MAX25231 Part Review
36V, 1.2A Mini Buck Converter with 3.5?A IQ?A is almost certainly a bad encoding/rendering of µA.36V, 1.2A Mini Buck Converter with 3.5µA IQ
Table
| Pin | Name | Likely role |
|---|---|---|
| 1 | SPS | Input/config/control, spread-spectrum setting or mode-related pin depending datasheet |
| 2 | EN | Digital input / enable |
| 3 | BST | Bootstrap supply pin |
| 4 | SUP | Power input / supply input |
| 5 | LX | Switching node / power output switch node |
| 6 | PGND | Power ground |
| 7 | AGND | Analog ground |
| 8 | FB | Feedback input |
| 9 | OUT | Regulator output sense/output-related pin |
| 10 | BIAS | Bias supply/input/output depending datasheet details |
| 11 | SYNC | Synchronization input |
| 12 | PGOOD | Power-good output, likely open-drain |
| 13 | EP | Exposed pad, ground/thermal |
SON50P300X300X80-13N.kicad_modFootprint side pad width and pitch match the ADI land pattern, but the side pad length is 0.85 mm versus the visible ADI 90-0397 land pattern value of 0.65 mm. This should be reviewed; it may be an IPC-style extension, but it does not directly match the manufacturer land pattern.
Exposed pad dimensions are close to the package/land-pattern values but not an exact match to ADI 90-0397. Current EP is 1.65 × 2.60 mm versus extracted land pattern 1.70 × 2.50 mm. This is probably acceptable only if intentionally based on IPC or package max dimensions; otherwise align to manufacturer land pattern.
/V variant if applicable3.5?A should be 3.5µA.MAX25231ATCB/V+T Part Review
Logic / AND), missing pin descriptions/types, description encoding issue (3.5?A → 3.5µA), incomplete package metadata, and footprint dimensions that don’t exactly match ADI land pattern 90-0397.MAX25231ATCB_V+Thttps://www.analog.com/MAX25231/datasheethttps://www.analog.com/media/en/technical-documentation/data-sheets/max25231.pdfhttps://pdfserv.maximintegrated.com/package_dwgs/21-0664.PDFhttps://pdfserv.maximintegrated.com/land_patterns/90-0397.PDFTable
| Field | Current value | Datasheet / official reference check |
|---|---|---|
| Part/project name | MAX25231ATCB_V+T | Represents orderable MPN MAX25231ATCB/V+T; acceptable sanitized project name. |
| Manufacturer Part Number | MAX25231ATCB/V+T | Matches orderable code with tape-and-reel suffix. Datasheet ordering table lists MAX25231ATCB/V+; T is the tape/reel ordering suffix. |
| Manufacturer | Analog Devices | Acceptable current manufacturer/owner; Maxim-origin part now under ADI. |
| Description | 36V, 1.2A Mini Buck Converter with 3.5?A IQ | Functionally correct, but encoding is wrong: should be 3.5µA IQ. Should also mention fixed 3.3 V variant. |
| Terminal count | 13 | Correct if exposed pad is modeled as pin 13: 12 TDFN leads + exposed pad. |
| Datasheet URL | https://www.analog.com/MAX25231/datasheet | Official ADI URL is present. Direct PDF is https://www.analog.com/media/en/technical-documentation/data-sheets/max25231.pdf. |
| Part Type | Integrated Circuits | Broadly acceptable, but too generic. |
| Subtype / IC type | Logic | Mismatch: this is a PMIC / buck DC-DC regulator, not a logic IC. |
| Logic Function | AND | Mismatch: MAX25231 is not an AND gate. |
| Package property | Not observed in part metadata returned by library search | Should identify 12 TDFN-CU, package code TD1233+2C, outline 21-0664, land pattern 90-0397. |
Table
| Spec | Datasheet value |
|---|---|
| Manufacturer / family | Analog Devices / Maxim Integrated MAX25231 |
| Function | 36 V, 1.2 A mini buck converter with low quiescent current |
| Variant reviewed | MAX25231ATCB/V+ / MAX25231ATCB/V+T |
| Output option | Fixed 3.3 V output |
| Operating input voltage | VSUP = 3.5 V to 36 V; after soft-start, 3 V to 36 V; 40 V transient tolerance for t < 1 s |
| Output current | 1.2 A |
| Quiescent current | 3.5 µA typ / 8 µA max no-load, no-switching for MAX25231ATCB/V+; 4.5 µA typ no-load switching; shutdown 1 µA typ / 5 µA max |
| Switching frequency | 2.1 MHz typ; 1.925 MHz min / 2.275 MHz max |
| External sync range | 1.7 MHz to 2.6 MHz |
| Spread spectrum | ±6% when SPS is high |
| Package | 12 TDFN-CU, 3 mm × 3 mm, exposed pad |
| Package code | TD1233+2C |
| Package outline | 21-0664 |
| Land pattern | 90-0397 |
| Thermal resistance | θJA 41 °C/W, θJC 8.5 °C/W on four-layer board |
Table
| Pin | Current symbol name | Datasheet function summary | Result |
|---|---|---|---|
| 1 | SPS | Spread-spectrum enable; high enables spread spectrum, low disables; 1 MΩ internal pulldown | Match |
| 2 | EN | High-voltage-compatible enable input; low turns part off | Match |
| 3 | BST | Bootstrap pin for high-side driver; use 0.1 µF from BST to LX | Match |
| 4 | SUP | Supply input; connect 4.7 µF ceramic to PGND | Match |
| 5 | LX | Buck switching node; connect 4.7 µH inductor between LX and OUT | Match |
| 6 | PGND | Power ground for high-current/high-frequency return | Match |
| 7 | AGND | Analog ground for quiet signals | Match |
| 8 | FB | Feedback pin; for fixed-voltage configs connect to BIAS | Match |
| 9 | OUT | Buck output-voltage sense input; bypass to PGND with 22 µF ceramic | Match |
| 10 | BIAS | 5 V internal BIAS supply; connect at least 1 µF ceramic to AGND | Match |
| 11 | SYNC | Sync/mode input; grounded/open enables skip mode, BIAS enables forced PWM; 1 MΩ internal pulldown | Match |
| 12 | PGOOD | Open-drain reset/power-good output; external pullup required | Match |
| 13 / EP | EP | Exposed pad; connect to PCB ground plane for thermal transfer; not current-carrying | Match as modeled terminal, but missing metadata |
Pin Type properties are currently Unspecified; this is incomplete for a power IC and reduces ERC usefulness.Pin Description metadata is missing for every terminal.SON50P300X300X80-13N.kicad_modTable
| Feature | Current footprint |
|---|---|
| Body/fab outline | 3.0 mm × 3.0 mm |
| Pin count | 12 perimeter pads + EP = 13 pads |
| Pitch | 0.50 mm |
| Perimeter pad size | 0.30 mm × 0.85 mm |
| Perimeter pad centers | X = ±1.45 mm; Y = ±1.25, ±0.75, ±0.25 mm |
| Exposed pad | 1.65 mm × 2.60 mm |
| Pin-1 indicator | Present |
| 3D model | MAX25231ATCB_V+T.stp present |
Table
| Feature | Official value |
|---|---|
| Package code | TD1233+2C |
| Package body, D/E | 2.95 / 3.00 / 3.05 mm min/nom/max |
| Package height, A | 0.70 / 0.75 / 0.80 mm min/nom/max |
| Lead pitch, e | 0.50 mm BSC |
| Lead width, b | 0.20 / 0.25 / 0.30 mm min/nom/max |
| Lead length, L | 0.30 / 0.40 / 0.50 mm min/nom/max |
| Package exposed pad D2 | 1.45 / 1.55 / 1.65 mm min/nom/max |
| Package exposed pad E2 | 2.40 / 2.50 / 2.60 mm min/nom/max |
| Land pattern terminal pad width | 0.30 mm |
| Land pattern terminal pad length | 0.65 mm |
| Land pattern pitch | 0.50 mm |
| Land pattern exposed pad | 1.70 mm × 2.50 mm |
SON50P300X300X80-13N) rather than explicitly tied to ADI TD1233+2C / 21-0664 / 90-0397; that is not necessarily wrong, but the geometry should be intentionally mapped to the official land pattern.3.5?A should be 3.5µA.Pin Type = Unspecified, and no pin descriptions are present.TD1233+2C, outline 21-0664, land pattern 90-0397.MAX25231ATCB/V+ is the fixed 3.3 V output variant.MAX25231ATCB/V+T matches the official orderable family/variant, including tape-and-reel suffix.36V, 1.2A fixed 3.3V mini buck converter with 3.5µA IQ.12 TDFN-CU, TD1233+2C, 21-0664, 90-0397.Sources checked
Current part metadata observed
Key datasheet specs
Pinout cross-check
Symbol / pin metadata findings
Footprint cross-check
Mismatches / issues to flag
High-confidence metadata mismatches
Footprint items needing review
Items that appear correct
Recommended next fixes