RK3568 Part Review and Datasheet Update
Thought for 8 sec
I’ll continue applying exact metadata batches for the remaining interface pins, then update the CSV status and run the final missing-property review.
Worked for 18 mins 59 sec
The review surfaced a final set of remaining GPIO/audio/SDMMC/GMAC mux pins still unspecified; I’m applying those exact batches now.
Worked for 9 mins 18 sec
Completed the remaining interface metadata batches and updated RK3568 Pin Metadata CSV.
Accomplished:
- Applied metadata for LCDC/VOP, CIF/EBC/camera, HDMI, MIPI CSI/DSI, eDP, USB, PCIe/SATA/QSGMII, Multi-PHY, SDMMC/GMAC/UART/CAN/I2S/PDM/ACODEC/TSADC/PMIC/PWM/JTAG/GPIO mux groups.
- Final semantic missing Pin Type search returned:
none found. - Component review returned no ERROR/WARNING results for missing/terminal pin properties.
Open items:
- None for Pin Type coverage found in the final review.
- Some descriptions are category-level rather than unique per alternate function, due to the RK3568’s highly multiplexed pin naming.
Verify names and footprint
Audit pin names
Normalize terminal names
Verify footprint mapping
Publish readiness review
Refine this doc
Ask about this doc
RK3568 Part Review
Date: 2026-07-06
Project: RK3568
Part UID: 111e7434-7f63-4f64-9fe8-9ab643a6378e
Reviewed part metadata
Table
| Field | Current / reviewed value | Datasheet cross-check |
|---|---|---|
| Manufacturer Part Number | RK3568 | Matches Rockchip RK3568 datasheet. |
| Manufacturer | Rockchip | Matches datasheet publisher: Rockchip Electronics Co., Ltd. |
| Description | Own stock | Too sparse for a reusable part; recommend replacing with a functional description. |
| Designator prefix | IC | Appropriate for application processor IC. |
| Datasheet URL | Updated from Mega link to official-domain Rockchip PDF: https://opensource.rock-chips.com/images/b/b6/Rockchip_RK3568_Datasheet_V1.3-20220929P.PDF | Official Rockchip open-source domain, Rev 1.3 dated 2022-09-29. A newer Rev 2.1 mirror was found on rockchips.net, but the official-domain URL was chosen for metadata. |
| BOM items | 0 | Expected for a part project; no assembled BOM parts. |
| Schematic terminals | 636 Terminal components | Matches FCBGA636L pin count. |
| Footprint asset | BGA636C65P28X28_1902X1902X168.kicad_mod | Naming is consistent with 0.65 mm pitch, 28 x 28 nominal ball grid, ~19 mm body, ~1.68 mm max height. |
| PCB pads | 636 pads | Matches FCBGA636L 636-ball package. |
Key datasheet specs extracted
- Device: RK3568 quad-core application processor.
- Package: FCBGA636L.
- Package body: 19.00 mm nominal, 18.90 mm min, 19.15 mm max.
- Ball pitch: 0.65 mm.
- Ball diameter: 0.36 mm nominal, 0.31 mm min, 0.41 mm max.
- Package height A: 1.52 mm nominal, 1.68 mm max.
- CPU: quad-core ARM Cortex-A55.
- GPU: Mali-G52 1-Core-2EE.
- NPU: up to 1 TOPS.
- Memory support: DDR3/DDR3L/DDR4/LPDDR3/LPDDR4/LPDDR4X, eMMC, SD/MMC, SPI flash, NAND.
- Display / video interfaces include HDMI, eDP, MIPI DSI, LVDS, RGB/BT1120/BT656.
- Camera/video input includes MIPI CSI and DVP/VICAP/ISP.
- Representative recommended rails include VDD_CPU 0.8-1.2 V, VDD_LOGIC/PMU_VDD_LOGIC_0V9 0.81-0.99 V, PMUIO1 2.97-3.63 V, GPIO IO rails at 1.8 V or 3.3 V depending bank, and DDR IO rails depending memory type.
- Datasheet ambient operating temperature: 0 to 80 degC.
Cross-check findings
Symbol / terminal model
- Pass: The schematic contains 636 terminals, matching FCBGA636L.
- Pass: Spot checks against datasheet Table 2-1 match the ball-number mapping, including examples:
- VSS_1 -> A1
- DDR4_CS0N/LPDDR4_CS0N_A/DDR3_ODT1/LPDDR3_ODT0/AC25 -> A2
- SARADC_VIN5 -> F22
- MIPI_DSI_TX0_D1N/LVDS_TX0_D1N -> AG16
- HDMI_TX_CLKN -> AG19
- PCIE20_RXP/SATA2_RXP/QSGMII_RXP_M1 -> Y27
- PCIE20_RXN/SATA2_RXN/QSGMII_RXN_M1 -> Y28
- Mismatch / issue: All terminals inspected have
Pin Type: Unspecified. Power pins, grounds, differential pairs, clocks, resets, analog supplies, and GPIOs should be typed/classified for ERC and downstream design reuse. - Mismatch / issue: Pin descriptions are not populated. The datasheet includes Table 2-4 IO function descriptions and Table 2-2/2-3 power/function IO descriptions, but the Flux terminals currently only carry pin number and terminal name.
- Mismatch / issue: Several terminal names appear to contain import/OCR formatting artifacts compared with datasheet naming style, for example double underscores and split tokens such as
DD_R3,GP_IO,MCU_J_TAG,VOP_BT1120_D10, and uppercaseNwhere datasheet usesn. These may not change connectivity, but they reduce searchability and may cause inconsistent signal naming. - Issue: The part is modeled as many Terminal components rather than one conventional IC component with pins. That can work in a part project, but the reusable symbol should still expose clean pin metadata and grouping.
Footprint
- Pass: PCB has 636 pads, matching FCBGA636L.
- Pass: Footprint filename indicates BGA636, 0.65 mm pitch, 28 x 28 grid, ~19.02 mm body, and 1.68 mm height, consistent with the datasheet nominal/max package data.
- Caution: I could not confirm exact pad diameter, solder mask, or paste geometry from the inspected layout output. Datasheet ball diameter is 0.31-0.41 mm, nominal 0.36 mm; the footprint should be checked against the RK3568 hardware design guide or a Rockchip-recommended land pattern if available.
- Caution: Layout summary reports 0 copper layers in this part project view. That may be normal for a footprint-only part project, but it should be verified before publishing/reusing if the footprint editor requires layer definitions.
Recommended fixes
- Populate Pin Type for all 636 pins: Ground for VSS/AVSS/TVSS/DDR_AVSS/etc.; Power In for voltage rails; Input for reset/clock inputs; Bi-Directional or Digital/Signal for GPIO and multiplexed interfaces; Passive/Signal for high-speed differential pins as appropriate.
- Add Pin Description values from datasheet Table 2-4 and power/ground descriptions from Table 2-2/Table 2-3.
- Normalize terminal names to datasheet style where possible: remove unintended split underscores, preserve
_M0/_M1mux suffixes, and use a consistent convention for active-lown/N. - If available, attach or cross-check against the RK3568 Hardware Design Guide / package land-pattern recommendation for exact BGA pad, mask, and paste dimensions.
- Replace the project description
Own stockwith a reusable part description such as:Rockchip RK3568 quad-core Cortex-A55 application processor with GPU/NPU, multimedia interfaces, DDR controller, FCBGA636L package.
Overall status
The part has the correct MPN/manufacturer, official datasheet URL, expected 636-pin count, and a footprint that is broadly consistent with FCBGA636L. The main quality gaps are metadata completeness: missing pin types, missing pin descriptions, and probable formatting artifacts in some pin names. No definitive ball-count or package-family mismatch was found.
Reviewed part metadata
Key datasheet specs extracted
Cross-check findings
Symbol / terminal model
Footprint
Recommended fixes
Overall status
