Datasheet Audit


Thought for 3 mins 7 sec
Thought for 8 sec
Getting project info.
Thought for 11 sec
Reading project assets.
Thought for 11 sec
Thought for 6 sec
1/2 Restore MPN and use supplied PDF URL to finish datasheet-backed part corrections.

Restore MPN and use supplied PDF URL to finish datasheet-backed part corrections.

Verify corrections and summarize any remaining blockers.

Thought for 7 sec
Awaiting 1 task
"DPS310XTSA1 Part Audit" completed.
The supplied PDF is now readable, and I restored the MPN to DPS310XTSA1. I’m applying its confirmed specifications and pin functions; pressure precision will be recorded as RMS noise, not as an accuracy tolerance.
Thought for 13 mins 12 sec
Thought for 6 sec
Awaiting 1 task
"DPS310XTSA1 Part Audit" completed.
Thought for 2 mins 54 sec
Thought for 7 sec
Managing 1 task
Thought for 14 sec
2/2 Verify corrections and summarize any remaining blockers.

Restore MPN and use supplied PDF URL to finish datasheet-backed part corrections.

Verify corrections and summarize any remaining blockers.

Thought for 17 sec
Awaiting 1 task
"DPS310XTSA1 Datasheet Verification" completed.
Using the PDF, I corrected the description/specifications, package designation, all eight pin descriptions, and pin types, and restored the MPN to DPS310XTSA1. My earlier claim that the pad mapping was reversed was incorrect; the mapping matches the datasheet and was left unchanged.
The changes are saved but not published; exact land, mask, and paste dimensions still need package-drawing verification, and paste output needs a Gerber check before fabrication—details are in Part Correction Audit.

Part Correction Audit
Latest outcome — 2026-10-26
Metadata and pin corrections completed and read back. Existing pin-to-pad mapping is correct against the actual datasheet top-view drawing; no pad relocation is needed. This supersedes the earlier unverified X-mirror hypothesis and prior web-scrape interpretation. Paste/mask dimensional certification and genuine paste correction remain blocked; no publication or replacement was performed. Project/MPN/pin identities and connections were preserved.

Table


Assigned itemStatusResult
Part TypeCompleted earlierSensors, → Sensor, commit c5a88086
Accidental MPN overwriteCompleted earlierSupplied URL → DPS310XTSA1, commit 1418019a
Description/specificationsCompletedQualified RMS noise, supply rails, ranges, interfaces and accuracy conditions; removed None and Unavailable stock/placeholder text. Commits c90e5ebe, final 4de7e164.
Package/category propertiesCompleted8-LGA → PG-VLGA-8-1; added Sensor Type Pressure, Operating Temperature -40 to +85 °C, commit d2f12914.
Pin descriptions/typesCompletedEight short descriptions added; SDO Output → Bi-Directional; both GND Power In → Ground. Commit a29dd2ed.
Pin names/numbers/symbol identityCompleted inspection; preservedAll eight names/numbers valid; ~CSB denotes active-low CSB and GND__1 uniquely identifies the second GND. No renumbering, renaming or position change.
Physical terminal mappingCompleted verification; no edit requiredActual Figure 1 has 1–4 on RIGHT, 8–5 on LEFT, top-to-bottom. Current pad coordinates match.
Copper dimensional certificationUnattempted correction; unresolvedExisting 0.35 mm square pads and 1.45 mm column spacing retained; detailed package/land-pattern PDF could not be retrieved for visual certification. Row pitch matches section 9.
Paste/mask correctionUnattempted; blockedDetailed aperture/mask source unavailable and generated paste export unverified. Imported paste circles reside in disabled Silk Shapes; no unsupported aperture rewrite.
Pin-1 silk markerUnattempted correctionSource marker exists in disabled shapes; no active standalone pin-1 marker identified. Remains an explicit footprint usability limitation.
Readback and reportCompletedFresh project metadata, symbol image/pins, pad tree, and five component-review categories checked.
No geometry, mask, paste, silk, STEP-model, connection or official Datasheet URL changes were made. The package-property edit is descriptive metadata on this non-generic part, not a footprint substitution. Tool warnings that part-level properties are non-standard project categories did not prevent the writes; readback confirms correct names/values. PG-VLGA-8-1 is an intentional manufacturer-specific value outside generic autocomplete options.
Authoritative evidence and provenance
User-supplied Infineon V1.2 (2020-10-15) PDF mirror, now successfully indexed and also downloaded as a PDF for visual inspection: https://4donline.ihs.com/images/VipMasterIC/IC/INFN/INFN-S-A0011520292/INFN-S-A0011520292-1.pdf?hkey=61A2E4C270F0397D049F8F05BD4F1054
Earlier retrieval failures and pending status are historical, not current blockers for metadata or pin functions. Three settled queries returned verified evidence, with subsequent focused accuracy queries resolving the remaining numeric claims.

Table


Source locationVerified fact and applied decision
Section 2.1, Table 2, p51 GND, 2 CSB, 3 SDI, 4 SCK, 5 SDO, 6 VDDIO, 7 GND, 8 VDD; SPI/I2C multiplexed functions support descriptions and electrical types.
Section 3.1, Table 3, p6Pressure 300–1200 hPa; temperature -40 to +85 °C; VDD 1.7–3.6 V; VDDIO 1.2–3.6 V.
Section 3.5, Table 7, p9Typical pressure precision: Low Power 1.0 Pa RMS, Standard 0.35 Pa RMS, High Precision 0.2 Pa RMS; average standard deviation, not absolute accuracy. Typical conditions VDD=VDDIO=1.8 V, PA=1000 hPa, TA=25 °C.
Section 3.5, Table 7, p9Typical relative accuracy ±6 Pa for any 1 hPa change within 800–1200 hPa at constant temperature within 20–60 °C. Typical calibrated temperature sensitivity 0.5 Pa/K at 1000 hPa, 25–65 °C.
Section 3.4, Table 6, p8Typical temperature accuracy ±0.5 °C at VDD=VDDIO=1.8 V, PA=1000 hPa, TA=25 °C; not a guaranteed maximum.
Section 9, p388-pin PG-VLGA-8-1, 2.0 × 2.5 × 1.0 mm body and 0.65 mm pitch.
Evidence handles:
  • Pin functions: dsq_0b02802fd1dd93423245, ds1–ds8.
  • Operating conditions/noise: dsq_11d01c8bc0318203bb4d, ds1–ds13.
  • Package: dsq_d3b8a4d928d5f76913c2, ds1.
  • Relative accuracy: dsq_7c87c2d0826c1e9c7afd, ds3 (other claims from that particular query were initially unverified and were not relied upon).
  • Temperature accuracy: dsq_49ee2bce24c931693a48, ds1–ds2.
  • Temperature sensitivity: dsq_6829361bb1f17c42d800, ds1.
Description before and after
Before: imported multi-line description advertised Sensors precision 0.005hPa, unqualified relative/temperature accuracy and sensitivity, LGA-8, duplicated manufacturer/MPN, plus None and Unavailable.
After (fresh project readback):
Infineon DPS310 digital barometric pressure and temperature sensor. Operating range: 300–1200 hPa, -40 to +85 °C. Supplies: VDD 1.7–3.6 V; VDDIO 1.2–3.6 V. I2C and 3-/4-wire SPI. Typical pressure precision (noise): 0.2 Pa RMS High Precision, 0.35 Pa RMS Standard, 1.0 Pa RMS Low Power; typical conditions VDD = VDDIO = 1.8 V, 1000 hPa, 25 °C. Precision is average standard deviation, not absolute accuracy. Typical relative pressure accuracy: ±6 Pa (±0.06 hPa) for a 1 hPa change within 800–1200 hPa at constant temperature within 20–60 °C. Typical temperature accuracy: ±0.5 °C at 25 °C, 1000 hPa, VDD = VDDIO = 1.8 V. Typical calibrated pressure temperature sensitivity: 0.5 Pa/K at 1000 hPa, 25–65 °C. Package PG-VLGA-8-1, 8 pins, 2.0 × 2.5 × 1.0 mm, 0.65 mm pitch.
The per-claim evidence is in the table above. No availability claim replaces Unavailable. No arbitrary nominal voltage property was added to misrepresent two supply ranges. Role and Role Details remain absent because no local served circuit target exists; Design Note was not misused for specifications or change history.
Final pin table, read back
All descriptions were previously absent. Pin names, numbers, terminal UIDs and Symbol Pin Position values were preserved. Table 2 supports the functions below.

Table


PinTerminalType before → afterPin Description after
1GNDPower In → GroundGround reference
2~CSBInput → InputActive-low SPI chip select
3SDIBi-Directional → Bi-DirectionalSPI/I2C serial data input/output
4SCKInput → InputSPI/I2C serial clock input
5SDOOutput → Bi-DirectionalSPI output / interrupt / I2C address-select
6VDDIOPower In → Power InDigital and I/O supply
7GND__1Power In → GroundGround reference
8VDDPower In → Power InAnalog block supply
SDO is represented by one conservative electrical type covering its input and output roles, not a claim that SPI data flows bidirectionally on SDO. It is unused in ordinary 3-wire SPI, interrupt output in interrupt-enabled 3-wire SPI, data output in 4-wire SPI, and address LSB input with optional interrupt in I2C. SDI is input-only in 4-wire SPI but bidirectional in other listed modes. CSB may be open with its internal pull-up or tied to VDDIO in I2C. Full mode-dependent meaning stays here rather than overloading the short pin label.
Actual Figure 1 inspection — correction to previous audit
The query confirmed that Figure 1 is a top view, not to scale, but explicitly could not determine left/right placement from OCR alone.
Separate manual visual verification: downloaded supplied PDF with curl (valid PDF 1.7, about 749 kB), rendered p5 with pdftoppm, and viewed it in the computer GUI. The visible actual figure has VDD/8 at upper LEFT, then GND/7, VDDIO/6, SDO/5 down that side; GND/1 at upper RIGHT, then CSB/2, SDI/3, SCK/4 down the right side. Thus the earlier web scrape saying pins 1–4 on the left was wrong. The visual diagram also shows the vent near lower left. This manual drawing check is distinct from machine-verified text extraction and does not establish exact pad dimensions from a not-to-scale figure.
Working evidence files retained on stopped computer datasheet-visual: /root/work/datasheet/dps310.pdf, /root/work/datasheet/pinout.png. Computer stopped after inspection.
Final pin-to-pad/coordinate table
Fresh get_layout pad readback after edits confirms all eight original pad UIDs, sizes and positions unchanged. Coordinates below are mm, +X right and +Y up. All pads active, Top, rectangular, 0.35 × 0.35 mm, zero rotation. Coordinate order matches the manually inspected Figure 1; pad-size/column-spacing certification remains unresolved.

Table


PinTerminalPad UIDX mmY mm
1GNDe892d454-225f-41be-ba41-d39a6fe9b61f+0.725+0.975
2~CSBf7596bf8-0bf8-411d-a2f1-5dd7914ecb95+0.725+0.325
3SDId66dbf88-ded3-4fc1-849a-b170112de59b+0.725-0.325
4SCKb2af85fa-0adb-41b0-b110-a21b50bb2172+0.725-0.975
5SDO2dcd3a8e-3e1a-4df7-a2ac-8140ea7d74e6-0.725-0.975
6VDDIOb2375390-eee2-487e-a5c6-2c84eb732a61-0.725-0.325
7GND__13d6b8b38-d87c-425f-9df1-44ebc9edf027-0.725+0.325
8VDD5dacb7d8-fa6d-41d4-9a4e-b30f9746a469-0.725+0.975
Derived actual row pitch 0.65 mm; column separation 1.45 mm. KiCad asset Y-down to Flux Y-up conversion explains sign reversal: source pad 1 (0.725,-0.975) becomes Flux (0.725,+0.975). No physical terminal identity swap exists.
Paste/mask and remaining footprint limitations
Footprint UID 0c274499-f941-4603-9a86-6e7fdbe2526e.defaultFootprint, asset XDCR_DPS310XTSA1.kicad_mod.
Observed existing source asset and rules:
  • Eight pads have (layers F.Cu F.Mask), no F.Paste, and source solder-mask margin 0.102 mm.
  • Eight F.Paste circles have centerline radius 0.0875 mm, stroke width 0.175 mm (outer diameter 0.35 mm). Graphic circles do not by themselves prove the original KiCad Gerber would be empty.
  • In Flux those circles were imported into Silk Shapes with silk/courtyard graphics, and that node is disabled by override 96bc42de-2ee0-4b2c-9f5e-87e9060834e8, active:false !important. They are not active dedicated paste apertures in the inspected tree.
  • Fab Shapes and VALUE are disabled; two horizontal line nodes active. Original pin-1 dot is in disabled shapes at source (+1.52,-1.1), consistent with pad-1 side, but no active standalone marker was identified.
  • Pad readback does not expose enough effective aperture data to certify automatically generated paste. Prior Top Solder Paste layout_2d showed only a generic 100 mm board outline, not the footprint; this does not prove an empty manufactured paste layer. Gerber export was not attempted.
Detailed drawing lookup attempts:
  1. Official package page: https://www.infineon.com/package/PG-VLGA-8-1 — no usable drawing URLs exposed; direct download empty.
  2. Manufacturer-authored package overview mirror discovered at https://e-nexty.dxp.nexty-ele.com/product_files/download?lc_code=ja&maker_code=INFINEON&product_file_id=3713220&product_id=5586274&product_part_number=DPS310&search_log_id=6435185 — search text mentions copper, mask, stencil and dimensions, but drawing query remains evidence_pending; direct download returned 118-byte HTML, not PDF. Snippets were not used to alter geometry.
  3. Official legacy package drawing URL discovered from a BDTIC index: https://www.infineon.com/dgdl/Infineon-PG-VLGA-8-1_DPS310XTSA1-PD-v01_00-EN.pdf?fileId=5546d46254e133b40154f2cdf4410edc — direct download returned empty file; rendering failed.
Unresolved: exact recommended copper/mask/stencil geometry and manufacture-layer output. Obtain a local copy of the PG-VLGA-8-1 package overview/drawing, or allow its pending indexing to settle, then implement actual paste apertures only if confirmed. Do not mirror or reorder pads: actual datasheet Figure 1 already matches them. Preserve existing pin IDs. No duplicate quality ticket was filed.
Final verification
  • get_project: final description, PG-VLGA-8-1, Pressure, temperature range, correct MPN and unchanged official Datasheet URL confirmed.
  • get_symbol pins and image: eight pins present once, updated electrical types and descriptions visible/readable. Explicit Symbol Pin Position values unchanged; parametric grouping fields still blank. No unsupported symbol redesign made.
  • get_layout pad tree: eight original pads active with unchanged dimensions and coordinates, even after package metadata change.
  • Component review at 2026-10-26T16:42:19.429Z: Incomplete Project Info, Missing Properties, Missing Terminals, Missing Parametric Symbol Properties and Excluded Terminal all Success, zero reported errors/warnings. These automated checks do not certify detailed paste/mask geometry or fabrication readiness.
This batch completes supported metadata/pin corrections and disproves the alleged mirrored terminal mapping. The overall correction task is not fabrication-complete until paste/mask and marker limitations are resolved. No publication was performed.
  • Latest outcome — 2026-10-26

  • Authoritative evidence and provenance

  • Description before and after

  • Final pin table, read back

  • Actual Figure 1 inspection — correction to previous audit

  • Final pin-to-pad/coordinate table

  • Paste/mask and remaining footprint limitations

  • Final verification