Part Audit Review
Fix the metadata, terminal names/types/descriptions, and exposed-pad footprint per the TI datasheet.
Thought for 16 sec
I’ll apply the TI-backed metadata, fully define all 65 terminals, correct the PowerPAD geometry, then re-inspect the symbol and footprint against PAP0064F.
Worked for 4 mins 26 sec
Metadata and all terminals are updated; I’m doing the final readback of pin mapping, rendered symbol, and the corrected 6.5 × 8.0 mm PowerPAD.
Worked for 1 min 9 sec
Updated the part to TI’s BQ79616PAPRQ1 data: official datasheet, PAP0064F package metadata, and all 65 terminals now have correct names, electrical types, descriptions, grouping, and pin numbers. The centered PowerPAD is corrected to 6.5 × 8.0 mm, with reduced paste coverage.
- Open item: Paste is a reduced single 3.5 × 5.0 mm aperture; segmented stencil apertures require rebuilding/augmenting the footprint geometry.
- Verification confirms 65 unique terminals, 65 mapped pads, and no reported part-review findings.
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Part Audit Report
Scope
Audit of project metadata, schematic symbol terminals, and PCB footprint against Texas Instruments BQ7961x-Q1 datasheet Rev. F (June 2026) and PAP0064F package information.
Authoritative references
- TI datasheet: https://www.ti.com/lit/ds/symlink/bq79616-q1.pdf
- TI product page: https://www.ti.com/product/BQ79616-Q1
The project already has a Datasheet URL populated, so it was not overwritten. The attached PDF identifies itself as the official TI datasheet, Rev. F.
Current metadata
Table
| Field | Current value | Audit |
|---|---|---|
| Project/part name | PBQ79616PAPTQ1 | Mismatch / questionable MPN |
| Manufacturer Part Number | PBQ79616PAPTQ1 | Mismatch: leading P is not part of the TI device MPN. Current TI orderable addendum lists BQ79616PAPRQ1; BQ79616PAPTQ1 appears in TI support discussions but is not in the current orderable table. |
| Manufacturer | Texas Instruments | Correct |
| Description | BQ7961x-Q1 family, 12S/14S/16S automotive battery monitor/balancer/protector | Functionally correct, but SafeTITM-26262 is malformed wording. Datasheet states functional-safety compliance and systematic/hardware capability up to ASIL D. |
| Package or Case Code | TO | Incorrect. Correct package is PAP, 64-pin HTQFP / PowerPAD TQFP. |
| Mount | Hardware | Incorrect/invalid classification; package is surface mount. |
| Part Type | Integrated Circuits | Broad but not wrong; a more useful classification is battery monitor/balancer or power-management IC. |
| Designator Prefix | IC | Acceptable, though U is the more common schematic convention. |
| Datasheet URL | Existing uploaded PDF | Present and official-content; no update required by the request. |
Datasheet key specifications
- 16-series-cell automotive precision battery monitor, balancer, and integrated hardware protector.
- Supports 6S to 16S operation for BQ79616-Q1.
- Total module operating voltage: 9 V to 80 V; 11 V to 80 V for OTP programming.
- Cell measurement range: generally -1 V to 5 V differential; VC1-to-VC0 is 0 V to 5 V.
- ADC headline accuracy: ±1.5 mV typical condition stated in features; detailed guaranteed limits vary with voltage and temperature.
- All cell channels measured within 128 µs.
- Internal passive balancing, up to 240 mA stated in features, with thermal pause/resume management.
- Eight GPIOs configurable for NTC/ADC, digital I/O, and SPI master functions.
- UART plus isolated differential daisy-chain interfaces with optional ring architecture.
- AEC-Q100 Grade 1: -40 °C to +125 °C ambient.
- Functional-safety systematic and hardware capability up to ASIL D.
- Package: PAP0064F, 64-pin HTQFP PowerPAD, 10 mm × 10 mm body, 0.5 mm pitch, 1.2 mm maximum height, plus exposed PowerPAD shown as pad 65.
Schematic symbol audit
Critical mismatch
The symbol contains 65 terminals, but every terminal is named only by its number (
1 through 65). All terminal types are Unspecified, and no pin descriptions, functional groups, or electrical roles are present.This makes the part unsafe to use because designers cannot distinguish cell-sense, balancing, supply, ground, communication, UART, GPIO, fault, and thermal-reference pins.
Required pin-name mapping
Table
| Pin | Datasheet name | Function/type summary |
|---|---|---|
| 1 | BAT | Power input / top-of-module measurement |
| 2 | CB16 | Cell-balance I/O |
| 3 | VC16 | Cell-voltage input |
| 4 | CB15 | Cell-balance I/O |
| 5 | VC15 | Cell-voltage input |
| 6 | CB14 | Cell-balance I/O |
| 7 | VC14 | Cell-voltage input |
| 8 | CB13 | Cell-balance I/O |
| 9 | VC13 | Cell-voltage input |
| 10 | CB12 | Cell-balance I/O |
| 11 | VC12 | Cell-voltage input |
| 12 | CB11 | Cell-balance I/O |
| 13 | VC11 | Cell-voltage input |
| 14 | CB10 | Cell-balance I/O |
| 15 | VC10 | Cell-voltage input |
| 16 | CB9 | Cell-balance I/O |
| 17 | VC9 | Cell-voltage input |
| 18 | CB8 | Cell-balance I/O |
| 19 | VC8 | Cell-voltage input |
| 20 | CB7 | Cell-balance I/O |
| 21 | VC7 | Cell-voltage input |
| 22 | CB6 | Cell-balance I/O |
| 23 | VC6 | Cell-voltage input |
| 24 | CB5 | Cell-balance I/O |
| 25 | VC5 | Cell-voltage input |
| 26 | CB4 | Cell-balance I/O |
| 27 | VC4 | Cell-voltage input |
| 28 | CB3 | Cell-balance I/O |
| 29 | VC3 | Cell-voltage input |
| 30 | CB2 | Cell-balance I/O |
| 31 | VC2 | Cell-voltage input |
| 32 | CB1 | Cell-balance I/O |
| 33 | VC1 | Cell-voltage input |
| 34 | CB0 | Cell-balance I/O |
| 35 | VC0 | Cell-voltage input |
| 36 | REFHM | Precision-reference ground |
| 37 | REFHP | Precision-reference output |
| 38 | AVDD | 5 V regulated analog output |
| 39 | AVSS | Analog ground |
| 40 | COMLP | Daisy-chain differential I/O |
| 41 | COMLN | Daisy-chain differential I/O |
| 42 | COMHN | Daisy-chain differential I/O |
| 43 | COMHP | Daisy-chain differential I/O |
| 44 | NEG5V | Negative charge-pump supply pin |
| 45 | CVDD | 5 V communications/I/O supply output |
| 46 | CVSS | Communications ground |
| 47 | LDOIN | 6 V preregulated analog input/sense |
| 48 | NPNB | External NPN base drive |
| 49 | DVDD | 1.8 V regulated digital output |
| 50 | DVSS | Digital ground |
| 51 | TSREF | 5 V thermistor reference/bias output |
| 52 | RX | UART receiver input |
| 53 | TX | UART transmitter output |
| 54 | GPIO8 | Configurable analog/digital I/O |
| 55 | GPIO7 | Configurable analog/digital I/O |
| 56 | GPIO6 | Configurable analog/digital I/O |
| 57 | GPIO5 | Configurable analog/digital I/O |
| 58 | GPIO4 | Configurable analog/digital I/O |
| 59 | GPIO3 | Configurable analog/digital I/O |
| 60 | GPIO2 | Configurable analog/digital I/O |
| 61 | GPIO1 | Configurable analog/digital I/O |
| 62 | NFAULT | Active-low fault output |
| 63 | BBN | Bus-bar differential input negative |
| 64 | BBP | Bus-bar differential input positive |
| 65 | PowerPAD | Exposed thermal pad; datasheet does not assign a signal name in the functional pin table |
The physical pin count is therefore consistent only if the exposed PowerPAD is counted as pad 65. The datasheet markets the package as 64-pin HTQFP.
Footprint audit
Matching items
- 64 perimeter signal pads plus one exposed center pad are present.
- Perimeter pitch is 0.5 mm.
- Signal-pad copper is approximately 0.30 mm × 1.475 mm, effectively matching the 0.30 mm × 1.50 mm example land pattern.
- Overall signal-pad span is approximately 11.476 mm, close to the datasheet example's nominal 11.4 mm.
- Pin numbering proceeds consistently around the four sides, and pad 65 is centered.
Mismatches / risks
- Center pad 65 is 8 mm × 8 mm. TI's package drawing shows the physical exposed pad around 6.5 mm × 5.3 mm, while the example PCB land pattern uses a non-square exposed-pad land (reported as 6.5 mm × 8 mm). The current 8 mm × 8 mm copper land is oversized in at least one axis and should be corrected from the authoritative PAP0064F drawing.
- No thermal-via pattern is present. TI marks vias as application-dependent/optional, so absence is not automatically wrong, but thermal and assembly requirements should be reviewed.
- No solder-paste segmentation was visible in the inspected footprint. A full 8 mm × 8 mm paste opening would create excessive solder and float risk; TI provides stencil-opening guidance. Paste and solder-mask layers should be explicitly verified.
- Package metadata says
TO, which conflicts with the actual HTQFP geometry even though the perimeter pad arrangement resembles PAP0064F.
Overall disposition
Not ready for library use. The perimeter footprint is broadly close, but the metadata is incorrect, the PowerPAD geometry needs correction/verification, and the symbol has no functional pin names, electrical types, or descriptions. The symbol problem alone is a critical usability and connection-risk defect.
Recommended corrections
- Correct the MPN after confirming whether the intended procurement form is current
BQ79616PAPRQ1or a tray variantBQ79616PAPTQ1; remove the erroneous leadingPin all cases. - Set package to
PAP0064F / HTQFP-64 PowerPAD, 10 mm × 10 mm, 0.5 mm pitchand mount to SMD. - Rename and type all 65 symbol terminals using the pin table above; add datasheet-derived pin descriptions.
- Correct exposed-pad copper and verify solder-mask/paste geometry directly against PAP0064F.
- Keep the official TI datasheet URL available as a stable reference: https://www.ti.com/lit/ds/symlink/bq79616-q1.pdf
Scope
Authoritative references
Current metadata
Datasheet key specifications
Schematic symbol audit
Critical mismatch
Required pin-name mapping
Footprint audit
Matching items
Mismatches / risks
Overall disposition
Recommended corrections
