Review all available part information (MPN, package, pin count, description, properties). If no datasheet URL is already set, search the web for the official datasheet and update the part's Datasheet property with the URL. Then cross-check the schematic symbol, footprint, and pin descriptions against the datasheet. Summarize key specs and flag any mismatches.
I’ll audit the part metadata, locate and set the official datasheet if needed, then verify the symbol pins and footprint against it and report any mismatches.
The official onsemi datasheet is already linked, so no URL update is needed. I found metadata and symbol-quality issues and am finishing the package/land-pattern cross-check now.
Audit complete. The datasheet URL was already the official onsemi PDF, and the six-pin mapping is correct; key issues are incorrect package metadata (TO vs SC-88), unspecified pin types/descriptions, incorrect AND-function classification, and a critical apparent 1000× footprint scaling error. I filed an internal part-quality report and documented full specs and findings in NC7WZ07P6X Part Audit.
The part identity and six-pin electrical mapping match the official onsemi datasheet, and the official datasheet URL is already present. However, the package metadata is incorrect, pin descriptions/types are not populated, the logic-function metadata is incorrect, and the footprint's computed geometry appears scaled 1000x too small despite the embedded KiCad source containing plausible SC-88 dimensions.
Source
Manufacturer: onsemi (property currently says ON Semiconductor; acceptable legacy naming)
SC-88, case 419B-02; commonly cross-listed as SC-70-6 / SOT-363
Use SC-88 as the manufacturer package
Datasheet URL
Official onsemi PDF already set
Correct; no update needed
Part type
Integrated Circuit / Logic
Correct
Logic function metadata
AND
Incorrect; this is a dual non-inverting buffer with open-drain outputs
Description
Dual non-inverting open-drain buffer; 1.65-5.5 V
Functionally correct overall
Pinout Cross-Check
Table
Pin
Datasheet name
Datasheet function
Current symbol terminal
Result
1
A1
Input
A1
Match
2
GND
Ground
GND
Match
3
A2
Input
A2
Match
4
Y2
Open-drain output
Y2
Match
5
VCC
Supply voltage
VCC
Match
6
Y1
Open-drain output
Y1
Match
Symbol issues
Every terminal has Pin Type: Unspecified; expected types are Input for A1/A2, Ground/Power for GND, Power for VCC, and open-drain Output for Y1/Y2.
Human-readable Pin Description fields are absent.
The terminal numbering and names are correct.
The left-input/right-output symbol organization is electrically sensible.
Footprint Cross-Check
Datasheet package
Package: SC-88, case 419B-02
Nominal body: 2.00 mm x 1.25 mm
Body limits: D = 1.80-2.20 mm; E = 1.15-1.35 mm
Pitch: 0.65 mm
Lead width: 0.15-0.30 mm
Lead length: 0.10-0.30 mm
Maximum package height: 0.90 mm (from package title)
Embedded footprint source
The embedded SOT65P210X110-6N.kicad_mod uses:
Six rectangular SMD pads
0.65 mm row pitch
Pad size 0.40 mm x 1.20 mm
Pad row centers at x = +/-0.95 mm
Fabrication body outline 1.25 mm x 2.00 mm
Pin-1 chamfer/marking
Those source dimensions are plausible for an SC-88 land pattern and the body outline matches the nominal package.
Critical computed-geometry mismatch
Flux's computed pad and shape data reports the same dimensions divided by 1000, for example:
Pad center x = +/-0.00095 mm instead of +/-0.95 mm
Pad size = 0.0004 mm x 0.0012 mm instead of 0.40 mm x 1.20 mm
Fabrication outline approximately 0.00125 mm x 0.002 mm instead of 1.25 mm x 2.00 mm
If the computed values are what manufacturing/export uses, the footprint is unusable. This appears to be a footprint import/unit-scaling defect and requires correction or confirmation in the PCB editor/export pipeline before use.
The datasheet package outline does not provide a recommended solder land pattern, so pad dimensions cannot be declared an exact manufacturer-land-pattern match from this datasheet alone. They are geometrically plausible for SC-88.
Key Electrical Specifications
Function: two independent non-inverting buffers, open-drain outputs
Logic behavior: input LOW drives output LOW; input HIGH releases output to high impedance
VCC operating range: 1.65 V to 5.5 V
Data retention supply: 1.5 V to 5.5 V
Inputs tolerate up to 5.5 V independent of VCC
Inputs and outputs are high impedance with VCC = 0 V
Output sink capability: 24 mA at VCC = 3.0 V with VOL max 0.55 V; 32 mA at VCC = 4.5 V with VOL max 0.55 V
Typical tPZL: 2.9 ns at 3.3 V and 2.3 ns at 5.0 V under datasheet test conditions
Typical tPLZ: 2.1 ns at 3.3 V and 1.4 ns at 5.0 V
Input leakage: up to +/-1 uA over -40 to +85 C
Power-off leakage: up to 10 uA over -40 to +85 C
Quiescent supply current: up to 10 uA over -40 to +85 C
Absolute maximum VCC, VIN, VOUT: -0.5 V to 6.5 V
Absolute maximum DC output current: +/-50 mA
Ambient characterization range in DC/AC tables: -40 C to +85 C
Top marking: Z07
Packing: 3000 units, tape and reel
Pb-free, halogen-free/BFR-free, RoHS compliant
Mismatches and Severity
Critical — footprint computed geometry appears 1000x too small. Confirm/fix before PCB use or manufacturing export.
Major — Package or Case Code = TO is wrong. It should identify SC-88 (case 419B-02), commonly SC-70-6/SOT-363.
Major — all symbol pin types are unspecified. This weakens ERC and fails to describe open-drain outputs and power pins.
Moderate — pin descriptions are absent. Populate each pin from the datasheet.
Moderate — logic-function metadata says AND. Correct classification is dual non-inverting buffer with open-drain outputs.
Minor — indexed package value SOT is overly broad. Prefer the exact manufacturer package.
Minor — description says outputs can sink up to 32 mA without immediately tying that figure to 4.5 V VCC. The 3.0 V rated point is 24 mA.
Recommended Corrections
Change Package or Case Code from TO to SC-88 (Case 419B-02) or the platform's canonical SC-88 value.
Change logic function from AND to Buffer / Non-Inverting Open-Drain Buffer.
Set pin types and descriptions according to the pin table above.
Investigate and repair the footprint unit scaling; verify actual exported Gerber pad dimensions with a measurement before release.