DRV2901 Part Review

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DRV2901DDV Part Information Review

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Review date: 2026-07-20 Part project: DRV2901DDV

flux

Completed the review and added the official TI datasheet URL: https://www.ti.com/lit/ds/symlink/drv2901.pdf.
I created the full findings in DRV2901DDV Part Information Review. Key result: the symbol pinout is functionally correct, but the part needs cleanup before production use — pin types/descriptions are missing, the active-low pin names differ from TI labels, the MPN should likely be the orderable DRV2901DDVR, and the footprint appears to be missing the exposed PowerPAD thermal pad.
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cherepanyadima

Check this schematic component against the datasheet for [MPN] and assign the correct pin orientation, section, and terminal order without changing, replacing, renumbering, or remapping any pins. Place Power pins first , Ground pins last , and distribute all other pins evenly along the left and right edges so the symbol remains compact, balanced, and approximately symmetrical. If a pin function is unclear, assign Unclear / Check datasheet, then apply all changes directly to the schematic component.

flux

I’ll update the existing DRV2901 terminals in place: set orientation/section/order from the TI datasheet while preserving every current pin number and terminal mapping.

flux

Updated the DRV2901 schematic component in place against the TI datasheet. I preserved all existing pin numbers, designators, and mappings.
Open items:
  • No unclear pins were found; all terminals were assigned to Power, Signal, No Connect, or Ground.
  • Pin types/descriptions were not changed because your request was limited to orientation, section, and terminal order.
Suggested next steps:
  1. Update pin types and pin descriptions from the datasheet for better ERC behavior.
  2. Correct the footprint PowerPAD issue flagged earlier.
  3. Set the orderable MPN to DRV2901DDVR if this part should be BOM-ready.
Fix metadata and footprint
Update pin metadata
Fix PowerPAD footprint
Set orderable MPN
Run part review
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Files

Pins

Symbol

Layout

3D View

GND
Pin Number
6
GND_B
Pin Number
30
PWM_A
Pin Number
8
GND
Pin Number
39
BST_A
Pin Number
34
GND
Pin Number
14
VREG
Pin Number
15
NC
Pin Number
19
GND
Pin Number
29
AGND
Pin Number
11
RESET_N
Pin Number
7
NC
Pin Number
24
NC
Pin Number
42
GND
Pin Number
38
VREG
Pin Number
13
RESET_N
Pin Number
17
NC
Pin Number
3
NC
Pin Number
25
GVDD_B
Pin Number
23
VREG
Pin Number
12
GVDD_A
Pin Number
44
GND
Pin Number
10
PVDD_B
Pin Number
32
NC
Pin Number
43
NC
Pin Number
4
NC
Pin Number
27
OUT_B
Pin Number
31
GND
Pin Number
18
SD_N
Pin Number
5
NC
Pin Number
26
GVDD_B
Pin Number
22
PVDD_A
Pin Number
35
PWM_B
Pin Number
16
OC_ADJ
Pin Number
9
OUT_A
Pin Number
36
GND
Pin Number
28
GVDD_A
Pin Number
1
NC
Pin Number
41
VDD
Pin Number
21
BST_B
Pin Number
33
GND_A
Pin Number
37
NC
Pin Number
20
OTW_N
Pin Number
2
NC
Pin Number
40
DRV2901DDV Part Information Review
Review date: 2026-07-20
Part project: DRV2901DDV
Official datasheet URL set on part: https://www.ti.com/lit/ds/symlink/drv2901.pdf
Scope
Reviewed available part metadata, schematic symbol terminals, PCB footprint pads, and official Texas Instruments datasheet/package information for the DRV2901 family in the DDV package.
Current Flux Part Metadata

Table

FieldCurrent value / observation
Project / part nameDRV2901DDV
DescriptionPiezo-Electric Actuator Controller PMIC 44-HTSSOP
Manufacturer nameTexas Instruments
Manufacturer Part NumberDRV2901DDV
Datasheet URLhttps://www.ti.com/lit/ds/symlink/drv2901.pdf
Part typeIntegrated Circuit
Designator prefixU
Symbol styleparametric-v1
Schematic terminals44 Terminal entries
PCB signal pads found44 pads
Net count0, as expected for a standalone published part
Official Datasheet / Vendor Information

Table

ItemDatasheet / TI value
DeviceDRV2901
Official orderable MPN foundDRV2901DDVR
StatusActive / production
DescriptionSingle-channel PWM-input piezo transducer driver for ultrasonic cleaning with wide supply voltage
PackageHTSSOP (DDV), 44 pins, PowerPAD
Package size listed in datasheet14.0 mm x 8.1 mm
Package option addendumHTSSOP (DDV) | 44, large tape-and-reel, 2000 qty
Operating temperature0°C to 125°C
RoHSYes
MSL / peak reflowLevel-3-260C-168 HR
Part markingDRV2901
Key Electrical Specs

Table

SpecValue
Headline supply operation12 V to 48 V
PVDD_X recommended operating range0 V min, 50 V typ, 52.5 V max
GVDD_X recommended range10.8 V to 13.2 V, 12 V typ
VDD recommended range10.8 V to 13.2 V, 12 V typ
Peak powerUp to 50 W peak
Output MOSFET RDS(on)90 mΩ typ high-side and low-side at TJ = 25°C, GVDD = 12 V
PWM frequency20 kHz to 600 kHz
Minimum output-filter inductance5 µH min, 10 µH typ
VREG2.95 V min, 3.3 V typ, 3.65 V max
VDD supply current10 mA typ operating, 6 mA typ reset mode
Gate supply current per half-bridge8 mA typ at 50% duty, 0.3 mA typ reset mode
Half-bridge idle current15 mA typ at 50% duty without output filter/load; 500 µA typ reset/no switching
Logic input thresholdsVIH = 2 V, VIL = 0.8 V
SD / OTW sink current abs max9 mA
OTW threshold115°C min, 125°C typ, 135°C max
Overtemperature error145°C min, 155°C typ, 165°C max
Overcurrent response time250 ns typ
OC programming resistor range22 kΩ to 69 kΩ, 5% tolerance
Important Absolute Maximum Ratings

Table

ParameterRating
VDD to AGND-0.3 V to 13.2 V
GVDD_X to AGND-0.3 V to 13.2 V
PVDD_X to GND_X-0.3 V to 71 V
OUT_X to GND_X-0.3 V to 71 V
BST_X to GND_X-0.3 V to 79.7 V
VREG to AGND-0.3 V to 4.2 V
PWM_X, OC_ADJ, M1, M2, M3 to AGND-0.3 V to 4.2 V
RESET_X, SD, OTW to AGND-0.3 V to 7 V
Maximum operating junction temperature0°C to 125°C
Storage temperature-40°C to 125°C
Datasheet-Required External Components / Pin Notes

Table

Pin / groupDatasheet requirement or note
BST_A / BST_BExternal 0.1 µF capacitor to OUT_A / OUT_B required
GVDD_A / GVDD_B0.1 µF capacitor to AGND required
PVDD_A / PVDD_BClose decoupling required: 0.01 µF in parallel with 1.0 µF to GND_A / GND_B
VDD47 µF in parallel with 0.1 µF to GND required
VREG0.1 µF capacitor to AGND required
OC_ADJResistor to ground required for analog overcurrent programming
OTWOpen-drain, active-low overtemperature warning
SDOpen-drain, active-low shutdown signal
RESETActive-low reset for half-bridges A and B
NC pinsDo not connect
Symbol Pinout Cross-Check
The symbol terminal pin-number mapping is functionally correct against the TI datasheet. Active-low signals are named with _N in the Flux symbol while TI omits the suffix and states active-low behavior in the descriptions.

Table

PinFlux terminalDatasheet pinResult
1GVDD_AGVDD_AMatch
2OTW_NOTWFunctional match; naming convention differs
3NCNCMatch
4NCNCMatch
5SD_NSDFunctional match; naming convention differs
6GNDGNDMatch
7RESET_NRESETFunctional match; naming convention differs
8PWM_APWM_AMatch
9OC_ADJOC_ADJMatch
10GNDGNDMatch
11AGNDAGNDMatch
12VREGVREGMatch
13VREGVREGMatch
14GNDGNDMatch
15VREGVREGMatch
16PWM_BPWM_BMatch
17RESET_NRESETFunctional match; naming convention differs
18GNDGNDMatch
19NCNCMatch
20NCNCMatch
21VDDVDDMatch
22GVDD_BGVDD_BMatch
23GVDD_BGVDD_BMatch
24NCNCMatch
25NCNCMatch
26NCNCMatch
27NCNCMatch
28GNDGNDMatch
29GNDGNDMatch
30GND_BGND_BMatch
31OUT_BOUT_BMatch
32PVDD_BPVDD_BMatch
33BST_BBST_BMatch
34BST_ABST_AMatch
35PVDD_APVDD_AMatch
36OUT_AOUT_AMatch
37GND_AGND_AMatch
38GNDGNDMatch
39GNDGNDMatch
40NCNCMatch
41NCNCMatch
42NCNCMatch
43NCNCMatch
44GVDD_AGVDD_AMatch
Footprint Cross-Check

Table

FeatureObserved in Flux footprintDatasheet / TI package infoResult
Signal pad count44 pads44 leads / signal landsMatch
Pin pitch~0.635 mm inferred from pad spacing0.635 mmMatch
Row spacing~7.45 mm inferred from pad centersTI example board layout references ~7.5 mm signal row spacingClose / likely acceptable
Signal pad size~1.955 mm x 0.392 mm inferred from tool valuesTI package drawing example land size: 1.45 mm x 0.40 mmPossible mismatch; may be IPC-derived but should be checked
Footprint labelDDV0044A-IPC_ACurrent TI package drawing found as DDV0044D PowerPAD TSSOPRevision/package-drawing mismatch risk
Exposed thermal padNo separate thermal / PowerPAD pad node foundPackage is 44-pin HTSSOP PowerPAD with exposed pad approx. 6.72–7.30 mm x 3.85–4.43 mmSignificant mismatch / production risk
Flagged Mismatches and Risks
  1. Missing exposed PowerPAD thermal pad in footprint — significant issue. The datasheet identifies the package as a 44-pin HTSSOP PowerPAD, and TI package drawing DDV0044D includes an exposed pad approximately 6.72–7.30 mm x 3.85–4.43 mm. The current Flux footprint inspection found only 44 signal pads and no separate exposed thermal pad node. This can affect solderability, mechanical robustness, and thermal performance.
  2. Pin metadata is incomplete. All schematic terminals currently have Pin Type = Unspecified, and no terminal-level pin descriptions are populated. The datasheet provides clear pin types: power, input, output/open-drain, output, and NC. This reduces ERC quality and usability.
  3. Active-low pin names differ from datasheet labels. Flux uses OTW_N, SD_N, and RESET_N; TI labels these pins OTW, SD, and RESET and describes active-low behavior. This is not a functional pinout error, but it is a datasheet naming mismatch.
  4. MPN property is not the active orderable TI number. The part property is DRV2901DDV, while TI’s active orderable part number is DRV2901DDVR. DDV is the package code; R indicates tape-and-reel. For sourcing/BOM use, prefer DRV2901DDVR or add it as the orderable part number.
  5. Footprint package drawing revision should be reviewed. The footprint is labeled DDV0044A-IPC_A, while the current TI package drawing located for the DDV PowerPAD TSSOP-44 is DDV0044D. This does not automatically prove incompatibility, but the land pattern should be verified against TI’s current package drawing before production.
  6. Signal pad length may differ from TI example land pattern. The footprint appears to use ~1.955 mm pad length versus TI’s extracted example land length of 1.45 mm, while width is close. This may be an IPC-derived footprint, but it should be checked with the official TI drawing/land-pattern guidance.
Overall Conclusion
The schematic symbol pin-number mapping is functionally correct for the DRV2901 DDV package. The most important issues are metadata completeness and footprint correctness: pin types/descriptions are missing, and the footprint appears to lack the exposed PowerPAD thermal pad required by the package. The part should not be treated as production-ready until the thermal pad and current TI DDV land pattern are verified or corrected.

  • Scope

  • Current Flux Part Metadata

  • Official Datasheet / Vendor Information

  • Key Electrical Specs

  • Important Absolute Maximum Ratings

  • Datasheet-Required External Components / Pin Notes

  • Symbol Pinout Cross-Check

  • Footprint Cross-Check

  • Flagged Mismatches and Risks

  • Overall Conclusion