Part Review and Datasheet Verification
Worked for 3 mins 2 sec
Completed the LMH0394SQE/NOPB review and documented the findings in LMH0394SQE/NOPB Part Review. The symbol pinout matches the datasheet for non-SPI/pin mode, the footprint pad count is consistent with 16 WQFN pins plus exposed DAP, and the main issues are unspecified pin types, ambiguous DAP naming, missing SPI alternate-function representation, and needing exact footprint geometry confirmation against TI RUM0016A.
Open items:
- Add/confirm visible Datasheet URL property as
https://www.ti.com/lit/ds/symlink/lmh0394.pdfif it is not already exposed. - Add per-pin descriptions/types and clarify pin 17 as exposed DAP/VEE.
- Decide whether this part should model SPI-mode alternate pin functions.
Suggested next steps:
- Update pin descriptions and pin types from the datasheet.
- Rename/describe
VEE_3asDAPorVEE_DAP. - Verify exact pad dimensions/pitch against the TI land pattern.
Thought for 7 sec
I’ll update the terminal pin metadata from the datasheet, rename/describe the exposed pad clearly as DAP/VEE, then inspect the footprint geometry against the TI RUM0016A land pattern.
Worked for 50 sec
Pin metadata is updated; I noticed a few values used non-standard enums, so I’m normalizing those now before verification.
Worked for 2 mins 45 sec
Updated the pin types/descriptions and clarified pin 17 as the DAP/exposed thermal pad tied to VEE/GND. I also verified the footprint: pad count, body outline, 0.65 mm pitch, and pin-1 marker match RUM0016A, but the land sizes differ from TI’s example layout: current perimeter pads are 0.35 × 0.85 mm vs TI example 0.3 × 0.6 mm, and exposed pad is 2.7 mm vs TI example 2.6 mm.
Open items:
- Decide whether to keep the current solderability-oriented footprint or revise it to TI’s example land pattern.
- Optionally rename
VEE_3toDAPorVEE_DAPfor visual clarity.
Suggested next steps:
- Revise the footprint pad geometry to TI’s example land pattern.
- Rename the DAP terminal for clarity.
- Add an SPI-mode symbol variant if this part should support both pin-mode and SPI-mode labeling.
Fix footprint and DAP
Revise land pattern
Rename DAP terminal
Run DRC review
Add SPI variant
