Part Review and Datasheet Update

I’ll inspect the part metadata, find the official datasheet if needed, update the Datasheet property, then compare symbol/footprint/pin details against the source and summarize any mismatches.
Completed the BNO086 part review and saved the detailed findings in BNO086 Part Review.
Summary: the symbol pin names/numbers and 28-pad LGA footprint match the official CEVA BNO08X/BNO086 datasheet. Flagged metadata issues: Datasheet URL uses an older CEVA domain, Manufacturer Name is set to BOSCH though the listed MPN manufacturer is CEVA Technologies, Package is missing, pin descriptions/types are mostly unspecified, and the description mentions SPI but omits I²C/UART support.
Provide a concise direct to the point best description for this part based from the datasheet. i don't need a very long but useless description.
BNO086 is a 28-pin LGA 9-axis smart IMU SiP integrating a 3-axis accelerometer, 3-axis gyroscope, 3-axis magnetometer, temperature sensor, and CEVA SH-2 sensor-fusion firmware, with I²C, SPI, and UART host interfaces.
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BNO086 Part Review
Source data inspected
  • Project: silicon-yard/bno086
  • Published part UID: 9a25ff3e-bf32-40aa-aae3-4a6dfff368a3
  • MPN: BNO086
  • Existing Datasheet URL: https://www.ceva-dsp.com/wp-content/uploads/2019/10/BNO080_085-Datasheet.pdf
  • Official current CEVA datasheet found: https://www.ceva-ip.com/wp-content/uploads/BNO080_085-Datasheet.pdf
  • Project description: BNO086 - Accelerometer, Gyroscope, Magnetometer, Temperature, 9 Axis Sensor IC, SPI Output
  • Schematic terminals: 28
  • Footprint pads: 28
Key datasheet specs
  • Device family: BNO08X; BNO086 is a BNO085-compatible enhancement.
  • Function: 9-axis SiP IMU integrating accelerometer, gyroscope, magnetometer, temperature sensing, and ARM Cortex-M0+ running CEVA SH-2 firmware.
  • Package: 28-pin LGA / 28-TFLGA module, 5.2 mm × 3.8 mm × 1.1 mm.
  • Supply rails: VDD 2.4–3.6 V; VDDIO approximately 1.7–3.6 V / 1.65–3.6 V depending table/source wording.
  • Temperature: -40 °C to +85 °C.
  • Interfaces: I²C, SPI, UART-SHTP, UART-RVC; protocol selected by PS1/PS0 at reset.
  • I²C: 100 kHz / 400 kHz, 7-bit address 0x4A or 0x4B, requires clock stretching support, typical pullups 2 kΩ–4 kΩ.
  • SPI: slave, mode 3, max 3 MHz; PS0/WAKE used as wake in SPI mode.
  • UART-SHTP: 3 Mb/s; UART-RVC: 115200 b/s; external clock/crystal required for UART modes.
  • Clock: internal, external 32 kHz, or crystal; crystal recommendation 50 ppm / 12.5 pF load.
  • Reflow/MSL: lead-free reflow peak up to 260 °C; MSL 1.
Pin cross-check

Table


PinDatasheet nameProject terminalStatus
1RESV_NCRESV_NC_1OK
2GNDGND_1OK
3VDDVDDOK
4BOOTNBOOTNOK
5PS1PS1OK
6PS0/WAKEPS0/WAKEOK
7RESV_NCRESV_NC_2OK
8RESV_NCRESV_NC_3OK
9CAPCAPOK
10CLKSEL0CLKSEL0OK
11NRSTNRSTOK
12RESV_NCRESV_NC_4OK
13RESV_NCRESV_NC_5OK
14H_INTNH_INTNOK
15ENV_SCLENV_SCLOK
16ENV_SDAENV_SDAOK
17SA0/H_MOSISA0/H_MOSIOK
18H_CSNH_CSNOK
19H_SCL/SCK/RXH_SCL/SCK/RXOK
20H_SDA/H_MISO/TXH_SDA/H_MISO/TXOK
21RESV_NCRESV_NC_6OK
22RESV_NCRESV_NC_7OK
23RESV_NCRESV_NC_8OK
24RESV_NCRESV_NC_9OK
25GNDGND_2OK
26XOUT32/CLKSEL1XOUT32/CLKSEL1OK
27XIN32XIN32OK
28VDDIOVDDIOOK
Footprint cross-check
The footprint contains 28 SMD rectangular pads and matches the datasheet land pattern structure: side rows use 0.25 mm × 0.675 mm pads, top/bottom rows use 0.25 mm × 0.575 mm pads, with pad centers corresponding to the 3.8 mm × 5.2 mm LGA footprint geometry. The footprint outline is 3.8 mm × 5.2 mm and courtyard is 5.8 mm × 7.2 mm.
Mismatches / issues flagged
  1. Datasheet URL property is set but uses an older CEVA domain: current official URL found is https://www.ceva-ip.com/wp-content/uploads/BNO080_085-Datasheet.pdf. Existing URL may still redirect/resolve, but the current official host is preferable.
  2. Manufacturer Name property says BOSCH: datasheet notes Bosch Sensortec manufactures the physical device, but distributor/manufacturer listing for MPN BNO086 is CEVA Technologies, Inc. Consider changing manufacturer to CEVA Technologies, Inc. or adding Bosch in role/details if desired.
  3. Package property is missing: recommended value is 28-LGA (5.2x3.8) or 28-TFLGA Module.
  4. Pin Type / Pin Description properties are not populated: all schematic terminal Pin Type fields inspected are Unspecified; datasheet provides clear input/output/bidirectional/NC roles and descriptions.
  5. Description is mostly correct but incomplete: it says SPI output only, while datasheet supports I²C, SPI, and UART host interfaces.
Conclusion
The core symbol pin numbering/names and footprint pad count/geometry are consistent with the official BNO08X datasheet for BNO086. The main cleanup items are metadata quality: update the datasheet URL to the current official CEVA URL, manufacturer naming, package property, pin type/descriptions, and description interface coverage.
  • Source data inspected

  • Key datasheet specs

  • Pin cross-check

  • Footprint cross-check

  • Mismatches / issues flagged

  • Conclusion

Documents

  • BNO086 Part Review

Assets

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image5Thumbnail
BNO086

BNO086

BNO086 Symbol.svgDefault
stp

BNO086

BNO086.stp3D Model
kicad_mod

BNO086

BNO086.kicad_modFootprint

BNO086

BNO086 thumbnail
BNO086 - Accelerometer, Gyroscope, Magnetometer, Temperature, 9 Axis Sensor IC, SPI Output BNO086 is a 28-pin LGA 9-axis smart IMU SiP integrating a 3-axis accelerometer, 3-axis gyroscope, 3-axis magnetometer, temperature sensor, and CEVA SH-2 sensor-fusion firmware, with I²C, SPI, and UART host interfaces.

Properties

BNO086

BOSCH

Sensors

IC

parametric-v1

Pricing & Availability

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