Part Datasheet Review and Verification

flux

Completed the part review and created a detailed report: em8900-v001-df10bplus-part-datasheet-review.
Open items:
  • Official datasheet found: https://www.emmicroelectronic.com/sites/default/files/products/files/8900-ds.pdf
  • Datasheet URL is not set, but the available project metadata tool did not expose the part-level Datasheet URL field for direct update.
  • Main issues flagged: MPN suffix discrepancy (DF10B+ vs datasheet ordering table DF11B+), missing pin descriptions/types, exposed pad connection needing confirmation, and footprint geometry needing numeric verification.
Suggested next steps:
  1. Set the part Datasheet URL field manually to the official EM Microelectronic PDF above.
  2. Confirm the DF10B+ vs DF11B+ suffix with EM Microelectronic/Digi-Key.
  3. Add datasheet-based pin descriptions and pin types to all terminals.
  4. Verify footprint pad geometry against the DFN10 3×3 drawing.
A

adrian95

Fix the pin descriptions/types, investigate the EP connection, and run a part review check afterward.

flux

I’ll update the terminal pin descriptions/types from the EM8900 datasheet, verify the exposed-pad recommendation, then run a review check and report any remaining issues.

flux

Updated all terminal pin descriptions and standardized pin types: AC/FB/LX*/DIS as Input, AVSS* as Ground, VSUP as Power Out, and EP as Passive.
Open items:
  • EP investigation: the official datasheet shows the DFN center pad mechanically but gives no explicit electrical connection instruction, so I documented EP as an exposed center pad with no specified connection.
  • Part review check returned no matching part-review findings/check items after the update, so there were no reported remaining part-review errors to address.
Suggested next steps:
  1. Confirm EP handling with EM Microelectronic if your footprint/library policy requires tying exposed pads to ground.
  2. Verify the footprint pad geometry numerically against the DFN10 3×3 drawing.
  3. Re-publish or release the part once the MPN suffix discrepancy is resolved.
Verify, document, export
Check footprint geometry
Update review document
Run full review
Export part report
Sign up to send

Files

Pins

Symbol

Layout

3D View

EM8900-V001-DF10B+ Part Datasheet Review
Source information
  • Project/part name: EM8900-V001-DF10B+
  • Manufacturer property: EM MICROELECTRONIC
  • MPN property: EM8900-V001-DF10B+
  • Description: ULTRA-LOW VOLTAGE DCDC BOOST CONVERTER FOR THERMAL ELECTRICAL GENERATOR, DFN-10
  • Package/property: 10-DFN
  • Pads in project context: 11
  • Official datasheet found: https://www.emmicroelectronic.com/sites/default/files/products/files/8900-ds.pdf
  • Datasheet title/version/date reported by web extraction: EM8900 Data Sheet, version 4.2, 6-Oct-2025
Note: The project does not currently expose a part-level Datasheet URL field through the available editable project metadata tool. The datasheet URL should be set to the official URL above when that property is available in the part editor.
Datasheet ordering/package notes
The official datasheet extraction reports ordering information for EM8900-V001-DF11B+, not EM8900-V001-DF10B+, while distributor data references EM8900-V001-DF10B+. Both are associated with EM8900 and DFN10 3 mm × 3 mm packaging. This suffix discrepancy should be confirmed with EM Microelectronic or the distributor before publishing the part as exact.
Key datasheet specs

Table

ItemDatasheet value
FunctionUltra-low-voltage DCDC boost converter for thermal electrical generators (TEGs)
Startup input5 mV minimum TEG voltage with specified transformer
Operating input5 mV minimum TEG voltage with specified transformer
Maximum TEG voltage200 mV
Maximum output power20 mW with specified transformer
Output pinVSUP; no integrated limiter/regulator, external/load regulation required
VSUP operating limitMax 4.2 V
VSUP absolute maximum-0.2 V to 5.0 V
Operating temperature-40 °C to +85 °C
Storage temperature-65 °C to +150 °C
DIS input range0 V to 4.2 V; logic high disables boost converter
LX0/LX1/LX2 swing0 V to 2.0 V
FB swing-2.0 V to +2.0 V
AC swing-0.4 V to +4.6 V
PackageDFN10, 3 mm × 3 mm
Pitch0.50 mm BSC
Terminal size0.25 ± 0.05 mm width, 0.40 ± 0.10 mm length
Central exposed pad1.70 ± 0.10 mm × 2.40 ± 0.10 mm
Datasheet pinout vs schematic symbol

Table

PinDatasheet nameDatasheet descriptionProject terminal/designatorMatch
1ACRectifier inputACOK
2FBDCDC switching controlFBOK
3LX2Transformer primary side connectionLX2OK
4LX1Transformer primary side connectionLX1OK
5LX0Transformer primary side connectionLX0OK
6AVSS0Device ground connectionAVSS0OK
7AVSS1Device ground connectionAVSS1OK
8AVSS2Device ground connectionAVSS2OK
9DISDCDC boost converter disabled when set to logic 1DISOK
10VSUPSupply outputVSUPOK
Exposed padNot in pinout table; mechanical central pad showncentral exposed padEP, Pin 11Needs confirmation/description update
Footprint review
Observed PCB footprint contains pads for AC, FB, LX2, LX1, LX0, AVSS0, AVSS1, AVSS2, DIS, VSUP, and EP, totaling 11 pads including the exposed pad. Silkscreen/fab outline indicates a 3 mm × 3 mm body with pin-1 marker, consistent with DFN10 3×3 at a high level.
Detailed pad geometry was not exposed in the layout inspection output, so terminal width/length, pitch, and exposed-pad dimensions could not be numerically verified from the tool output. The footprint should be checked against: 0.50 mm pitch, 0.25 ± 0.05 mm terminal width, 0.40 ± 0.10 mm terminal length, and 1.70 × 2.40 mm exposed pad.
Mismatches / issues to fix
  1. Datasheet URL missing in project properties: The part project has no accessible datasheet URL set; official URL is https://www.emmicroelectronic.com/sites/default/files/products/files/8900-ds.pdf.
  2. MPN suffix discrepancy: Project MPN is EM8900-V001-DF10B+, but the current official datasheet extraction lists EM8900-V001-DF11B+ in the ordering table. Confirm whether DF10B+ is a distributor/orderable alias, older suffix, or incorrect MPN.
  3. Pin descriptions are not populated: All terminals currently show Pin Type: Unspecified and no visible Pin Description. Add datasheet descriptions to each terminal.
  4. Exposed pad description missing/ambiguous: Project uses EP as Pin 11. Datasheet pin table lists only pins 1–10, while the mechanical drawing shows a central pad. Confirm whether EM requires exposed pad connection to AVSS/ground and document it in the EP pin description.
  5. Footprint geometry not fully verified: High-level pad count/body style is consistent, but exact pad dimensions were not available from inspection output.
  • Set Datasheet URL: https://www.emmicroelectronic.com/sites/default/files/products/files/8900-ds.pdf
  • AC pin description: Rectifier input
  • FB pin description: DCDC switching control
  • LX2/LX1/LX0 pin description: Transformer primary side connection
  • AVSS0/AVSS1/AVSS2 pin description: Device ground connection
  • DIS pin description: DCDC boost converter disabled when set to logic 1; 0–4.2 V supply/control pin
  • VSUP pin description: Supply output; externally limited/regulated, max operating 4.2 V
  • EP pin description: Exposed/central pad; verify required connection, likely thermal/mechanical ground pad depending on datasheet notes

  • Source information

  • Datasheet ordering/package notes

  • Key datasheet specs

  • Datasheet pinout vs schematic symbol

  • Footprint review

  • Mismatches / issues to fix

  • Recommended property/pin-description updates