Audit complete. The 144-pin numbering and general footprint topology are correct, but all pin descriptions/types are missing and the 80 perimeter pads are 0.8 × 1.0 mm instead of Quectel’s recommended 0.8 × 2.5 mm; several pin names also differ. The Datasheet property was not changed because it was already populated, and I filed a part-quality report.
Check this schematic component against the datasheet for [MPN] and assign the correct pin orientation, section, and terminal order without changing, replacing, renumbering, or remapping any pins. Remove the Pin Group property from all pins if it exists. Place Power pins first and Ground pins last. Within each section, distribute the pins as evenly as possible between the left and right sides; for example, split 10 pins as 5/5 and 11 pins as 5/6 or 6/5. If a section contains only one pin, leave it on the most appropriate side. Keep the symbol compact, balanced, and visually symmetrical. If a pin function is unclear, assign Unclear / Check datasheet, then apply all changes directly to the schematic component.
I’ll use the current part’s MPN (EC200U), verify every terminal against the official Quectel datasheet, then assign sections, orientation, and terminal order while preserving all pin numbers and mappings.
Reorganized all 144 EC200U terminals into balanced functional sections, with power first and 43 ground pins last. Removed every Pin Group property and assigned each pin a section, left/right orientation, and unique terminal order.
All original pin names, numbers, and footprint mappings were preserved. Seven reserved or ambiguous pins were placed in Unclear / Check datasheet.
Family name; does not identify a specific regional/orderable variant.
Manufacturer Part Number
EC200U
Valid series identifier, but underspecified for an exact variant.
Manufacturer
Quectel
Correct.
Description
LTE standard module Bluetooth wireless communication 4G cat1 module all-network
Broadly correct but imprecise. Official description: LTE Cat 1 IoT/M2M module.
Package/case
Module
Too generic. Official form factor is a 144-pad LCC module.
Mount
Standard
Imprecise; this is a surface-mount LCC module.
Designator prefix
IC
Acceptable.
Part Type
Missing
Should identify the module/communications IC category.
Datasheet URL
Existing Google Drive URL
Already populated, so it was not changed. An official manufacturer URL is listed above for reference.
Terminals / pads
144 / 144
Correct, contiguous numbering 1–144.
Key specifications
LTE Cat 1 bis module optimized for IoT/M2M applications.
Maximum data rate: 10 Mbps downlink / 5 Mbps uplink.
Supply voltage: 3.3–4.3 V, nominal 3.8 V.
LCC form factor.
Module dimensions: 28.0 ±0.15 mm × 31.0 ±0.15 mm × 2.4 ±0.2 mm.
Approximate weight: 4.1 g.
Extended operating temperature range: -40 °C to +85 °C.
Schematic symbol and terminal audit
All 144 terminal numbers are present exactly once.
Terminal-to-footprint-pad association is complete.
Overall pin sequence and functional groupings correspond to the Quectel pin table.
Every terminal currently has Pin Type: Unspecified.
No terminal has a populated Pin Description property.
Quectel defines electrical types including DI, DO, DIO, AI, AIO, AO, OD, PI, and PO; these should be mapped into appropriate symbol electrical types and descriptions.
Pin-name mismatches
Table
Pin
Current
Datasheet
Assessment
38
SPI_MOSI
SPI_DOUT
Functional alias, but not the authoritative pin name; datasheet type is DO in SPI master mode.
39
SPI_MISO
SPI_DIN
Functional alias, but not the authoritative pin name; datasheet type is DI in SPI master mode.
35
ANT_BT/WIFI__SCAN
ANT_BT/WIFI_SCAN
Doubled-underscore formatting artifact.
73
LOUDSPK__P
LOUDSPK_P
Doubled-underscore formatting artifact.
74
LOUDSPK__N
LOUDSPK_N
Doubled-underscore formatting artifact.
118
WLAN_SLP__CLK
WLAN_SLP_CLK
Doubled-underscore formatting artifact.
127
WLAN_PWR__EN
WLAN_PWR_EN
Doubled-underscore formatting artifact.
The remaining pin names and numbers correspond to the official table, including power, ground, reserved, UART, USB, SIM, SDIO, antenna, audio, LCD, WLAN, and RF-control functions.
PCB footprint audit
Exactly 144 SMD pads, numbered 1–144 with no duplicates or omissions.
Pad arrangement matches the documented topology:
Pads 1–72: perimeter sequence.
Pads 73–84: central 1.6 mm-pitch cluster.
Pads 85–112: large ground-pad matrix.
Pads 113–116 and 141–144: additional perimeter pads.
Pads 117–140: two internal columns.
Internal pad geometry agrees with the drawing:
Pads 73–84 and 117–140: 1.1 × 1.1 mm.
Pads 85–112: 2.0 × 3.0 mm.
Center pitch: 1.6 mm.
Ground matrix spacing follows the documented 3.2/3.4 mm horizontal and 4.8 mm vertical spacing where applicable.
Critical footprint mismatch
All 80 perimeter lands—pads 1–72, 113–116, and 141–144—are currently 0.8 × 1.0 mm. Quectel’s recommended motherboard footprint specifies 0.8 × 2.5 mm perimeter lands at 1.3 mm pitch. Pad centers, pitch, ordering, and topology otherwise align.
This is a manufacturability and solder-joint reliability risk. The current copper envelope is approximately the module body size (31 × 28 mm) instead of the extended recommended land pattern (approximately 34.3 × 31.0 mm).
Actions taken
Datasheet property was not changed because a URL was already present, matching the user’s conditional instruction.
No symbol or footprint geometry was modified.
A part-quality issue was filed with the Flux engineering team for the perimeter-pad geometry and incomplete symbol metadata.
Recommended corrections
Change all 80 perimeter pads from 0.8 × 1.0 mm to 0.8 × 2.5 mm while preserving centers, pitch, numbering, and layers.
Populate every terminal’s Pin Description from the Quectel pin table.
Map every terminal to an appropriate electrical Pin Type.
Rename pins 38 and 39 to SPI_DOUT and SPI_DIN, respectively.
Remove doubled-underscore artifacts from pins 35, 73, 74, 118, and 127.
Set package metadata to 144-pad LCC, surface mount, and add a suitable Part Type.
Consider replacing the existing Datasheet URL with the official Quectel URL in a separate requested edit.