Part Review Check
Update the package code, pin types, and pin descriptions from the datasheet.
Thought for 6 sec
I’ll update the package metadata and set each terminal’s pin type and datasheet-backed description, then re-read the part to verify the changes.
Worked for 2 mins 56 sec
The first update applied, but Flux warned that
Power and I/O aren’t standard Pin Type values, so I’m normalizing those to Power In and Bi-Directional before verification.Worked for 35 sec
Thought for 13 sec — Evaluating package codes
Set properties on VDD, VIO, CANL and 1 more.
Thought for 9 sec
Getting project info.
Completed 5 design checks.
Reading schematic details.
Thought for a moment
Refine this doc
Ask about this doc
Part Review — MCP2562FD-H/MF
Date: 2026-07-09
Scope
Reviewed available part information in this Flux part project against the Microchip MCP2561/2FD datasheet, including MPN, manufacturer, package, pin count, description, properties, schematic symbol terminals, footprint asset, and pin descriptions.
Project Metadata Observed
Table
| Field | Project value | Datasheet / expected value | Status |
|---|---|---|---|
| Manufacturer Part Number | MCP2562FD-H/MF | MCP2562FD-H/MF | Match |
| Manufacturer Name | Microchip | Microchip Technology Inc. | Match |
| Description | CAN Flexible Data Rate transceiver with 1.8 V to 5.5 V I/O | MCP2562FD is high-speed CAN FD transceiver with VIO | Match, but note VDD is 4.5 V to 5.5 V |
| Part Type | Integrated Circuits | Integrated circuit / CAN FD transceiver | Acceptable |
| Designator Prefix | IC | IC/U-style prefix appropriate | Acceptable |
| Package or Case Code | TO | MF, 8-lead 3 mm x 3 mm DFN with exposed pad | Mismatch |
| Datasheet URL | storage.googleapis.com user-uploaded PDF | Official Microchip PDF exists at ww1.microchip.com/...DS20005284.pdf | Existing URL present; not changed per request condition |
| Pads / terminals | 9 | 8 leads + exposed thermal pad EP | Match |
Existing project datasheet URL:
aab85b2a1e2b3a5089f779c1f71860543d81788f20eb4991bbd9f48732271328.pdf
Official Microchip datasheet found:
https://ww1.microchip.com/downloads/aemDocuments/documents/APID/ProductDocuments/DataSheets/MCP2561-2FD-High-Speed-CAN-Flexible-Data-Rate-Transceiver-DS20005284.pdf
Because the project already had a Datasheet URL populated, I did not update the Datasheet property. The existing file appears to contain the same Microchip datasheet content used for extraction.
Datasheet Identity and Ordering Code
MCP2562FD-H/MF decodes as:
- MCP2562FD: CAN FD transceiver with VIO digital I/O supply pin.
- H: high-temperature version, -40 °C to +150 °C.
- MF: 8-lead plastic dual flat no-lead package, 3 mm x 3 mm x 0.9 mm body, with exposed pad.
- No T suffix: standard packaging, not tape-and-reel.
- No VAO suffix: standard part, not AEC-Q100 suffix variant.
Key Datasheet Specifications
Table
| Spec | Value |
|---|---|
| Function | High-speed CAN Flexible Data Rate transceiver |
| VDD operating range | 4.5 V to 5.5 V |
| VIO operating range | 1.8 V to 5.5 V |
| CAN FD rate | Guaranteed support up to 5 Mbps; characterized/optimized operation includes 2, 5, and 8 Mbps references |
| Temperature range for H variant | -40 °C to +150 °C |
| CANH/CANL DC fault rating | -58 V to +58 V absolute maximum |
| CANH/CANL transient rating | ISO-7637 transient capability listed as -150 V to +100 V |
| ESD CANH/CANL | ±8 kV IEC 61000-4-2; ±8 kV HBM for MCP2562FD CAN pins |
| Other pins ESD | ±4 kV HBM; all pins ±300 V MM, ±750 V CDM |
| Standby behavior | STBY high enters standby; transmitter/high-speed receiver off, low-power receiver monitors bus; RXD indicates wake-up activity after filter delay |
| Thermal pad | Exposed pad EP recommended connected to VSS for EMI and thermal performance |
Pin Table Cross-Check
Table
| Pin | Datasheet name | Datasheet function | Project terminal | Project pin metadata | Status |
|---|---|---|---|---|---|
| 1 | TXD | Transmit Data Input | TXD | Pin Type: Unspecified | Number/name match; type/description missing |
| 2 | VSS | Ground | VSS | Pin Type: Unspecified | Number/name match; type/description missing |
| 3 | VDD | Supply Voltage | VDD | Pin Type: Unspecified | Number/name match; type/description missing |
| 4 | RXD | Receive Data Output | RXD | Pin Type: Unspecified | Number/name match; type/description missing |
| 5 | VIO | Digital I/O Supply Pin, MCP2562FD only | VIO | Pin Type: Unspecified | Number/name match; type/description missing |
| 6 | CANL | CAN Low-Level Voltage I/O | CANL | Pin Type: Unspecified | Number/name match; type/description missing |
| 7 | CANH | CAN High-Level Voltage I/O | CANH | Pin Type: Unspecified | Number/name match; type/description missing |
| 8 | STBY | Standby Mode Input | STBY | Pin Type: Unspecified | Number/name match; type/description missing |
| 9 / EP | EP | Exposed Thermal Pad; connect to VSS recommended | EP | Pin Type: Unspecified | Number/name match; type/description missing |
Schematic Symbol Review
Observed terminals:
- Left side: TXD pin 1, VSS pin 2, VDD pin 3, RXD pin 4.
- Right side: VIO pin 5, CANL pin 6, CANH pin 7, STBY pin 8.
- Bottom: EP pin 9.
The symbol pin numbers and terminal names match the datasheet pinout. The placement is readable and functionally reasonable. However, terminal properties do not include datasheet-backed Pin Description values, and all Pin Type properties are set to Unspecified.
Recommended pin type metadata:
Table
| Pin | Recommended Pin Type |
|---|---|
| 1 TXD | Input |
| 2 VSS | Ground |
| 3 VDD | Power |
| 4 RXD | Output |
| 5 VIO | Power |
| 6 CANL | I/O |
| 7 CANH | I/O |
| 8 STBY | Input |
| 9 EP | Ground / exposed pad |
Footprint Review
Observed footprint asset:
- SON65P300X300X100-9N-D.kicad_mod
Datasheet package and land-pattern data:
Table
| Feature | Datasheet value |
|---|---|
| Package code | MF |
| Package type | 8-lead plastic DFN / no-lead |
| Body | 3.00 mm x 3.00 mm |
| Height | 0.80 / 0.90 / 1.00 mm min/nom/max |
| Lead pitch | 0.65 mm BSC |
| Exposed pad | Yes, EP pin 9 |
| Recommended land pattern drawing | Microchip C04-2062B |
| Recommended contact pad width X1 | 0.35 mm max |
| Recommended contact pad length Y1 | 0.65 mm max |
| Recommended contact pad spacing C1 | 3.10 mm nominal |
| Center pad width W2 | 2.40 mm max |
| Center pad length T2 | 1.55 mm max |
The footprint asset name is consistent with the datasheet package family:
65Pindicates 0.65 mm pitch.300X300X100indicates 3.00 mm x 3.00 mm body and 1.00 mm max height.9Nindicates nine pads/terminals including exposed pad.
The layout data exposes the nine pad names, and they match the datasheet terminal names: TXD, VSS, VDD, RXD, VIO, CANL, CANH, STBY, EP.
Limitation: available layout inspection did not expose exact numeric copper pad dimensions or XY pad coordinates, so I could not numerically verify pad width, pad length, or EP size against Microchip land pattern C04-2062B. The footprint naming and pad count strongly indicate the intended package, but a full land-pattern validation would require reading the actual kicad_mod geometry or another footprint-detail view.
Mismatches and Issues Flagged
- Package or Case Code is set to
TO, but MCP2562FD-H/MF is Microchip package codeMF, an 8-lead 3 mm x 3 mm DFN with exposed pad. - Pin Type is
Unspecifiedfor every terminal. Datasheet-backed pin types should be Input, Output, Power, Ground, or I/O as listed above. - Pin Description properties are not populated in the inspected terminal metadata. The datasheet descriptions should be added for all pins.
- EP pin should be clearly described as exposed thermal pad and recommended connected to VSS for EMI and thermal performance.
- The project description emphasizes 1.8 V to 5.5 V I/O, which is accurate for VIO, but consumers should not infer the main supply VDD can run at 1.8 V. VDD operating range is 4.5 V to 5.5 V.
- The Datasheet URL property points to a stored uploaded PDF rather than the official Microchip URL. This is not strictly an error because a datasheet URL exists and the content appears to be the Microchip datasheet, but replacing it with the official Microchip URL would improve traceability.
- Exact footprint copper dimensions could not be numerically verified from available indexed layout data.
Recommended Cleanup
- Change Package or Case Code from
TOtoMForDFN-8-EP 3x3mm 0.65mm pitchdepending on the preferred property convention. - Add Pin Description values from the datasheet for all terminals.
- Set Pin Type values according to the datasheet.
- Consider updating Datasheet URL to the official Microchip PDF URL for long-term traceability.
- If footprint precision matters for publishing, verify the kicad_mod pad coordinates and dimensions directly against Microchip land pattern C04-2062B.
Scope
Project Metadata Observed
Datasheet Identity and Ordering Code
Key Datasheet Specifications
Pin Table Cross-Check
Schematic Symbol Review
Footprint Review
Mismatches and Issues Flagged
Recommended Cleanup
