I’ll incorporate that into the audit: using the verified MCF8329A1IREER pin table, I’ll assign section, orientation, and terminal order to every existing pin, remove all Pin Group properties, and preserve every pin number and mapping.
The symbol organization and datasheet-backed metadata are applied. I’m doing the final readback now to confirm all 37 pins, ordering, types, descriptions, and footprint mappings remained intact.
Updated the part to the official TI MCF8329A1IREER metadata and datasheet, with WQFN REE0036A, 36 pins plus exposed pad, 4.5–60 V operation, and −40°C to 125°C rating. All 37 terminals now have datasheet-verified types/descriptions, balanced sections and orientations, unique Power-first/Ground-last ordering, and no Pin Group properties; pin numbers and footprint mappings were preserved.
The footprint’s 5 × 4 mm body, 0.4 mm pitch, and exposed pad match the TI package drawing. Corrected mismatches included the incomplete MPN/description, missing datasheet and pin metadata, SCL’s type, and the SHA/SHB/SHC I/O classifications.
Wirelessly connects nets on schematic. Used to organize schematics and separate functional blocks. To wirelessly connect net portals, give them same designator. #portal
General Purpose Thick Film Standard Power
and High-Power Chip Resistor
47 kOhms ±5% 0.125W, 1/8W Chip Resistor 0805 (2012 Metric) Automotive AEC-Q200 Thick Film
Features:
- RMCF – standard power ratings
- RMCP – high power ratings
- Nickel barrier terminations standard
- Power derating from 100% at 70ºC to zero at +155ºC
- RoHS compliant, REACH compliant, and halogen free
- AEC-Q200 compliant