Part Review and Datasheet Update

A

adrian95

Review all available part information (MPN, package, pin count, description, properties). If no datasheet URL is already set, search the web for the official datasheet and update the part's Datasheet property with the URL. Then cross-check the schematic symbol, footprint, and pin descriptions against the datasheet. Summarize key specs and flag any mismatches.

flux

I’ll review the part metadata, find and attach the official datasheet if missing, then cross-check pins/symbol/footprint against the datasheet and report any mismatches.

flux

Completed the DRV8212DSGR part review and saved the detailed report in drv8212dsgr-part-datasheet-review. The pinout matches the TI datasheet, but pin types/descriptions are incomplete, the stored datasheet URL is not the canonical TI URL, and the footprint land pattern is slightly larger than TI’s example.
Suggested next steps:
  • Update the Datasheet URL to TI’s official link.
  • Populate pin types and pin descriptions.
  • Verify/adjust the footprint against the TI land pattern before release.
Fix metadata, URL, footprint
Fix part issues
Use TI datasheet URL
Adjust footprint land pattern
Run part checks
Sign up to send

Files

Pins

Symbol

Layout

3D View

DRV8212DSGR Part Datasheet Review
Scope
Reviewed project part metadata, schematic terminals, PCB footprint data, and available datasheet information for DRV8212DSGR.
Part Metadata Found
Note: The part already had a Datasheet URL property set, so I did not overwrite it. The current URL is a stored PDF copy; the canonical TI URL above can be used if you want the property changed to the official source URL.
Key Datasheet Specs
  • Device: DRV8212 11-V H-bridge motor driver with PWM, PH/EN, and half-bridge control interfaces
  • Package/orderable: DRV8212DSGR, DSG WSON-8 with exposed thermal pad
  • Body size: 2.0 mm × 2.0 mm nominal
  • Height: 0.8 mm max
  • Pitch: 0.5 mm
  • Motor supply VM: 0 V to 11 V recommended, 12 V abs max
  • Logic supply VCC: 1.65 V to 5.5 V recommended
  • Logic inputs: compatible with 1.8 V, 3.3 V, and 5 V logic
  • Output current: up to 4 A peak full-bridge / per half-bridge, 8 A peak with parallel half-bridge mode; thermal limits apply
  • On resistance: 280 mΩ typical total HS+LS, 140 mΩ typical per FET
  • PWM frequency: 0 to 100 kHz
  • Protection: VCC UVLO, output overcurrent protection, thermal shutdown
  • Required bypassing: 0.1 µF ceramic from VM to GND plus VM bulk capacitance; 0.1 µF ceramic from VCC to GND
Datasheet Pinout Cross-Check

Table

PinDatasheet nameDatasheet type/functionProject terminalResult
1VMMotor power supplyVMMatch
2OUT1H-bridge outputOUT1Match
3OUT2H-bridge outputOUT2Match
4GNDGroundGNDMatch
5IN2/ENControl input, internal pulldownIN2/ENMatch
6IN1/PHControl input, internal pulldownIN1/PHMatch
7MODETri-level mode input referenced to VCCMODEMatch
8VCCLogic supplyVCCMatch
9EP / exposed thermal padThermal pad, connect to system groundEPMatch, but description should explicitly say connect to GND
Symbol Review
Matches
  • All 9 project terminals exist and pin numbers match the DSG WSON datasheet pinout.
  • Pin naming matches TI functional naming, including alternate input labels IN1/PH and IN2/EN.
  • The exposed pad is represented as pin 9 / EP.
Issues / Improvements
  • All terminal Pin Type properties are currently Unspecified. Suggested types:
    • VM, VCC: Power In
    • GND, EP: Ground
    • OUT1, OUT2: Output
    • IN1/PH, IN2/EN, MODE: Input
  • Pin descriptions are not populated. Suggested descriptions:
    • VM: Motor power supply; bypass to GND with 0.1 µF ceramic plus bulk capacitance.
    • OUT1/OUT2: H-bridge outputs; connect to motor/load.
    • GND: Device/system ground.
    • IN2/EN and IN1/PH: H-bridge control inputs with internal pulldowns.
    • MODE: Tri-level control mode input; low = PWM, high = PH/EN, Hi-Z = half-bridge.
    • VCC: Logic power supply; bypass to GND with 0.1 µF ceramic.
    • EP: Exposed thermal pad; solder and connect to system ground.
Footprint Review
Footprint Found
  • Asset: SON50P200X200X80-9N.kicad_mod
  • Description: DSG0008A_2022
  • Pads: 8 perimeter SMD pads plus exposed pad 9
  • Body/fab outline: 2.0 mm × 2.0 mm nominal
  • Pad pitch: 0.5 mm
  • Exposed pad: 1.0 mm × 1.7 mm in the footprint
  • Perimeter pads: 0.3 mm × 0.7 mm in the footprint
Datasheet Mechanical / Land Pattern Reference
  • Package: DSG0008A WSON-8, 2.0 mm × 2.0 mm, 0.5 mm pitch, 0.8 mm max height
  • Lead width: 0.18 mm to 0.32 mm
  • Lead length: 0.2 mm to 0.4 mm
  • Exposed thermal pad package dimension: 1.6 ± 0.1 mm × 0.9 ± 0.1 mm
  • Example board layout signal pads: 0.25 mm × 0.5 mm
  • Example board layout exposed pad land: 1.6 mm × 0.9 mm
Footprint Assessment
  • Package family/body/pin count/pitch: Match.
  • Pin numbering/location: Matches standard DSG top-view mapping: pins 1–4 left side, pins 5–8 right side, exposed pad 9 center.
  • Signal pad size: Footprint uses 0.3 mm × 0.7 mm; TI example board layout shows 0.25 mm × 0.5 mm. This is slightly larger than the example land pattern and should be reviewed against assembly-house rules.
  • Exposed pad size/orientation: Footprint uses 1.0 mm × 1.7 mm versus TI example around 0.9 mm × 1.6 mm, likely a slightly enlarged/rotated equivalent. This is close but should be verified with the land-pattern drawing before release.
  • Paste aperture: No detailed split-paste/stencil definition was verified beyond the KiCad pad paste layer. TI recommends controlled exposed-pad paste coverage around 87% for 0.125 mm stencil.
Mismatch Summary
  1. No critical pinout mismatch found. Schematic terminal names and pin numbers match the datasheet.
  2. Pin metadata incomplete: pin types are all Unspecified and pin descriptions are missing.
  3. Datasheet property is set but not canonical TI URL: current URL points to a stored PDF copy; official URL is https://www.ti.com/lit/ds/symlink/drv8212.pdf.
  4. Footprint is close but not identical to TI example land pattern: perimeter and exposed-pad dimensions are slightly larger than the datasheet example board layout.
  5. Exposed pad connectivity note: EP exists as pin 9, but should be described as and normally connected to system ground in consuming schematics.

  • Scope

  • Part Metadata Found

  • Key Datasheet Specs

  • Datasheet Pinout Cross-Check

  • Symbol Review

  • Matches

  • Issues / Improvements

  • Footprint Review

  • Footprint Found

  • Datasheet Mechanical / Land Pattern Reference

  • Footprint Assessment

  • Mismatch Summary