Hirose Connector Audit

Thought for 15 sec

I found the project’s footprint asset and part metadata, but the indexed PCB data does not expose the full per-pad rule details for the KiCad footprint pads — it only confirms that pads 1–30 exist under footprint asset F-ER830P08SV2H, and that the uploaded footprint file is ER830P08SV2H.kicad_mod.

Project part identity:

MPN: ER8-30P-0.8SV-2H
Manufacturer: Hirose
Connector: ER8 series, 30-position, 2-row, 0.8 mm pitch board-to-board header
Footprint asset: ER830P08SV2H.kicad_mod
3D model: ER8-30P-0.8SV-2H.stp

From the Hirose/RS data fetched for this exact MPN, the manufacturer’s recommended PCB layout is:

30 contacts, 2 rows
Pitch: 0.8 mm
15 contacts per row
Contact span C: 11.2 mm
Mounting-hole span B: 14.8 mm
Mounting holes: 2 × Ø1.45 ±0.08 mm, non-plated through holes
Connector outline / keepout A: 18.0 mm
Body/outline width reference: 5.6 mm
Pin 1 shown at left side of layout
Pin 2 shown on lower row

Assuming the footprint origin is centered, the expected 0.8 mm-pitch pad-center coordinates for the 30 signal pads are:

Table

Pad	X mm	Row / expected Y
1	-5.6	upper row
2	-5.6	lower row
3	-4.8	upper row
4	-4.8	lower row
5	-4.0	upper row
6	-4.0	lower row
7	-3.2	upper row
8	-3.2	lower row
9	-2.4	upper row
10	-2.4	lower row
11	-1.6	upper row
12	-1.6	lower row
13	-0.8	upper row
14	-0.8	lower row
15	0.0	upper row
16	0.0	lower row
17	0.8	upper row
18	0.8	lower row
19	1.6	upper row
20	1.6	lower row
21	2.4	upper row
22	2.4	lower row
23	3.2	upper row
24	3.2	lower row
25	4.0	upper row
26	4.0	lower row
27	4.8	upper row
28	4.8	lower row
29	5.6	upper row
30	5.6	lower row

Expected mounting-hole centers, assuming centered origin:

Table

Hole	X mm	Y mm	Geometry
MH1	-7.4	0	Ø1.45 mm NPTH
MH2	+7.4	0	Ø1.45 mm NPTH

Expected outline / placement references:

Overall connector/avoid area length: 18.0 mm
Hole-to-hole span: 14.8 mm
Contact-center span: 11.2 mm
Pin 1 orientation: left side of connector; pin 1 on the upper row, pin 2 on the lower row per manufacturer drawing orientation.

Likely manufacturing mismatch flags against a correct 0.8 mm-pitch two-row connector:

Project index did not expose pad size/shape/layer details, so I could not verify exact copper pad width/length from the indexed footprint.
If the actual footprint pad centers differ from the -5.6 mm … +5.6 mm sequence at 0.8 mm pitch, the connector will not solder correctly.
If MH1/MH2 are not Ø1.45 mm NPTH at approximately ±7.4 mm, the plastic locating pegs may not fit.
If the footprint treats the mounting holes as plated copper pads instead of non-plated mechanical holes, that would be a likely fabrication mismatch.
If pin 1 is not on the left-side upper row relative to the manufacturer’s recommended layout, the connector may be mirrored or rotated incorrectly.
The project metadata has a suspicious package value: “Package or Case Code: TO”, which does not match this connector package and should not be relied on for manufacturing.

Thought for 4 sec

flux

Audit complete. The MPN and 30-pin count are correct, but I flagged several issues:

Package code TO is incorrect for this Hirose SMT board-to-board connector.
All 30 symbol pins lack descriptions and use Unspecified instead of passive pin types.
The Datasheet property already exists, so it was not changed; however, it points to an RS product page rather than the official Hirose product documentation.
The footprint has pads 1–30 and two mounting holes, but exact pad dimensions and hole plating were not exposed for definitive verification. Manufacturer requirements include 0.8 mm pitch, 2 × Ø1.45 mm NPTH holes at 14.8 mm spacing, and an 18.0 × 5.6 mm connector envelope.

Key ratings: 0.5 A/contact, 100 VAC, 50 mΩ maximum contact resistance, 1000 MΩ minimum insulation resistance, 300 VAC withstand, 100 mating cycles, 85 Ω differential impedance, and PCIe Gen.4/16 Gbps support. Hirose sources conflict on the upper operating temperature: the specification sheet states +85 °C, while the current product page states +125 °C.

Fix metadata and pins

Update Datasheet URL

Correct pin metadata

Verify footprint geometry

File quality issue

Pin Number

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