Part Verification and Datasheet Review

C

cherepanyadima

Review all available part information (MPN, package, pin count, description, properties). If no datasheet URL is already set, search the web for the official datasheet and update the part's Datasheet property with the URL. Then cross-check the schematic symbol, footprint, and pin descriptions against the datasheet. Summarize key specs and flag any mismatches.

flux

I’ll inspect the part metadata, look for an official datasheet if needed, then compare the symbol/footprint/pins against the datasheet and update the Datasheet property if missing.

flux

The project already has an Analog Devices datasheet URL set, so I’m using that as the source of truth and moving into pin/footprint verification.
Created a project doc

MAX20303BEWN+T Part Review

View Document
Date: 2026-07-08 Project/part: MAX20303BEWN+T

flux

Completed the part review and saved the detailed findings in MAX20303BEWN+T Part Review.
  • Datasheet URL was already set to the official Analog Devices page, so no update was needed.
  • Symbol pin mapping and main 56-WLP footprint geometry match the datasheet.
  • Flagged issues: Part Type is too narrow, explicit package metadata is missing, footprint pad diameter should be reviewed against ADI AN1891/assembler rules, and there are minor text/naming cleanup items.
Fix metadata and footprint
Fix flagged issues
Review WLP pads
Run validation checks
Add package property
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Files

Pins

Symbol

Layout

3D View

Name
Pin #
Type
Part Type
Pin Description
Pin Orientation
DRN
A1
Output
Terminal
ERM/LRA haptic driver negative output.
right
DRP
A2
Output
Terminal
ERM/LRA haptic driver positive output.
left
HDGND
A3
Ground
Terminal
Haptic driver ground. Keep within -0.3V to +0.3V of GSUB.
left
SYS_1
A4
Power Out
Terminal
System load connection, SYS bump A4. Connect both SYS bumps together on PCB with low impedance; bypass common node with minimum 10µF to GND.
left
L2OUT
A5
Power Out
Terminal
LDO2 output. Bypass with 1µF capacitor to GND.
right
BK2GND
A6
Ground
Terminal
Buck2 ground. Keep within -0.3V to +0.3V of GSUB.
right
BK2LX
A7
Passive
Terminal
Buck2 regulator switch. Connect through 2.2µH inductor to BK2OUT.
right
SCL
B1
Input
Terminal
I2C serial clock input.
left
SDA
B2
Bi-Directional
Terminal
I2C serial data input/open-drain output.
right
CPP
B3
Passive
Terminal
Charge pump flying-capacitor positive terminal. Connect 22nF min, 33nF max capacitor to CPN.
left
CPN
B4
Passive
Terminal
Charge pump flying-capacitor negative terminal. Connect 22nF min, 33nF max capacitor to CPP.
right
CPOUT
B5
Power Out
Terminal
Charge pump output. Bypass with 1µF capacitor to GND.
left
L2IN
B6
Power In
Terminal
LDO2 input. Bypass with 1µF capacitor to GND.
right
BK2OUT
B7
Power Out
Terminal
Buck2 regulator output. Bypass with 10µF capacitor to GND.
right
LED2
C1
Output
Terminal
Current sink output 2.
left
DGND
C2
Ground
Terminal
Digital ground. Keep within -0.3V to +0.3V of GSUB.
left
MPC4
C3
Bi-Directional
Terminal
Multipurpose control I/O 4.
right
MPC1
C4
Bi-Directional
Terminal
Multipurpose control I/O 1.
right
MPC0
C5
Bi-Directional
Terminal
Multipurpose control I/O 0.
left
CELL
C6
Input
Terminal
Fuel-gauge voltage input. Bypass with 0.1µF capacitor to GND.
left
BBOUT
C7
Power Out
Terminal
Buck-boost regulator output. Bypass with 10µF capacitor to GND.
right
LED1
D1
Output
Terminal
Current sink output 1.
right
PFN1
D2
Bi-Directional
Terminal
Configurable power-mode control pin, e.g. KIN.
left

MAX20303BEWN+T