Part Audit Review

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Part Audit

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Part Audit Scope and evidence status
Reviewed the current part metadata, 17-terminal schematic symbol, embedded KiCad footprint, and attached STEP model against the official STMicroelectronics datasheet already stored on the part. The datasheet extraction was OCR-based and did not return Flux inline citation identifiers, so the numerical datasheet facts below should be treated as official-source cross-checks with citation provenance unavailable in this report.
Existing metadata Key specifications
  • Function: six-line integrated EMI/RFI pi-filter and ESD protection for microSD/T-Flash interfaces.
  • Package: Micro QFN, nominal body 3.50 x 1.20 mm, 0.50 mm typical height and 0.55 mm maximum.
  • Operating temperature: -40 to +85 °C; maximum junction temperature 125 °C.

flux

Audit complete. The official ST datasheet URL was already populated, so no update was needed. Pin numbering/topology matches, but pin descriptions and electrical types are missing, pins 2/16 are ambiguously named, and exposed pad 17 is likely 2.80 mm instead of the recommended 2.30 mm land length.
Full findings: Part Audit
Suggested next steps
  1. Correct and verify the exposed-pad footprint.
  2. Add datasheet-derived pin descriptions and electrical types.
  3. Rename the DAT3 pull-up/pull-down terminals clearly.
  4. Populate explicit package and SMD mount properties.
adrian95

adrian95

Correct the exposed-pad land, terminal names, pin types, and descriptions to match the datasheet.

flux

I’ll update the exposed-pad land to the datasheet footprint, rename the DAT3 pull terminals, assign electrical pin types, add pin descriptions, then re-check the symbol and footprint.

flux

Updated and verified:
  • Exposed pad corrected to 0.30 × 2.30 mm.
  • Renamed pins 2/16 to DAT3_PULLDOWN and DAT3_PULLUP.
  • Added datasheet-aligned descriptions to all 17 terminals.
  • Set signal/filter pins to Passive, VCC to Power In, and exposed pad to Ground.
  • Pin numbers and footprint mappings remain intact.
No open items.
Validate footprint fully
Inspect 3D alignment
Tighten courtyard
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Part Audit
Scope and evidence status
Reviewed the current part metadata, 17-terminal schematic symbol, embedded KiCad footprint, and attached STEP model against the official STMicroelectronics datasheet already stored on the part. The datasheet extraction was OCR-based and did not return Flux inline citation identifiers, so the numerical datasheet facts below should be treated as official-source cross-checks with citation provenance unavailable in this report.
Existing metadata

Table

FieldCurrent valueAssessment
Part nameEMIF06-MSD02N16Correct
ManufacturerSTMicroelectronicsCorrect
MPNEMIF06-MSD02N16Correct
Part typeEMI / RFI ComponentsReasonable
Description6-Line EMI filter & ESD protector for SD card, uQFN16Functionally correct
Designator prefixFLReasonable
Datasheet URLOfficial STMicroelectronics PDFAlready populated; no update required
Terminal count17Correct when the exposed ground pad is represented as terminal 17; package has 16 perimeter leads
Package propertyNot explicitly populatedMetadata gap: add Micro QFN 3.5 x 1.2 mm, 16L / narrow micro-QFN if desired
Mount propertyNot explicitly populatedMetadata gap: SMD
Key specifications
  • Function: six-line integrated EMI/RFI pi-filter and ESD protection for microSD/T-Flash interfaces.
  • Package: Micro QFN, nominal body 3.50 x 1.20 mm, 0.50 mm typical height and 0.55 mm maximum.
  • Operating temperature: -40 to +85 °C; maximum junction temperature 125 °C.
  • Interface compatibility: up to 52 MHz stated by ST.
  • Six series resistors: 45 ohm typical, 36–54 ohm range.
  • Integrated pull-ups: 90 kohm typical, 80–100 kohm range.
  • Integrated DAT3 pull-down: 470 kohm typical, 375–565 kohm range.
  • Per-line capacitance: 20 pF maximum at 1 MHz test conditions.
  • Breakdown voltage: 5 V minimum to 8 V maximum at 1 mA.
  • Leakage: 200 nA maximum at 3 V per line.
  • IEC 61000-4-2 protection: external-side pins have higher ratings than internal-side pins; up to ±8 kV contact and ±15 kV air on the other/external pins.
  • Marking: N6; tape-and-reel ordering, base quantity 3000.
Symbol and pin-map cross-check
The symbol contains pins 1–16 plus exposed pad 17. The perimeter mapping matches the datasheet topology:

Table

PinCurrent symbol nameDatasheet functionResult
1WP/CDWP / mechanical card-detect pathMatch
2RDAT3_GNDDAT3 pull-down connectionFunctionally matches, but name is cryptic
3DAT2_INDAT2 internal/host sideMatch
4DAT3_INDAT3 internal/host sideMatch
5CMD_INCMD internal/host sideMatch
6CLK_INCLK internal/host sideMatch
7DAT0_INDAT0 internal/host sideMatch
8DAT1_INDAT1 internal/host sideMatch
9DAT1_EXDAT1 external/card sideMatch
10DAT0_EXDAT0 external/card sideMatch
11CLK_EXCLK external/card sideMatch
12CMD_EXCMD external/card sideMatch
13DAT3_EXDAT3 external/card sideMatch
14DAT2_EXDAT2 external/card sideMatch
15VCCSupplyMatch
16RDATA_VCCDAT3 pull-up connectionFunctionally matches, but likely typo/ambiguous name
17EP_(GND)Exposed ground padMatch
Symbol issues
  1. All pins have Pin Type = Unspecified. Signal pins should be classified as passive or bidirectional as appropriate; VCC should be power input and EP/GND should be power/ground. Leaving all pins unspecified weakens ERC.
  2. Pin Description properties are absent. The user-visible names are present, but there are no explanatory descriptions derived from the datasheet.
  3. Pins 2 and 16 use unclear names. Recommended clearer names are DAT3_PULLDOWN and DAT3_PULLUP (or equivalent), while retaining pin numbers.
  4. RDATA_VCC appears to be an ambiguous abbreviation or typo. Its datasheet function is the DAT3 pull-up connection, not a generic data supply pin.
Footprint cross-check
Matching items
  • 17 copper pads: 16 perimeter pads plus exposed pad 17.
  • 0.40 mm perimeter pitch.
  • Perimeter pads are 0.20 x 0.45 mm, matching the values shown in the recommended land-pattern drawing.
  • Nominal fabrication body outline is 3.50 x 1.20 mm.
  • Pin-1 dot/marker is present adjacent to pad 1.
  • A STEP model is attached at unit scale.
Potential mismatch requiring correction
  • Exposed copper pad 17 is 0.30 x 2.80 mm. The package exposed-metal dimension is nominally 0.30 x 2.80 mm, but the datasheet's recommended PCB footprint drawing appears to specify a shorter 0.30 x 2.30 mm land. The footprint seems to have copied the package metal length rather than the recommended land length. This is the main manufacturability concern and should be confirmed visually from Figure 13 before publishing or using the part.
Quality observations
  • The courtyard is 5.50 x 4.00 mm, substantially larger than the 3.50 x 1.20 mm body. This is conservative rather than electrically wrong, but may unnecessarily constrain dense placement.
  • The reference text is centered on the package and sized 1.27 mm; unless hidden by the host EDA, it may overlap the component body and nearby pads on silkscreen.
  • The STEP model exists, but model-to-pad alignment was not independently dimension-verified in this audit.
Overall verdict
  • MPN/manufacturer/function: pass.
  • Datasheet attachment: pass; already official, so no property update was needed.
  • Pin numbering and electrical topology: pass.
  • Symbol metadata quality: needs improvement (missing descriptions and electrical types; unclear pull-up/down pin names).
  • Footprint: perimeter land pattern appears correct; exposed-pad length is a probable mismatch against the recommended footprint and should be corrected or authoritatively re-checked before production use.

  • Scope and evidence status

  • Existing metadata

  • Key specifications

  • Symbol and pin-map cross-check

  • Symbol issues

  • Footprint cross-check

  • Matching items

  • Potential mismatch requiring correction

  • Quality observations

  • Overall verdict