Part Audit Review
Thought for 49 sec
I’ll audit the part metadata, source the official datasheet if needed, update the Datasheet property, and cross-check the symbol, footprint, and pin descriptions. I’ll then verify the result and report key specifications plus any discrepancies.
Worked for 45 sec
The audit is underway. I’m checking the nine-pad mapping and package geometry against the manufacturer’s documentation, with changes limited to the Datasheet property.
Worked for 7 mins 54 sec
Audit complete; full findings are in SIM-ST-MFF2 Part Audit.
- Existing Datasheet property was retained because no exact official Hologram-hosted datasheet URL was available for this discontinued MPN.
- The eight documented pins match the expected SIM interface naming, but all pin types/descriptions are unspecified.
- The ninth exposed pad is undocumented, and the footprint/thermal-pad/stencil geometry could not be verified against authoritative manufacturer data.
- Conclusion: the part is not production-safe as-is; confirm the EPAD connection and obtain an authoritative MFF2 land/stencil pattern before fabrication.
Fix metadata and verify
Resolve EPAD details
Update pin metadata
Check manufacturability
Refine this doc
Ask about this doc
SIM-ST-MFF2 Part Audit
Audit date: 2026-07-27
Project: SIM-ST-MFF2
Part UID:
Project: SIM-ST-MFF2
Part UID:
526c2ed4-0833-4ab7-a12c-791c59b3ad5dVerdict
Not safe to use as-is for a new production design without resolving the exposed-pad and land-pattern ambiguity. The eight functional contacts match the available legacy SIM datasheet and the footprint body/pad arrangement is mechanically plausible for MFF2/QFN8. However, the symbol and footprint add a ninth
EPAD terminal that is not defined by the authoritative eight-pin table, all symbol electrical types and pin descriptions are unset, and the legacy datasheet does not provide a dimensioned recommended PCB land pattern with which to validate pad sizes. The exact MPN is also discontinued/legacy.Metadata inventory
Table
| Field | Current project value | Audit finding |
|---|---|---|
| Project/part name | SIM-ST-MFF2 | Matches distributor-listed Hologram MPN. |
| Manufacturer Part Number | SIM-ST-MFF2 | Exact match to DigiKey legacy listing. |
| Manufacturer Name | Hologram, Inc. | Matches DigiKey listing. |
| Part Type | Integrated Circuit | Acceptable broad classification; a more specific eSIM/UICC classification is not present. |
| Designator Prefix | U | Reasonable for a soldered embedded SIM IC/module. |
| Symbol Style | parametric-v1 | Populated. |
| Datasheet URL | https://storage.googleapis.com/graviton-electric-symbols/document_assets/user-uploaded/482c48cca496d2df334afc2e235308a781ccc8e956a2b297fde223e15b85fffd.pdf | Populated and readable. It contains the same legacy SIM technical content linked by DigiKey, but the stored URL is a Flux-hosted upload, not a direct Hologram URL. No exact official Hologram-hosted SIM-ST-MFF2 PDF could be located. |
| Description | Long project description describing Hologram global embedded IoT eSIM, 2G/3G/4G LTE, MFF2, remote provisioning, 1.6–5.5 V, −40 to +105 °C | Mostly consistent with the industrial-grade option in the legacy datasheet. It overgeneralizes the temperature/voltage as if every unit has industrial-grade Starchip silicon; the same document also describes a Samsung standard-grade option at −25 to +85 °C and nominal 1.6/3/5 V. |
| Published state | Published part | Confirmed. |
| Terminal count | 9 | Eight functional perimeter contacts plus project-defined center EPAD. |
| Footprint pad count | 9 | Eight perimeter pads plus one large center pad. |
| Package/format | Footprint asset SIM-ST-MFF2.kicad_mod; value text SIM-ST-MFF2_HOL; 3D model SIM-ST-MFF2_HOL.step | Intended MFF2/QFN8 embedded package. |
No BOM instance metadata exists because this is a part project. Project summary reports 9 terminal components, 0 nets, and 13 PCB layout nodes.
Datasheet evidence and URL decision
Exact legacy-part evidence
DigiKey identifies:
- Manufacturer: Hologram, Inc.
- MPN: SIM-ST-MFF2
- Description: GLOBAL IOT EMBEDDED SIM CHIP
- Detailed type: 2G, 3G, 4G LTE IoT eSIM (MFF2)
- Size: 5 mm × 6 mm × 0.82 mm
- Packaging: tape and reel
- Status: discontinued
- Datasheet target:
https://mm.digikey.com/Volume0/opasdata/d220001/medias/docus/778/SIM_DS_170107_v2.pdf
The current Flux Datasheet property resolves to readable legacy SIM technical data with the same pinout, MFF2/QFN8 format, silicon options, and operating ranges. It is therefore not absent or broken.
Official-manufacturer search
Hologram's official datasheet hub is:
https://docs.hologram.io/guides/sims/hologram-iot-sim-datasheetsThe hub no longer lists an exact
SIM-ST-MFF2 PDF. Its official legacy G1 embedded PDF is:https://cdn1.hologram.io/docs/datasheets/2024_Global_G1_Embedded_SIM_Datasheet.pdfThat document applies to newer/different part numbers (
G1-DFN8; past numbers GL1-MMF2 [as printed/extracted] and SIM-E-MFF2-GL), not explicitly to SIM-ST-MFF2, and specifies different silicon/temperature details. Substituting it as the Datasheet property would incorrectly claim exact applicability.Datasheet mutation result: unattempted/not required. The existing property is populated and readable, while no exact direct official Hologram URL for this discontinued MPN was found. The property was deliberately left unchanged rather than replacing it with a non-exact official document.
Authoritative key specifications
From the legacy SIM datasheet linked for the exact MPN:
- Embedded form factor: MFF2 (QFN8)
- Standard: ETSI TS 102.671 standardized format
- Nominal body: 6 × 5 mm
- Height: 0.75–0.82 mm
- Mounting: soldered to PCB; tray/reel/box transportation
- Networks/applications: 2G/3G/4G/LTE, SIM/USIM/ISIM/HPSIM, Release 8 content, OTA remote file/applet management
- Industrial option: Starchip
SCM392G, 1.6–5.5 V, −40 to +105 °C, 136K/256K memory, minimum 200 million read/write cycles, 25-year retention, JESD22-B103 vibration - Standard option: Samsung
S3FS9FG, 1.6 V / 3 V / 5 V, −25 to +85 °C, 340K/440K memory, minimum 500K read/write cycles, 25-year retention - Pinout: 1 GND, 2 NC, 3 I/O, 4 NC, 5 NC, 6 CLK, 7 RST, 8 VCC
The datasheet does not provide a conventional absolute-maximum table or a dimensioned recommended PCB land pattern in extractable content.
Complete symbol pin review
Table
| Pin | Current name | Datasheet function | Expected electrical type | Current electrical type | Current description | Result |
|---|---|---|---|---|---|---|
| 1 | GND | Ground | Ground / power return | Unspecified | Blank | Number/name correct; type and description missing. |
| 2 | NC | No connect | Not Connected | Unspecified | Blank | Number/name correct; type and description missing. |
| 3 | I/O | Bidirectional SIM data | Bi-Directional / Digital | Unspecified | Blank | Number/name correct; type and description missing. |
| 4 | NC | No connect | Not Connected | Unspecified | Blank | Number/name correct; type and description missing. |
| 5 | NC | No connect | Not Connected | Unspecified | Blank | Number/name correct; type and description missing. |
| 6 | CLK | Clock input from host | Input / Digital | Unspecified | Blank | Number/name correct; type and description missing. |
| 7 | RST | Reset input from host | Input / Digital | Unspecified | Blank | Number/name correct; type and description missing. |
| 8 | VCC | SIM supply input | Power In | Unspecified | Blank | Number/name correct; type and description missing. |
| 9 | EPAD | Not present in the datasheet's eight-pin table | Ambiguous; must be vendor-defined before connection | Unspecified | Blank | Undocumented extra terminal. |
All nine symbol pins also have blank Section, Pin Group, orientation metadata, and terminal order. The rendered positions place pins 1–4 on the left and 5–9 on the right; this is legible but does not itself establish package orientation.
Complete footprint pad mapping
Raw footprint source (
SIM-ST-MFF2.kicad_mod) is used below because it preserves exact units and numbering.Table
| Pad | Mapped terminal | Center position (mm) | Copper size (mm) | Datasheet mapping | Result |
|---|---|---|---|---|---|
| 1 | GND | (−2.545202, −1.905) | 0.6096 × 0.4064 | Pin 1 GND | Correct mapping. |
| 2 | NC | (−2.545202, −0.635) | 0.6096 × 0.4064 | Pin 2 NC | Correct mapping. |
| 3 | I/O | (−2.545202, +0.635) | 0.6096 × 0.4064 | Pin 3 I/O | Correct mapping. |
| 4 | NC | (−2.545202, +1.905) | 0.6096 × 0.4064 | Pin 4 NC | Correct mapping. |
| 5 | NC | (+2.545202, +1.905) | 0.6096 × 0.4064 | Pin 5 NC | Correct mapping. |
| 6 | CLK | (+2.545202, +0.635) | 0.6096 × 0.4064 | Pin 6 CLK | Correct mapping. |
| 7 | RST | (+2.545202, −0.635) | 0.6096 × 0.4064 | Pin 7 RST | Correct mapping. |
| 8 | VCC | (+2.545202, −1.905) | 0.6096 × 0.4064 | Pin 8 VCC | Correct mapping. |
| 9 | EPAD | (0, 0) | 3.6068 × 3.7084 | Not documented in eight-pin table | Ambiguous extra pad. |
Geometry derived from footprint
- Vertical pitch within each row: 1.27 mm
- Horizontal center-to-center row spacing: 5.090404 mm
- Perimeter pad dimensions: 0.6096 × 0.4064 mm
- Center pad dimensions: 3.6068 × 3.7084 mm
- Fabrication body outline: from ±2.9972 mm in X and ±2.5019 mm in Y = 5.9944 × 5.0038 mm
- Courtyard: approximately 6.5024 × 5.5118 mm
- Silkscreen pin-1 marker: circle left of pad 1 at approximately (−3.5866, −1.905)
- Fabrication orientation mark: semicircular notch centered on the lower body edge
- All pads include F.Cu, F.Paste, and F.Mask
Package comparison
- Body match: footprint fab body 5.9944 × 5.0038 mm, effectively matching the datasheet's nominal 6 × 5 mm MFF2 body.
- Orientation/numbering match: perimeter numbering follows the datasheet diagram: 1→4 down/up one side and 5→8 back along the opposite side, with pin 1 opposite pin 8.
- Pitch: footprint uses 1.27 mm vertical pitch. The available exact-MPN datasheet extraction does not provide a dimensioned pitch value, so this is plausible but not authoritatively verified from that document.
- Pad dimensions/land pattern: the datasheet does not provide an extractable recommended land pattern or pad-size tolerances. The 0.6096 × 0.4064 mm lands and 3.6068 × 3.7084 mm center land cannot be certified against manufacturer recommendations.
- Center pad: the datasheet calls the package QFN8 and lists only pins 1–8. It does not state whether a center metal area exists, is electrically isolated, should float, or should connect to GND. Modeling it as terminal/pad 9
EPADis therefore not verified. - Paste: the large center pad has a single full-area paste aperture. Without a manufacturer stencil recommendation, voiding, float, and solder-volume behavior are unverified.
- Markings: pin-1 marker exists. Value text is disabled; reference text is active above the package. The footprint includes hidden/comment-only imported dimension labels and an Accelerated Designs copyright note.
Note: Flux's computed pad readout displayed positions/sizes scaled by 0.001 relative to the imported KiCad payload. The raw footprint payload clearly states millimetre values and is the authoritative geometry source for this audit.
Mismatches and ambiguities
- Undocumented ninth terminal/pad: symbol and footprint contain
EPADpin/pad 9; the datasheet defines only eight pins and gives no electrical instruction for a center pad. - Electrical types missing: all symbol pins are
Unspecified, including NC, GND, VCC, CLK, RST, and I/O. - Pin descriptions missing: all nine terminal descriptions are blank.
- Terminal organization metadata missing: Section, Pin Group, orientation, and order are blank for every pin.
- Land pattern not authoritatively verifiable: no dimensioned manufacturer PCB footprint was found for the exact legacy MPN.
- Center-paste design unverified: full paste on the large EPAD may or may not meet the package vendor's stencil guidance.
- Description overstates one silicon grade: 1.6–5.5 V and −40 to +105 °C apply to the Starchip industrial option, while the same legacy document also lists a Samsung standard-grade option.
- Lifecycle risk: DigiKey lists the exact MPN as discontinued; Hologram's current official datasheet hub does not list it as a current product.
- Datasheet provenance ambiguity: existing PDF is readable and relevant but stored at a Flux upload URL and lacks clearly extractable Hologram branding/MPN/revision text. The distributor link identifies it as
SIM_DS_170107_v2.pdf; no exact official Hologram-hosted URL was found. - No conventional absolute-maximum ratings table found: do not infer 5.5 V is an absolute maximum rather than an operating limit beyond the wording available.
Safety/use recommendation
- For schematic evaluation/prototyping: the eight standard ISO/ETSI SIM contacts appear mapped correctly.
- For PCB fabrication or production: do not release as-is until Hologram or the actual module/package vendor confirms the exact legacy land pattern, center-pad construction/connection, and stencil design. Also confirm whether sourced inventory is the industrial or standard silicon option.
- Because the user prohibited symbol/footprint changes, no identified mismatch was corrected.
Scope status
- Completed: full metadata/property inventory.
- Completed: Datasheet property presence/readability check and official-manufacturer search.
- Completed: complete 9-terminal symbol and 9-pad footprint mapping review.
- Completed: footprint body, pad positions, dimensions, pitch, orientation, markings, and package comparison.
- Completed: concise key-specification extraction.
- Completed: mismatch/ambiguity list and use-safety verdict.
- Unattempted (by design): Datasheet-property mutation, because the existing URL is populated/readable and no exact official direct Hologram URL for
SIM-ST-MFF2was found. - Unattempted (prohibited): symbol or footprint corrections.
Evidence URLs
- Hologram official SIM datasheet hub: https://docs.hologram.io/guides/sims/hologram-iot-sim-datasheets
- Exact MPN DigiKey page: https://www.digikey.com/en/products/detail/hologram-inc/SIM-ST-MFF2/9489898
- Exact MPN distributor-linked legacy PDF: https://mm.digikey.com/Volume0/opasdata/d220001/medias/docus/778/SIM_DS_170107_v2.pdf
- Hologram official newer legacy-G1 embedded PDF (not exact MPN): https://cdn1.hologram.io/docs/datasheets/2024_Global_G1_Embedded_SIM_Datasheet.pdf
Verdict
Metadata inventory
Datasheet evidence and URL decision
Exact legacy-part evidence
Official-manufacturer search
Authoritative key specifications
Complete symbol pin review
Complete footprint pad mapping
Geometry derived from footprint
Package comparison
Mismatches and ambiguities
Safety/use recommendation
Scope status
Evidence URLs
