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NC7WZ07P6X Part Audit
Verdict
The part identity and six-pin electrical mapping match the official onsemi datasheet, and the official datasheet URL is already present. However, the package metadata is incorrect, pin descriptions/types are not populated, the logic-function metadata is incorrect, and the footprint's computed geometry appears scaled 1000x too small despite the embedded KiCad source containing plausible SC-88 dimensions.
Source
Existing Part Information

Table


ItemCurrent valueAssessment
MPNNC7WZ07P6XCorrect
ManufacturerON SemiconductorAcceptable legacy name; current brand is onsemi
Pin count6Correct
MountSurface MountCorrect
Package propertyTOIncorrect
Indexed packageSOTToo generic
Correct packageSC-88, case 419B-02; commonly cross-listed as SC-70-6 / SOT-363Use SC-88 as the manufacturer package
Datasheet URLOfficial onsemi PDF already setCorrect; no update needed
Part typeIntegrated Circuit / LogicCorrect
Logic function metadataANDIncorrect; this is a dual non-inverting buffer with open-drain outputs
DescriptionDual non-inverting open-drain buffer; 1.65-5.5 VFunctionally correct overall
Pinout Cross-Check

Table


PinDatasheet nameDatasheet functionCurrent symbol terminalResult
1A1InputA1Match
2GNDGroundGNDMatch
3A2InputA2Match
4Y2Open-drain outputY2Match
5VCCSupply voltageVCCMatch
6Y1Open-drain outputY1Match
Symbol issues
  • Every terminal has Pin Type: Unspecified; expected types are Input for A1/A2, Ground/Power for GND, Power for VCC, and open-drain Output for Y1/Y2.
  • Human-readable Pin Description fields are absent.
  • The terminal numbering and names are correct.
  • The left-input/right-output symbol organization is electrically sensible.
Footprint Cross-Check
Datasheet package
  • Package: SC-88, case 419B-02
  • Nominal body: 2.00 mm x 1.25 mm
  • Body limits: D = 1.80-2.20 mm; E = 1.15-1.35 mm
  • Pitch: 0.65 mm
  • Lead width: 0.15-0.30 mm
  • Lead length: 0.10-0.30 mm
  • Maximum package height: 0.90 mm (from package title)
Embedded footprint source
The embedded SOT65P210X110-6N.kicad_mod uses:
  • Six rectangular SMD pads
  • 0.65 mm row pitch
  • Pad size 0.40 mm x 1.20 mm
  • Pad row centers at x = +/-0.95 mm
  • Fabrication body outline 1.25 mm x 2.00 mm
  • Pin-1 chamfer/marking
Those source dimensions are plausible for an SC-88 land pattern and the body outline matches the nominal package.
Critical computed-geometry mismatch
Flux's computed pad and shape data reports the same dimensions divided by 1000, for example:
  • Pad center x = +/-0.00095 mm instead of +/-0.95 mm
  • Pad size = 0.0004 mm x 0.0012 mm instead of 0.40 mm x 1.20 mm
  • Fabrication outline approximately 0.00125 mm x 0.002 mm instead of 1.25 mm x 2.00 mm
If the computed values are what manufacturing/export uses, the footprint is unusable. This appears to be a footprint import/unit-scaling defect and requires correction or confirmation in the PCB editor/export pipeline before use.
The datasheet package outline does not provide a recommended solder land pattern, so pad dimensions cannot be declared an exact manufacturer-land-pattern match from this datasheet alone. They are geometrically plausible for SC-88.
Key Electrical Specifications
  • Function: two independent non-inverting buffers, open-drain outputs
  • Logic behavior: input LOW drives output LOW; input HIGH releases output to high impedance
  • VCC operating range: 1.65 V to 5.5 V
  • Data retention supply: 1.5 V to 5.5 V
  • Inputs tolerate up to 5.5 V independent of VCC
  • Inputs and outputs are high impedance with VCC = 0 V
  • Output sink capability: 24 mA at VCC = 3.0 V with VOL max 0.55 V; 32 mA at VCC = 4.5 V with VOL max 0.55 V
  • Typical tPZL: 2.9 ns at 3.3 V and 2.3 ns at 5.0 V under datasheet test conditions
  • Typical tPLZ: 2.1 ns at 3.3 V and 1.4 ns at 5.0 V
  • Input leakage: up to +/-1 uA over -40 to +85 C
  • Power-off leakage: up to 10 uA over -40 to +85 C
  • Quiescent supply current: up to 10 uA over -40 to +85 C
  • Absolute maximum VCC, VIN, VOUT: -0.5 V to 6.5 V
  • Absolute maximum DC output current: +/-50 mA
  • Ambient characterization range in DC/AC tables: -40 C to +85 C
  • Top marking: Z07
  • Packing: 3000 units, tape and reel
  • Pb-free, halogen-free/BFR-free, RoHS compliant
Mismatches and Severity
  1. Critical — footprint computed geometry appears 1000x too small. Confirm/fix before PCB use or manufacturing export.
  2. Major — Package or Case Code = TO is wrong. It should identify SC-88 (case 419B-02), commonly SC-70-6/SOT-363.
  3. Major — all symbol pin types are unspecified. This weakens ERC and fails to describe open-drain outputs and power pins.
  4. Moderate — pin descriptions are absent. Populate each pin from the datasheet.
  5. Moderate — logic-function metadata says AND. Correct classification is dual non-inverting buffer with open-drain outputs.
  6. Minor — indexed package value SOT is overly broad. Prefer the exact manufacturer package.
  7. Minor — description says outputs can sink up to 32 mA without immediately tying that figure to 4.5 V VCC. The 3.0 V rated point is 24 mA.
  • Change Package or Case Code from TO to SC-88 (Case 419B-02) or the platform's canonical SC-88 value.
  • Change logic function from AND to Buffer / Non-Inverting Open-Drain Buffer.
  • Set pin types and descriptions according to the pin table above.
  • Investigate and repair the footprint unit scaling; verify actual exported Gerber pad dimensions with a measurement before release.
  • Retain the existing official datasheet URL.
  • Verdict

  • Source

  • Existing Part Information

  • Pinout Cross-Check

  • Symbol issues

  • Footprint Cross-Check

  • Datasheet package

  • Embedded footprint source

  • Critical computed-geometry mismatch

  • Key Electrical Specifications

  • Mismatches and Severity

  • Recommended Corrections