match: perimeter numbering follows the datasheet diagram: 1→4 down/up one side and 5→8 back along the opposite side, with pin 1 opposite pin 8.
  • Pitch: footprint uses 1.27 mm vertical pitch. The available exact-MPN datasheet extraction does not provide a dimensioned pitch value, so this is plausible but not authoritatively verified from that document.
  • Pad dimensions/land pattern: the datasheet does not provide an extractable recommended land pattern or pad-size tolerances. The 0.6096 × 0.4064 mm lands and 3.6068 × 3.7084 mm center land cannot be certified against manufacturer recommendations.
  • Center pad: the datasheet calls the package QFN8 and lists only pins 1–8. It does not state whether a center metal area exists, is electrically isolated, should float, or should connect to GND. Modeling it as terminal/pad 9 EPAD is therefore not verified.
  • Paste: the large center pad has a single full-area paste aperture. Without a manufacturer stencil recommendation, voiding, float, and solder-volume behavior are unverified.
  • Markings: pin-1 marker exists. Value text is disabled; reference text is active above the package. The footprint includes hidden/comment-only imported dimension labels and an Accelerated Designs copyright note.
Note: Flux's computed pad readout displayed positions/sizes scaled by 0.001 relative to the imported KiCad payload. The raw footprint payload clearly states millimetre values and is the authoritative geometry source for this audit.
Mismatches and ambiguities
  1. Undocumented ninth terminal/pad: symbol and footprint contain EPAD pin/pad 9; the datasheet defines only eight pins and gives no electrical instruction for a center pad.
  2. Electrical types missing: all symbol pins are Unspecified, including NC, GND, VCC, CLK, RST, and I/O.
  3. Pin descriptions missing: all nine terminal descriptions are blank.
  4. Terminal organization metadata missing: Section, Pin Group, orientation, and order are blank for every pin.
  5. Land pattern not authoritatively verifiable: no dimensioned manufacturer PCB footprint was found for the exact legacy MPN.
  6. Center-paste design unverified: full paste on the large EPAD may or may not meet the package vendor's stencil guidance.
  7. Description overstates one silicon grade: 1.6–5.5 V and −40 to +105 °C apply to the Starchip industrial option, while the same legacy document also lists a Samsung standard-grade option.
  8. Lifecycle risk: DigiKey lists the exact MPN as discontinued; Hologram's current official datasheet hub does not list it as a current product.
  9. Datasheet provenance ambiguity: existing PDF is readable and relevant but stored at a Flux upload URL and lacks clearly extractable Hologram branding/MPN/revision text. The distributor link identifies it as SIM_DS_170107_v2.pdf; no exact official Hologram-hosted URL was found.
  10. No conventional absolute-maximum ratings table found: do not infer 5.5 V is an absolute maximum rather than an operating limit beyond the wording available.
Safety/use recommendation
  • For schematic evaluation/prototyping: the eight standard ISO/ETSI SIM contacts appear mapped correctly.
  • For PCB fabrication or production: do not release as-is until Hologram or the actual module/package vendor confirms the exact legacy land pattern, center-pad construction/connection, and stencil design. Also confirm whether sourced inventory is the industrial or standard silicon option.
  • Because the user prohibited symbol/footprint changes, no identified mismatch was corrected.
Scope status
  • Completed: full metadata/property inventory.
  • Completed: Datasheet property presence/readability check and official-manufacturer search.
  • Completed: complete 9-terminal symbol and 9-pad footprint mapping review.
  • Completed: footprint body, pad positions, dimensions, pitch, orientation, markings, and package comparison.
  • Completed: concise key-specification extraction.
  • Completed: mismatch/ambiguity list and use-safety verdict.
  • Unattempted (by design): Datasheet-property mutation, because the existing URL is populated/readable and no exact official direct Hologram URL for SIM-ST-MFF2 was found.
  • Unattempted (prohibited): symbol or footprint corrections.
Evidence URLs

  • Verdict

  • Metadata inventory

  • Datasheet evidence and URL decision

  • Exact legacy-part evidence

  • Official-manufacturer search

  • Authoritative key specifications

  • Complete symbol pin review

  • Complete footprint pad mapping

  • Geometry derived from footprint

  • Package comparison

  • Mismatches and ambiguities

  • Safety/use recommendation

  • Scope status

  • Evidence URLs

Documents

Assets

kicad_mod

SIM-ST-MFF2

SIM-ST-MFF2.kicad_modFootprint
SIM-ST-MFF2

SIM-ST-MFF2

SIM-ST-MFF2 Symbol.svgDefault
step

SIM-ST-MFF2

SIM-ST-MFF2_HOL.step3D Model
SIM-ST-MFF2-thumb.png

SIM-ST-MFF2-thumb.png

SIM-ST-MFF2-thumbThumbnail

SIM-ST-MFF2

SIM-ST-MFF2 thumbnail
Global Embedded IoT eSIM (MFF2) – Embedded MFF2 eSIM for IoT devices, asset tracking, telematics, smart meters, industrial automation, connected products, and embedded cellular applications. Supports global 2G, 3G, and 4G LTE IoT connectivity through the Hologram cellular network, providing secure machine-to-machine (M2M) communication without the need for a removable SIM card. Features a compact MFF2 (5 × 6 × 0.82 mm) solder-down form factor, remote provisioning and activation, global roaming support, developer-friendly APIs, and compatibility with LTE, LTE-M, NB-IoT, 3G, and 2G networks (network availability depends on region and carrier). Designed for high-reliability embedded applications, it operates from 1.6 V to 5.5 V and is available in an industrial temperature range of −40°C to +105°C for rugged IoT deployments.
#Hologram #SIMSTMFF2 #EmbeddedSIM #eSIM #MFF2 #IoTSIM #CellularIoT #LTEM #NBIoT #AssetTracking #IndustrialIoT #EmbeddedSystems

Properties

SIM-ST-MFF2

Hologram, Inc.

Integrated Circuit

mm.digikey.com/Volume0/opasdata/d220001/medias/docus/778/SIM_DS_170107_v2.pdf

U

parametric-v1

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