MIMX8ML2DVNLZAB Repair

V

vitachrona

flux

Repair this MIMX8ML2DVNLZAB part project so it is safe for use in the Vitachrona main board. Use authoritative NXP i.MX 8M Plus datasheet, package/ball map, hardware design guide, and reference material. Inspect all 548 terminals and assign correct electrical types to every ball: Ground for all VSS/GND domains, Power In for supply inputs, Power Out only for genuine generated/reference outputs, Input/Output/Bi-Directional/Open Collector/Passive as appropriate for reset, boot, clocks, DDR, USB, MIPI, eMMC, GPIO and analog functions. Preserve exact ball numbers, functional names, and one-to-one footprint mapping. Correct malformed/truncated names if present. Organize the schematic into functional sub-symbols (Power/Ground, DDR, USB/MIPI, eMMC, GPIO/peripherals, clocks/boot/debug) without changing physical mappings. Verify the existing 548-pad 15x15 mm 0.5 mm-pitch footprint, package geometry, pad separation, pin-1 orientation and 3D scale. Do not invent pin functions; record any ball whose authoritative type cannot be established. Publish/update the part when complete and report the resulting part UID/version, counts by electrical type, verification evidence, and any blockers. Edit only this active part project.

flux

I’ll audit the 548-ball part against authoritative NXP documentation, then correct the symbol, terminal types, sub-symbol organization, footprint, and 3D model before publishing. I’ll preserve every physical ball mapping and explicitly flag any unverifiable terminal; first I’m checking editability and the current part state.

flux

Blocked by permissions: your access to the active silicon-yard/mimx8ml2dvnlzab part project is view-only, so I could not safely edit or publish it.
  • Current part UID: e1481b81-d5bc-426e-b59e-7859583a95ff
  • 548 terminals and 548 pads are present, but all 548 terminal types are Unspecified
  • Functional sub-symbols are not configured
  • Metadata incorrectly references i.MX 8M Mini / 486-ball / 0.8 mm, conflicting with the FCBGA548 15 × 15 mm, 0.5 mm footprint
  • Existing assets: 548-pad KiCad footprint, STEP model, and SVG symbol
  • I filed an internal part-quality report; no mappings or files were changed
The project owner must grant you edit/publish access, or perform the repair from an authorized account. Once access is updated, I can complete the authoritative ball-by-ball audit and publish the corrected version.
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Pins

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3D View

MIMX8ML2DVNLZAB Part Information and Datasheet Audit
Audit scope
Reviewed the available part metadata, official NXP datasheet content, all 548 schematic terminals, and the corresponding PCB footprint pads.
Part metadata

Table

FieldProject/library valueDatasheet cross-check
Manufacturer part numberMIMX8ML2DVNLZABValid i.MX 8M Plus nomenclature: production, Dual derivative 2, consumer temperature, FCBGA548, 1.8 GHz, standard fusing, silicon rev. B
ManufacturerNXPMatches
DescriptionARM Cortex-A53 Microprocessor IC i.MX8ML 2 Core, 64-Bit 1.8GHz 548-LFBGA (15x15)Substantially correct, but incomplete: derivative 2 also includes VPU and NPU; the package is described by NXP as FCBGA548 rather than LFBGA548
Pin/ball count548Matches
Package propertyLFBGABroad BGA family match, but NXP documentation identifies the package as FCBGA548, 15 x 15 mm, 0.5 mm pitch, package outline SOT2047-1
Datasheet propertyhttps://cache.nxp.com/secured/assets/documents/en/data-sheet/IMX8MPCEC.pdf?...Present, so no update was required. It points to NXP's consumer-products datasheet, document IMX8MPCEC. The stored URL is a signed/cache URL and may expire; a stable official form is https://www.nxp.com/docs/en/data-sheet/IMX8MPCEC.pdf.
Part TypeIntegrated CircuitsAcceptable, but generic
IC subtype metadataLogic / ANDIncorrect classification for an applications processor
Designator prefixICAcceptable
Key specifications
  • Family: NXP i.MX 8M Plus applications processor.
  • Variant: Dual derivative 2: 2 x 64-bit Arm Cortex-A53, VPU, and 2.3 TOPS NPU; ISP and HiFi 4 are not enabled on derivative 2.
  • Cortex-A53 frequency: up to 1.8 GHz for the LZ frequency code.
  • Real-time core: Arm Cortex-M7 up to 800 MHz.
  • Temperature grade: consumer (D), junction range 0 to +95 C.
  • Package: FCBGA548, 15 x 15 mm, 0.5 mm pitch, 29 x 29 nominal ball matrix, NXP outline SOT2047-1.
  • External memory: 32-bit LPDDR4 up to 4000 MT/s or DDR4 up to 3200 MT/s, with inline ECC support.
  • Multimedia: 1080p60 H.265/H.264 encode and decode; GC7000UL 3D and GC520L 2D graphics.
  • Major interfaces represented in the pinout include dual USB, PCIe Gen 3 x1, dual MIPI CSI, MIPI DSI, LVDS, HDMI, dual Gb Ethernet, SD/eMMC, NAND, SPI, I2C, UART, SAI, SPDIF, JTAG, and GPIO.
Symbol and pin audit
  • Schematic terminal count: 548.
  • Unique physical Pin Number / ball-coordinate values: 548.
  • Duplicate ball coordinates: none found.
  • Blank ball coordinates: none found.
  • Every schematic terminal has a matching PCB pad object by terminal designator.
  • Spot checks against NXP Table 78 match, including A19 MIPI_DSI1_D2_P, B5 GPIO1_IO15, G10 BOOT_MODE0, R24 NVCC_SNVS_1P8, W9 VDD_SOC, and AD2 DRAM_DQ27.
  • Repeated power and ground balls are uniquely named in the project (VDD_SOC_1..., VSS_1..., etc.) while preserving the correct physical ball number. This is internally consistent.
Pin metadata mismatches
  1. Pin Description is absent on all terminals. The user-visible designators contain the primary signal names, but no datasheet-derived functional descriptions are populated.
  2. Pin Type is Unspecified on all 548 terminals. Power, ground, input, output, bidirectional, analog, clock, differential, and reserved/DNU pins are not electrically classified. This reduces ERC usefulness.
  3. The symbol is represented as 548 individual terminal records rather than grouped functional sections. Connectivity mapping is intact, but readability and reusable symbol organization are limited.
Footprint audit
  • Footprint asset: BGA548C50P29X29_1500X1500X148.kicad_mod.
  • Encoded geometry matches the required class: 548 balls, 0.50 mm pitch, 29 x 29 nominal matrix, 15.00 x 15.00 mm body.
  • The project exposes 548 corresponding PCB pads and no missing terminal-to-pad associations were found.
  • Flux displays pad objects by terminal designator (signal name), while physical ball coordinates remain in each terminal's Pin Number. This is an internal representation and is not, by itself, evidence of an incorrect mapping.
  • Exact pad diameter, solder-mask opening, copper shape, courtyard, and coordinate-by-coordinate pitch could not be independently read from the available layout inspection output. Therefore, the footprint's fine geometry is not fully verified against NXP SOT2047-1.
  • The footprint filename encodes a height of approximately 1.48 mm, while one extracted package record reports a 1.331 mm body height. Height does not affect copper land mapping, but the 3D/mechanical metadata should be checked against the exact SOT2047-1 package drawing.
Flagged mismatches and risks
Definite metadata issues
  • Incorrect IC subtype: Logic / AND is wrong; this is an applications processor/microprocessor.
  • Package naming: LFBGA and 548-LFBGA should preferably be FCBGA548 to match NXP documentation.
  • Incomplete description: omits the enabled VPU and NPU.
  • Missing Pin Description: all 548 terminals lack descriptions.
  • Unspecified Pin Type: all 548 terminals lack electrical classification.
Verification limitations / follow-up risks
  • The stored official datasheet URL is present but uses an NXP cache URL with a signed query string, which may be less durable than NXP's stable document URL.
  • Full footprint land-pattern geometry could not be proven from the available node output. Pad size, mask opening, courtyard, orientation marker, and exact depopulated-ball pattern should be checked directly against SOT2047-1 before production release.
  • The library metadata's approximate package height may not match the exact package drawing.
Overall assessment
The core identity, 548-ball count, physical ball numbering, signal naming, and symbol-to-footprint associations appear internally consistent, with spot-checked ball assignments matching the official NXP ball map. The main deficiencies are metadata quality and ERC semantics rather than an observed pin-map failure: wrong Logic / AND classification, FCBGA/LFBGA naming inconsistency, incomplete feature description, no pin descriptions, and every pin marked Unspecified. Exact footprint pad geometry remains the principal unverified manufacturing item.

  • Audit scope

  • Part metadata

  • Key specifications

  • Symbol and pin audit

  • Pin metadata mismatches

  • Footprint audit

  • Flagged mismatches and risks

  • Definite metadata issues

  • Verification limitations / follow-up risks

  • Overall assessment