Part Datasheet Audit


Review all available part information (MPN, package, pin count, description, properties). If no datasheet URL is already set, search the web for the official datasheet and update the part's Datasheet property with the URL. Then cross-check the schematic symbol, footprint, and pin descriptions against the datasheet. Summarize key specs and flag any mismatches.
I’ll audit the part metadata, locate and attach the official datasheet if needed, then verify the symbol, footprint, and pin definitions against it and report any discrepancies.
Created a project doc

DS1100Z-50+ Part Audit

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Existing Datasheet property: https://datasheets.maximintegrated.com/en/ds/DS1100.pdf Current official Analog Devices URL: https://www.analog...
Audit complete. The existing datasheet URL is valid, so no property update was needed; package geometry is broadly correct, but all eight symbol-to-pin assignments are incorrect, and pin types/descriptions are missing. Full specifications and the exact mismatch table are in DS1100Z-50+ Part Audit.
Fix mapping and review
Fix pin mapping
Add pin metadata
Set Part Type
Run validation

DS1100Z-50+ Part Audit
Datasheet
Metadata review

Table


FieldProject valueResult
MPNDS1100Z-50+Confirmed
ManufacturerAnalog DevicesConfirmed; legacy datasheet is Maxim-branded
Package8-SOICBroadly correct but imprecise; official package is 8-lead SO, 150 mil narrow, code S8+4, outline 21-0041
Pin count8Confirmed
DescriptionFive-tap 50 ns delay line, 10 ns increments, 4.75–5.25 V, −40°C to +85°C, TTL/CMOS, ten 74LS loads/tapConfirmed
Part TypeMissingMetadata omission / review warning
The + suffix denotes lead-free/RoHS packaging.
Pinout cross-check
All eight project terminal numbers are mapped to the wrong functions compared with the official datasheet.

Table


Physical pinOfficial functionCurrent project functionResult
1VCCINMismatch
2TAP 1 outputTAP_2Mismatch
3TAP 3 outputTAP_4Mismatch
4TAP 5 outputGNDMismatch
5GNDTAP_5Mismatch
6TAP 4 outputTAP_3Mismatch
7TAP 2 outputTAP_1Mismatch
8INVCCMismatch
Additional symbol issues:
  • Every terminal has Pin Type = Unspecified.
  • Expected types are: IN = input; TAP1–TAP5 = outputs; VCC = power input; GND = ground/power input.
  • Pin descriptions are absent.
  • Section, Pin Group, Pin Orientation, and Terminal Order are not defined.
Footprint review
  • Footprint asset: SOIC127P600X175-8N.kicad_mod
  • 8 rectangular SMD pads, numbered 1–8
  • 1.27 mm pitch
  • Pad size approximately 0.65 × 1.525 mm
  • Fabrication body approximately 3.90 × 4.90 mm
  • Pin-1 marking present
  • Geometry is consistent with a standard 8-lead 150 mil narrow SOIC and broadly matches ADI outline 21-0041 / land pattern 90-0096.
The footprint geometry and pad count are suitable, but the logical terminal-to-pad mapping inherits the incorrect pin assignments above. No symbol or footprint edits were made during this audit.
3D model
A dedicated DS1100Z-50+.stp model is assigned at origin, 0° rotation, 1:1 scale. Detailed mechanical conformity could not be confirmed from the structured model metadata, so exact body and lead alignment remains uncertain.
Key specifications
  • Function: five-tap fixed silicon delay line
  • Supply: 4.75–5.25 V, nominal 5 V
  • Operating temperature: −40°C to +85°C
  • Nominal tap delays: 10, 20, 30, 40, and 50 ns
  • Delay tolerance for ≤40 ns taps: ±2 ns at 25°C, ±3 ns over 0–70°C, ±4 ns over −40–85°C
  • Delay tolerance for >40 ns taps: ±5%, ±8%, and ±13% over those respective ranges
  • Logic thresholds: VIH ≥ 2.2 V; VIL ≤ 0.8 V
  • Output capability: IOH −1 mA at VOH = 4 V; IOL 12 mA at VOL = 0.5 V; up to ten 74LS loads per tap
  • Active supply current at 1 MHz: 30–50 mA with outputs open
  • Input leakage: ±1 µA
  • Input capacitance: 5 pF typical, 10 pF maximum
  • Power-up time: 200 µs maximum
  • Minimum input pulse width for the 50 ns version: nominally 10 ns
  • Absolute pin voltage: −0.5 V to +6.0 V
  • Datasheet notes that decoupling and PCB layout affect delay accuracy near maximum frequency.
Conclusion
The MPN, manufacturer, pin count, functional description, and general SOIC-8 footprint geometry are credible. The critical defect is the complete reversal/misassignment of all eight terminal functions to physical pin numbers; using the part as currently mapped would connect every signal and supply to the wrong package lead. The missing Part Type, unspecified electrical pin types, and absent pin descriptions are secondary metadata/symbol-quality issues.
  • Datasheet

  • Metadata review

  • Pinout cross-check

  • Footprint review

  • 3D model

  • Key specifications

  • Conclusion