MAX25231 Part Review

Likely validation findings for MAX25231ATCB/V+T:
Confident flags 1. Incorrect manufacturer metadata
Current: Analog Devices
Likely correct: Analog Devices / Maxim Integrated
This is mildly nuanced because Maxim is now part of Analog Devices, but for a Maxim-origin part the manufacturer is often represented as Analog Devices Inc./Maxim Integrated or Analog Devices / Maxim. If Flux expects the current corporate owner, “Analog Devices” is acceptable. If it expects the datasheet/manufacturer branding, “Maxim Integrated / Analog Devices” is more precise.
Flag confidence: Medium, not severe.

2. Incorrect part type / subtype / logic function
Current metadata:
  • Part type: Integrated Circuits
  • Subtype: Logic
  • logicFunction: AND
Correct function: Switching voltage regulator / buck converter / DC-DC converter.
This is a clear mismatch. The MAX25231 is not a logic IC and has no AND-gate function. It should be categorized as something like:
  • Integrated Circuits
  • Power Management IC
  • DC-DC Switching Regulator
  • Buck Converter / Step-Down Converter
Flag confidence: High.
Severity: High metadata error.

3. Description has encoding issue
Current description: 36V, 1.2A Mini Buck Converter with 3.5?A IQ
The ?A is almost certainly a bad encoding/rendering of µA.
Corrected description should likely be:
36V, 1.2A Mini Buck Converter with 3.5µA IQ
Flag confidence: High.
Severity: Low to medium metadata quality issue.

4. Pin electrical types/descriptions missing
Current: Pin type unspecified and no pin descriptions.
For a power-management IC, pin roles matter. These should not all be generic/unspecified if the library supports terminal metadata.
Suggested pin roles/descriptions:

Table


PinNameLikely role
1SPSInput/config/control, spread-spectrum setting or mode-related pin depending datasheet
2ENDigital input / enable
3BSTBootstrap supply pin
4SUPPower input / supply input
5LXSwitching node / power output switch node
6PGNDPower ground
7AGNDAnalog ground
8FBFeedback input
9OUTRegulator output sense/output-related pin
10BIASBias supply/input/output depending datasheet details
11SYNCSynchronization input
12PGOODPower-good output, likely open-drain
13EPExposed pad, ground/thermal
At minimum, SUP, PGND, AGND, LX, FB, EN, PGOOD, EP should have meaningful pin typing/descriptions.
Flag confidence: High that metadata is incomplete.
Severity: Medium to high, because pin types affect ERC quality.

5. EP should be described as ground/thermal
Current: Pin 13 EP exists but no description/type.
Official info says EP is ground/thermal. It should be tied to ground per datasheet recommendations, usually PGND/AGND ground plane/thermal pad depending the layout guidance.
Flag confidence: High.
Severity: Medium.

Footprint/package checks 6. Terminal count of 13 is acceptable despite “12 TDFN”
The official package is “12 TDFN-CU” but includes 12 perimeter pins plus exposed pad. Flux terminal count of 13 is therefore reasonable if the exposed pad is represented as pin 13.
Do not flag terminal count as wrong.
Confidence: High.

7. Footprint name is broadly plausible but package naming may be generic
Current footprint: SON50P300X300X80-13N.kicad_mod
This implies:
  • SON/TDFN-style package
  • 0.50 mm pitch
  • 3.00 × 3.00 mm body
  • 0.80 mm height
  • 13 terminals including EP
Official:
  • 12 TDFN-CU
  • package code TD1233+2C
  • outline 21-0664
  • land pattern 90-0397
  • 3 mm × 3 mm class package
  • 12 pins + EP
The footprint naming is not exact to ADI’s package code, but it appears mechanically in the right family.
Flag confidence: Low as an error.
Recommendation: Cautiously note that the footprint should be verified against ADI land pattern 90-0397.

8. Footprint terminal pad length appears longer than official land pattern
Current side pads: 0.30 × 0.85 mm
Official land pattern visible dims: terminal pad width 0.30 mm, terminal pad length 0.65 mm
Width matches. Length differs by +0.20 mm.
This could be significant, but IPC-derived footprints often extend pads beyond nominal manufacturer land pattern for solder fillet requirements. However, if ADI 90-0397 explicitly says 0.65 mm land length, then 0.85 mm may be oversized.
Flag confidence: Medium.
Severity: Cautious/medium, not a guaranteed failure without seeing the full 90-0397 drawing and coordinate convention.
Suggested wording:
Footprint side pad width and pitch match the ADI land pattern, but the side pad length is 0.85 mm versus the visible ADI 90-0397 land pattern value of 0.65 mm. This should be reviewed; it may be an IPC-style extension, but it does not directly match the manufacturer land pattern.

9. Exposed pad footprint size is close but not exact
Current EP: 1.65 × 2.60 mm
Official land pattern: exposed pad 1.70 × 2.50 mm
Package outline EP/package pad tolerance: D2 1.45/1.55/1.65, E2 2.4/2.5/2.6
The footprint EP appears to use max package pad dimensions or close to them: 1.65 × 2.60. The land pattern says 1.70 × 2.50. Differences:
  • X/D direction: current 1.65 vs land 1.70, smaller by 0.05 mm
  • Y/E direction: current 2.60 vs land 2.50, larger by 0.10 mm
This is close. The EP size is not wildly wrong, but it does not match the cited land pattern exactly.
Flag confidence: Medium-low.
Severity: Cautious.
Suggested wording:
Exposed pad dimensions are close to the package/land-pattern values but not an exact match to ADI 90-0397. Current EP is 1.65 × 2.60 mm versus extracted land pattern 1.70 × 2.50 mm. This is probably acceptable only if intentionally based on IPC or package max dimensions; otherwise align to manufacturer land pattern.

10. Side pad coordinates likely imply correct pitch/count
Side pads at y:
  • −1.25, −0.75, −0.25, +0.25, +0.75, +1.25
That is 6 pads per side at 0.50 mm pitch, matching 12 pins total. X at ±1.45 with 3.0 mm body is plausible for leadless side lands.
Do not confidently flag pitch/count as wrong.
Confidence: High that this is broadly plausible.

Pinout sanity check 11. Pin names/order appear to match official list
Given pins:
1 SPS
2 EN
3 BST
4 SUP
5 LX
6 PGND
7 AGND
8 FB
9 OUT
10 BIAS
11 SYNC
12 PGOOD
13 EP
You state official ADI pins are as listed. Therefore the schematic pin names and numbering appear correct.
Do not flag pinout as wrong.
Confidence: High, assuming the official pin list has been transcribed correctly.

12. Fixed 3.3 V variant metadata should mention fixed output
Part number MAX25231ATCB/V+ is stated to be the fixed 3.3 V variant. Current description only says generic “36V, 1.2A Mini Buck Converter...”
The metadata should ideally include:
  • fixed 3.3 V output
  • automotive-qualified /V variant if applicable
  • buck regulator / step-down converter
  • 1.2 A output current
  • 36 V input capability
  • low-IQ 3.5 µA
Flag confidence: Medium-high.
Severity: Medium metadata completeness issue.

Suggested validation summary Flag confidently
  1. Subtype/function is wrong: marked as Logic / AND, but this is a buck DC-DC regulator.
  2. Description encoding error: 3.5?A should be 3.5µA.
  3. Pin metadata incomplete: pin types and descriptions are missing.
  4. EP metadata incomplete: exposed pad should be documented as ground/thermal.
  5. Part should identify fixed 3.3 V variant: MAX25231ATCB/V+ is not just a generic adjustable buck if official source says fixed 3.3 V.
Flag cautiously / review recommended
  1. Manufacturer naming: “Analog Devices” is acceptable after Maxim acquisition, but “Analog Devices / Maxim Integrated” may be more precise.
  2. Footprint side pad length: current 0.85 mm vs ADI land pattern 0.65 mm; review against 90-0397.
  3. Exposed pad dimensions: current 1.65 × 2.60 mm vs land pattern 1.70 × 2.50 mm; close but not exact.
  4. Footprint/package name: generic SON naming is plausible, but should be mapped to ADI TD1233+2C / outline 21-0664 / land pattern 90-0397.
Do not flag
  1. Terminal count 13: acceptable because 12 TDFN pins plus exposed pad.
  2. Schematic pin names/numbering: appear correct.
  3. Pitch/body size/basic pad arrangement: broadly consistent with 12-pin 3 × 3 mm, 0.5 mm-pitch TDFN/SON-style package.
Created a project doc

MAX25231ATCB/V+T Part Review

View Document

Date: 2026-07-23 Current Flux library part/project: MAX25231ATCB_V+T
Completed the MAX25231ATCB/V+T review and created the detailed report: MAX25231ATCB/V+T Part Review.
Open items:
  • Datasheet URL was already set to an official ADI URL, so I did not change it.
  • Main mismatches: wrong subtype/function metadata (Logic / AND), missing pin descriptions/types, description encoding issue (3.5?A3.5µA), incomplete package metadata, and footprint dimensions that don’t exactly match ADI land pattern 90-0397.
Suggested next steps:
  1. Update the part metadata and pin descriptions.
  2. Decide whether to revise the footprint to match ADI/Maxim 90-0397 exactly.
  3. Re-run a final part-quality check after those edits.
Fix metadata and footprint
Fix part metadata
Revise footprint
Run final review
SPS
Pin Number
1
BST
Pin Number
3
OUT
Pin Number
9
AGND
Pin Number
7
SYNC
Pin Number
11
PGOOD
Pin Number
12
EN
Pin Number
2
FB
Pin Number
8
LX
Pin Number
5
SUP
Pin Number
4
PGND
Pin Number
6
BIAS
Pin Number
10
EP
Pin Number
13

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MAX25231ATCB/V+T Part Review
Date: 2026-07-23
Sources checked
  • Current Flux library part/project: MAX25231ATCB_V+T
  • Existing Datasheet URL property: https://www.analog.com/MAX25231/datasheet
  • Official Analog Devices datasheet PDF: https://www.analog.com/media/en/technical-documentation/data-sheets/max25231.pdf
  • Official package outline: https://pdfserv.maximintegrated.com/package_dwgs/21-0664.PDF
  • Official land pattern: https://pdfserv.maximintegrated.com/land_patterns/90-0397.PDF
The existing Datasheet URL is already populated and points to the official Analog Devices MAX25231 datasheet page, so no datasheet-property update was required.
Current part metadata observed

Table


FieldCurrent valueDatasheet / official reference check
Part/project nameMAX25231ATCB_V+TRepresents orderable MPN MAX25231ATCB/V+T; acceptable sanitized project name.
Manufacturer Part NumberMAX25231ATCB/V+TMatches orderable code with tape-and-reel suffix. Datasheet ordering table lists MAX25231ATCB/V+; T is the tape/reel ordering suffix.
ManufacturerAnalog DevicesAcceptable current manufacturer/owner; Maxim-origin part now under ADI.
Description36V, 1.2A Mini Buck Converter with 3.5?A IQFunctionally correct, but encoding is wrong: should be 3.5µA IQ. Should also mention fixed 3.3 V variant.
Terminal count13Correct if exposed pad is modeled as pin 13: 12 TDFN leads + exposed pad.
Datasheet URLhttps://www.analog.com/MAX25231/datasheetOfficial ADI URL is present. Direct PDF is https://www.analog.com/media/en/technical-documentation/data-sheets/max25231.pdf.
Part TypeIntegrated CircuitsBroadly acceptable, but too generic.
Subtype / IC typeLogicMismatch: this is a PMIC / buck DC-DC regulator, not a logic IC.
Logic FunctionANDMismatch: MAX25231 is not an AND gate.
Package propertyNot observed in part metadata returned by library searchShould identify 12 TDFN-CU, package code TD1233+2C, outline 21-0664, land pattern 90-0397.
Key datasheet specs

Table


SpecDatasheet value
Manufacturer / familyAnalog Devices / Maxim Integrated MAX25231
Function36 V, 1.2 A mini buck converter with low quiescent current
Variant reviewedMAX25231ATCB/V+ / MAX25231ATCB/V+T
Output optionFixed 3.3 V output
Operating input voltageVSUP = 3.5 V to 36 V; after soft-start, 3 V to 36 V; 40 V transient tolerance for t < 1 s
Output current1.2 A
Quiescent current3.5 µA typ / 8 µA max no-load, no-switching for MAX25231ATCB/V+; 4.5 µA typ no-load switching; shutdown 1 µA typ / 5 µA max
Switching frequency2.1 MHz typ; 1.925 MHz min / 2.275 MHz max
External sync range1.7 MHz to 2.6 MHz
Spread spectrum±6% when SPS is high
Package12 TDFN-CU, 3 mm × 3 mm, exposed pad
Package codeTD1233+2C
Package outline21-0664
Land pattern90-0397
Thermal resistanceθJA 41 °C/W, θJC 8.5 °C/W on four-layer board
Pinout cross-check
The schematic symbol terminal names and pin numbers match the datasheet pin table.

Table


PinCurrent symbol nameDatasheet function summaryResult
1SPSSpread-spectrum enable; high enables spread spectrum, low disables; 1 MΩ internal pulldownMatch
2ENHigh-voltage-compatible enable input; low turns part offMatch
3BSTBootstrap pin for high-side driver; use 0.1 µF from BST to LXMatch
4SUPSupply input; connect 4.7 µF ceramic to PGNDMatch
5LXBuck switching node; connect 4.7 µH inductor between LX and OUTMatch
6PGNDPower ground for high-current/high-frequency returnMatch
7AGNDAnalog ground for quiet signalsMatch
8FBFeedback pin; for fixed-voltage configs connect to BIASMatch
9OUTBuck output-voltage sense input; bypass to PGND with 22 µF ceramicMatch
10BIAS5 V internal BIAS supply; connect at least 1 µF ceramic to AGNDMatch
11SYNCSync/mode input; grounded/open enables skip mode, BIAS enables forced PWM; 1 MΩ internal pulldownMatch
12PGOODOpen-drain reset/power-good output; external pullup requiredMatch
13 / EPEPExposed pad; connect to PCB ground plane for thermal transfer; not current-carryingMatch as modeled terminal, but missing metadata
Symbol / pin metadata findings
  • Pin names and numbers are correct.
  • All terminal Pin Type properties are currently Unspecified; this is incomplete for a power IC and reduces ERC usefulness.
  • Pin Description metadata is missing for every terminal.
  • Recommended pin typing/descriptions should classify at least: SUP = Power input, PGND/AGND/EP = Ground/Thermal, LX = switching power node, BST/BIAS = supply/bias support pins, FB = analog feedback input, EN/SPS/SYNC = control inputs, PGOOD = open-drain output.
Footprint cross-check
Current footprint asset: SON50P300X300X80-13N.kicad_mod
Observed current footprint geometry from the KiCad asset:

Table


FeatureCurrent footprint
Body/fab outline3.0 mm × 3.0 mm
Pin count12 perimeter pads + EP = 13 pads
Pitch0.50 mm
Perimeter pad size0.30 mm × 0.85 mm
Perimeter pad centersX = ±1.45 mm; Y = ±1.25, ±0.75, ±0.25 mm
Exposed pad1.65 mm × 2.60 mm
Pin-1 indicatorPresent
3D modelMAX25231ATCB_V+T.stp present
Official package / land pattern dimensions extracted from ADI/Maxim PDFs:

Table


FeatureOfficial value
Package codeTD1233+2C
Package body, D/E2.95 / 3.00 / 3.05 mm min/nom/max
Package height, A0.70 / 0.75 / 0.80 mm min/nom/max
Lead pitch, e0.50 mm BSC
Lead width, b0.20 / 0.25 / 0.30 mm min/nom/max
Lead length, L0.30 / 0.40 / 0.50 mm min/nom/max
Package exposed pad D21.45 / 1.55 / 1.65 mm min/nom/max
Package exposed pad E22.40 / 2.50 / 2.60 mm min/nom/max
Land pattern terminal pad width0.30 mm
Land pattern terminal pad length0.65 mm
Land pattern pitch0.50 mm
Land pattern exposed pad1.70 mm × 2.50 mm
Footprint assessment:
  • Basic family, body size, pin count, pitch, and pin-1 indicator are plausible for the MAX25231 package.
  • Perimeter pad width and pitch match the land pattern values.
  • Perimeter pad length differs: current footprint uses 0.85 mm, while the visible ADI/Maxim 90-0397 land pattern value is 0.65 mm. This should be reviewed; it may be an IPC-style extension, but it does not directly match the manufacturer land-pattern drawing.
  • Exposed pad is close but not identical: current is 1.65 mm × 2.60 mm; ADI/Maxim land pattern is 1.70 mm × 2.50 mm. The current exposed pad matches the package maximum dimensions in one orientation more than the recommended land pattern.
  • Footprint name is generic (SON50P300X300X80-13N) rather than explicitly tied to ADI TD1233+2C / 21-0664 / 90-0397; that is not necessarily wrong, but the geometry should be intentionally mapped to the official land pattern.
Mismatches / issues to flag
High-confidence metadata mismatches
  1. Wrong IC subtype/function metadata: current subtype/function says Logic / AND, but the part is a switching buck regulator / PMIC.
  2. Description encoding issue: 3.5?A should be 3.5µA.
  3. Pin metadata incomplete: all pins have Pin Type = Unspecified, and no pin descriptions are present.
  4. Package metadata incomplete: metadata should identify 12 TDFN-CU, package code TD1233+2C, outline 21-0664, land pattern 90-0397.
  5. Variant detail missing from description: MAX25231ATCB/V+ is the fixed 3.3 V output variant.
Footprint items needing review
  1. Side pad length: 0.85 mm current vs 0.65 mm official land-pattern value.
  2. Exposed pad size: 1.65 mm × 2.60 mm current vs 1.70 mm × 2.50 mm official land pattern.
  3. Footprint naming/source traceability: generic footprint name should be documented or revised to directly reference ADI package code/land pattern.
Items that appear correct
  1. MPN MAX25231ATCB/V+T matches the official orderable family/variant, including tape-and-reel suffix.
  2. Datasheet URL is present and official.
  3. Terminal count of 13 is correct when EP is modeled.
  4. Schematic symbol pin names and pin numbers match the datasheet pin table.
  5. Footprint body class, 0.50 mm pitch, 12 side pads, EP, and pin-1 indicator are broadly consistent with the 12 TDFN-CU package.
  1. Change IC subtype/function metadata from Logic / AND to PMIC / DC-DC Buck Regulator / Switching Regulator.
  2. Update description to: 36V, 1.2A fixed 3.3V mini buck converter with 3.5µA IQ.
  3. Add pin descriptions and meaningful pin types for all 13 terminals.
  4. Add package metadata: 12 TDFN-CU, TD1233+2C, 21-0664, 90-0397.
  5. Decide whether to keep the current IPC-style footprint or revise it to exactly match ADI/Maxim land pattern 90-0397.
  • Sources checked

  • Current part metadata observed

  • Key datasheet specs

  • Pinout cross-check

  • Symbol / pin metadata findings

  • Footprint cross-check

  • Mismatches / issues to flag

  • High-confidence metadata mismatches

  • Footprint items needing review

  • Items that appear correct

  • Recommended next fixes

Assets

MAX25231ATCB_V+T

SON50P300X300X80-13N.kicad_modFootprint
MAX25231ATCB_V+T

MAX25231ATCB_V+T

MAX25231ATCB_V+T.stp3D Model

MAX25231ATCB_V+T

MAX25231ATCB_V+T Symbol.svgDefault
MAX25231ATCBV+-thumb.png

MAX25231ATCBV+-thumb.png

MAX25231ATCBV+-thumbThumbnail

MAX25231ATCB/V+

MAX25231ATCB/V+ thumbnail
Buck Regulator Positive Output Step-Down DC-DC Controller IC 12-TDFN (3x3)
Automotive Synchronous Buck Converter: MAX25231ATCB/V+ is a high-efficiency synchronous step-down converter designed for automotive applications, operating from a 4.5V to 36V input supply and providing up to 2A output current. It integrates a 2.1MHz switching frequency, forced-PWM mode, and is housed in a 12-pin 3mm × 3mm TDFN package.

Properties

MAX25231ATCB/V+

Analog Devices Inc./Maxim Integrated

Integrated Circuits

IC

parametric-v1

Pricing & Availability

DPN

Stock

Qty 1

2

0

$2.124–$3.8669

1

3.9K

$3.92

1

1.2K

$1.8677

Controls