MAX25231 Part Review
Worked for 11 mins 59 sec
Likely validation findings for MAX25231ATCB/V+T:
Confident flags
1. Incorrect manufacturer metadata
Current: Analog Devices
Likely correct: Analog Devices / Maxim Integrated
Likely correct: Analog Devices / Maxim Integrated
This is mildly nuanced because Maxim is now part of Analog Devices, but for a Maxim-origin part the manufacturer is often represented as Analog Devices Inc./Maxim Integrated or Analog Devices / Maxim. If Flux expects the current corporate owner, “Analog Devices” is acceptable. If it expects the datasheet/manufacturer branding, “Maxim Integrated / Analog Devices” is more precise.
Flag confidence: Medium, not severe.
2. Incorrect part type / subtype / logic function
Current metadata:
- Part type: Integrated Circuits
- Subtype: Logic
- logicFunction: AND
Correct function: Switching voltage regulator / buck converter / DC-DC converter.
This is a clear mismatch. The MAX25231 is not a logic IC and has no AND-gate function. It should be categorized as something like:
- Integrated Circuits
- Power Management IC
- DC-DC Switching Regulator
- Buck Converter / Step-Down Converter
Flag confidence: High.
Severity: High metadata error.
Severity: High metadata error.
3. Description has encoding issue
Current description:
36V, 1.2A Mini Buck Converter with 3.5?A IQThe
?A is almost certainly a bad encoding/rendering of µA.Corrected description should likely be:
36V, 1.2A Mini Buck Converter with 3.5µA IQ
Flag confidence: High.
Severity: Low to medium metadata quality issue.
Severity: Low to medium metadata quality issue.
4. Pin electrical types/descriptions missing
Current: Pin type unspecified and no pin descriptions.
For a power-management IC, pin roles matter. These should not all be generic/unspecified if the library supports terminal metadata.
Suggested pin roles/descriptions:
Table
| Pin | Name | Likely role |
|---|---|---|
| 1 | SPS | Input/config/control, spread-spectrum setting or mode-related pin depending datasheet |
| 2 | EN | Digital input / enable |
| 3 | BST | Bootstrap supply pin |
| 4 | SUP | Power input / supply input |
| 5 | LX | Switching node / power output switch node |
| 6 | PGND | Power ground |
| 7 | AGND | Analog ground |
| 8 | FB | Feedback input |
| 9 | OUT | Regulator output sense/output-related pin |
| 10 | BIAS | Bias supply/input/output depending datasheet details |
| 11 | SYNC | Synchronization input |
| 12 | PGOOD | Power-good output, likely open-drain |
| 13 | EP | Exposed pad, ground/thermal |
At minimum, SUP, PGND, AGND, LX, FB, EN, PGOOD, EP should have meaningful pin typing/descriptions.
Flag confidence: High that metadata is incomplete.
Severity: Medium to high, because pin types affect ERC quality.
Severity: Medium to high, because pin types affect ERC quality.
5. EP should be described as ground/thermal
Current: Pin 13 EP exists but no description/type.
Official info says EP is ground/thermal. It should be tied to ground per datasheet recommendations, usually PGND/AGND ground plane/thermal pad depending the layout guidance.
Flag confidence: High.
Severity: Medium.
Severity: Medium.
Footprint/package checks 6. Terminal count of 13 is acceptable despite “12 TDFN”
The official package is “12 TDFN-CU” but includes 12 perimeter pins plus exposed pad. Flux terminal count of 13 is therefore reasonable if the exposed pad is represented as pin 13.
Do not flag terminal count as wrong.
Confidence: High.
7. Footprint name is broadly plausible but package naming may be generic
Current footprint:
SON50P300X300X80-13N.kicad_modThis implies:
- SON/TDFN-style package
- 0.50 mm pitch
- 3.00 × 3.00 mm body
- 0.80 mm height
- 13 terminals including EP
Official:
- 12 TDFN-CU
- package code TD1233+2C
- outline 21-0664
- land pattern 90-0397
- 3 mm × 3 mm class package
- 12 pins + EP
The footprint naming is not exact to ADI’s package code, but it appears mechanically in the right family.
Flag confidence: Low as an error.
Recommendation: Cautiously note that the footprint should be verified against ADI land pattern 90-0397.
Recommendation: Cautiously note that the footprint should be verified against ADI land pattern 90-0397.
8. Footprint terminal pad length appears longer than official land pattern
Current side pads: 0.30 × 0.85 mm
Official land pattern visible dims: terminal pad width 0.30 mm, terminal pad length 0.65 mm
Official land pattern visible dims: terminal pad width 0.30 mm, terminal pad length 0.65 mm
Width matches. Length differs by +0.20 mm.
This could be significant, but IPC-derived footprints often extend pads beyond nominal manufacturer land pattern for solder fillet requirements. However, if ADI 90-0397 explicitly says 0.65 mm land length, then 0.85 mm may be oversized.
Flag confidence: Medium.
Severity: Cautious/medium, not a guaranteed failure without seeing the full 90-0397 drawing and coordinate convention.
Severity: Cautious/medium, not a guaranteed failure without seeing the full 90-0397 drawing and coordinate convention.
Suggested wording:
Footprint side pad width and pitch match the ADI land pattern, but the side pad length is 0.85 mm versus the visible ADI 90-0397 land pattern value of 0.65 mm. This should be reviewed; it may be an IPC-style extension, but it does not directly match the manufacturer land pattern.
9. Exposed pad footprint size is close but not exact
Current EP: 1.65 × 2.60 mm
Official land pattern: exposed pad 1.70 × 2.50 mm
Package outline EP/package pad tolerance: D2 1.45/1.55/1.65, E2 2.4/2.5/2.6
Official land pattern: exposed pad 1.70 × 2.50 mm
Package outline EP/package pad tolerance: D2 1.45/1.55/1.65, E2 2.4/2.5/2.6
The footprint EP appears to use max package pad dimensions or close to them: 1.65 × 2.60. The land pattern says 1.70 × 2.50. Differences:
- X/D direction: current 1.65 vs land 1.70, smaller by 0.05 mm
- Y/E direction: current 2.60 vs land 2.50, larger by 0.10 mm
This is close. The EP size is not wildly wrong, but it does not match the cited land pattern exactly.
Flag confidence: Medium-low.
Severity: Cautious.
Severity: Cautious.
Suggested wording:
Exposed pad dimensions are close to the package/land-pattern values but not an exact match to ADI 90-0397. Current EP is 1.65 × 2.60 mm versus extracted land pattern 1.70 × 2.50 mm. This is probably acceptable only if intentionally based on IPC or package max dimensions; otherwise align to manufacturer land pattern.
10. Side pad coordinates likely imply correct pitch/count
Side pads at y:
- −1.25, −0.75, −0.25, +0.25, +0.75, +1.25
That is 6 pads per side at 0.50 mm pitch, matching 12 pins total. X at ±1.45 with 3.0 mm body is plausible for leadless side lands.
Do not confidently flag pitch/count as wrong.
Confidence: High that this is broadly plausible.
Pinout sanity check 11. Pin names/order appear to match official list
Given pins:
1 SPS
2 EN
3 BST
4 SUP
5 LX
6 PGND
7 AGND
8 FB
9 OUT
10 BIAS
11 SYNC
12 PGOOD
13 EP
2 EN
3 BST
4 SUP
5 LX
6 PGND
7 AGND
8 FB
9 OUT
10 BIAS
11 SYNC
12 PGOOD
13 EP
You state official ADI pins are as listed. Therefore the schematic pin names and numbering appear correct.
Do not flag pinout as wrong.
Confidence: High, assuming the official pin list has been transcribed correctly.
12. Fixed 3.3 V variant metadata should mention fixed output
Part number MAX25231ATCB/V+ is stated to be the fixed 3.3 V variant. Current description only says generic “36V, 1.2A Mini Buck Converter...”
The metadata should ideally include:
- fixed 3.3 V output
- automotive-qualified
/Vvariant if applicable - buck regulator / step-down converter
- 1.2 A output current
- 36 V input capability
- low-IQ 3.5 µA
Flag confidence: Medium-high.
Severity: Medium metadata completeness issue.
Severity: Medium metadata completeness issue.
Suggested validation summary Flag confidently
- Subtype/function is wrong: marked as Logic / AND, but this is a buck DC-DC regulator.
- Description encoding error:
3.5?Ashould be3.5µA. - Pin metadata incomplete: pin types and descriptions are missing.
- EP metadata incomplete: exposed pad should be documented as ground/thermal.
- Part should identify fixed 3.3 V variant: MAX25231ATCB/V+ is not just a generic adjustable buck if official source says fixed 3.3 V.
- Manufacturer naming: “Analog Devices” is acceptable after Maxim acquisition, but “Analog Devices / Maxim Integrated” may be more precise.
- Footprint side pad length: current 0.85 mm vs ADI land pattern 0.65 mm; review against 90-0397.
- Exposed pad dimensions: current 1.65 × 2.60 mm vs land pattern 1.70 × 2.50 mm; close but not exact.
- Footprint/package name: generic SON naming is plausible, but should be mapped to ADI TD1233+2C / outline 21-0664 / land pattern 90-0397.
- Terminal count 13: acceptable because 12 TDFN pins plus exposed pad.
- Schematic pin names/numbering: appear correct.
- Pitch/body size/basic pad arrangement: broadly consistent with 12-pin 3 × 3 mm, 0.5 mm-pitch TDFN/SON-style package.
Worked for 1 min 30 sec
Created a project doc
MAX25231ATCB/V+T Part Review
Date: 2026-07-23 Current Flux library part/project: MAX25231ATCB_V+T
Completed the MAX25231ATCB/V+T review and created the detailed report: MAX25231ATCB/V+T Part Review.
Open items:
- Datasheet URL was already set to an official ADI URL, so I did not change it.
- Main mismatches: wrong subtype/function metadata (
Logic/AND), missing pin descriptions/types, description encoding issue (3.5?A→3.5µA), incomplete package metadata, and footprint dimensions that don’t exactly match ADI land pattern 90-0397.
Suggested next steps:
- Update the part metadata and pin descriptions.
- Decide whether to revise the footprint to match ADI/Maxim 90-0397 exactly.
- Re-run a final part-quality check after those edits.
Fix metadata and footprint
Fix part metadata
Revise footprint
Run final review
