Part Audit Review

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Part Audit

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Part Audit Scope
Audit of the GPY211C0VC part metadata, schematic symbol terminals, PCB footprint, and terminal descriptions against the official MaxLinear GPY211 datasheet.
Sources Existing Part Information Key Specifications
  • Single-port 2.5G Ethernet PHY.

flux

Audit complete. The MPN, manufacturer, 57 terminals, pin mapping, and VQFN-56 footprint geometry match the MaxLinear datasheet; the main issues are missing pin descriptions, all pin types being Unspecified, absent explicit package metadata, and an outdated Rev. 1.4 datasheet link versus current Rev. 1.5. The URL was not changed because an official datasheet was already set.
Full findings: Part Audit
A

adrian95

Populate every pin type and description from the datasheet, including alternate functions and connection requirements.

flux

I’ll populate all 57 terminals with datasheet-backed electrical types and descriptions, preserving alternate functions and mandatory connection notes, then verify the complete pin table.

flux

Populated and verified all 57 terminals with datasheet-backed Pin Type and Pin Description properties. Descriptions include alternate functions, strap behavior, pull resistors, AC coupling, supply requirements, oscillator connections, DC/DC configuration, and exposed-pad grounding; pin numbers and footprint mappings were preserved.
A

adrian95

Organize the terminals into proper pin groups, sections, orientations, and terminal order.

flux

I’ll organize all terminals into functional symbol sections and pin groups, assign readable orientations and deterministic ordering, then verify every pin remains mapped correctly.

flux

Organized all 57 terminals into functional sections: Control & Management, Serial & LED, SGMII, Clock & Calibration, Ethernet Media, Power, and Ground. Every pin now has a meaningful group, valid orientation, and unique consecutive order; all pin numbers, types, descriptions, and footprint mappings were preserved.
Finalize part validation
Configure differential pairs
Audit footprint geometry
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Part Audit
Scope
Audit of the GPY211C0VC part metadata, schematic symbol terminals, PCB footprint, and terminal descriptions against the official MaxLinear GPY211 datasheet.
Sources
Existing Part Information

Table

FieldCurrent valueAssessment
Part name / MPNGPY211C0VCCorrect
ManufacturerMaxLinearCorrect
Part typeEthernetCorrect but broad
DescriptionEthernet ICs TRANSVR IC GPY211C0VC VQFN56 SLNW8 COMM>Identifies the device, package, former SPEC code, and commercial grade, but is distributor-style, abbreviated, and has a stray trailing >
Terminal count57Correct: 56 perimeter leads plus exposed pad
Designator prefixICAppropriate
Datasheet URLOfficial MaxLinear Rev. 1.4 PDFPresent; no missing-URL update required. It is one revision behind the current Rev. 1.5 listing.
Package propertyNo explicit Package or Case Code property foundMetadata omission; footprint itself is PG-VQFN-56 / 7 mm x 7 mm
Key Specifications
  • Single-port 2.5G Ethernet PHY.
  • Line-side standards/rates: 10BASE-Te, 100BASE-TX, 1000BASE-T, and 2.5GBASE-T.
  • MAC interface: SGMII+/SGMII with rate adaptation.
  • IEEE 1588v2 precision time protocol and timestamping support.
  • Energy Efficient Ethernet (IEEE 802.3az), Wake-on-LAN, cable diagnostics, Auto MDI/MDI-X, and jumbo frames up to 10 kB.
  • 25 MHz crystal/clock operation, ±50 ppm clock accuracy.
  • Integrated DC/DC converter enables single 3.3 V input operation; optional external 1.0 V low-voltage rails.
  • Supply ranges: 3.3 V domains 3.13–3.46 V; 1.0 V domains 0.97–1.03 V; MDIO pad supply selectable as 1.8 V (1.71–1.89 V) or 3.3 V (3.135–3.46 V).
  • Commercial operating range: 0°C to 70°C; operation up to 85°C ambient is conditional on junction temperature remaining at or below 110°C.
  • Active ordering code GPY211C0VC; former Intel sales code 99AFC6; former SPEC code SLNW8; OTP firmware 0x886F.
  • Package: PG-VQFN-56, 7.0 mm x 7.0 mm, 0.4 mm pitch, 0.90 mm max height, exposed ground pad.
Symbol Cross-Check
All 56 numbered symbol terminals match the datasheet pin-number/name table. Duplicate functional pins are differentiated with schematic suffixes (DCDC_REGO_1/_2, VDD_1/_2, GND_1/_2, VDDA3V3_1/_2, VDDA0V9_1/_2/_3) while retaining the correct physical pin numbers. Pin 12 is labeled MDINT, matching the package pinout table; the detailed function table also identifies GPIO14 as its general-purpose/alternate identity.
The exposed pad is represented as terminal 57 named EP. Electrically this corresponds to datasheet EPAD / VSS and must connect to the PCB ground plane.
Symbol metadata mismatches
  • Every terminal has Pin Type: Unspecified; the datasheet defines input, output, bidirectional, analog, power, and ground roles.
  • No Pin Description properties are populated. Therefore important requirements and alternate functions are absent from the part, including HRSTN behavior, TRSTN pull-down, SGMII AC coupling, MDIO voltage selection, oscillator requirements, RCAL/RESREF resistor functions, and exposed-pad grounding.
  • Pin 12's symbol name MDINT is valid, but a description should preserve the GPIO14 alternate function.
  • Exposed-pad name EP is understandable but less explicit than datasheet naming VSS/EPAD.
Footprint Cross-Check
The footprint is QFN40P700X700X90-57N-D and describes PG-VQFN-56.
Confirmed geometry:
  • 56 perimeter pads plus one central exposed pad: correct.
  • 7.0 mm x 7.0 mm body: correct.
  • 0.4 mm lead pitch: correct.
  • 0.20 mm perimeter pad width: matches nominal lead width.
  • 0.85 mm footprint pad length provides a normal solder land extension beyond the nominal 0.4 mm package lead length.
  • 5.2 mm x 5.2 mm exposed pad: consistent with the package drawing/footprint convention.
  • Pin-1 chamfer and marker are present.
  • 3D model asset is attached.
Footprint caveat
The datasheet provides the package outline and requires the exposed pad to be grounded, but the extracted document does not provide a complete recommended PCB land-pattern table. The footprint is dimensionally consistent with the package outline, but solder-paste segmentation and the thermal-via pattern are not encoded in this bare part footprint. MaxLinear thermal characterization references a 4-layer PCB with 16 thermal vias; the final board should implement an appropriate exposed-pad paste aperture and grounded thermal-via array according to assembler/process guidance.
High priority
  1. Populate Pin Type for all terminals from the datasheet. Current Unspecified values weaken ERC and semantic checks.
  2. Populate Pin Description for all terminals, including alternate functions and mandatory connection notes.
Medium priority
  1. Add explicit package metadata: Package or Case Code = PG-VQFN-56 (7 x 7 mm, 0.4 mm pitch).
  2. Clean the description to: Single-port 2.5GBASE-T Ethernet PHY with SGMII+/SGMII, IEEE 1588v2, integrated DC/DC, PG-VQFN-56, commercial temperature.
  3. Rename or describe exposed pad as VSS (EPAD) to make its required ground connection unambiguous.
Low priority / maintenance
  1. The Datasheet URL is valid and official, so it was not changed under the requested missing-URL rule. It points to Rev. 1.4, while MaxLinear lists Rev. 1.5 (March 2024). Replace it when a stable official Rev. 1.5 direct PDF URL is available.
Overall Result
The core identity, MPN, manufacturer, terminal count, pin numbering/naming, and package geometry are consistent with the datasheet. The main quality issue is incomplete terminal metadata rather than an incorrect pinout or footprint.

  • Scope

  • Sources

  • Existing Part Information

  • Key Specifications

  • Symbol Cross-Check

  • Symbol metadata mismatches

  • Footprint Cross-Check

  • Footprint caveat

  • Mismatches and Recommended Corrections

  • High priority

  • Medium priority

  • Low priority / maintenance

  • Overall Result