Part Datasheet Audit

A

adrian95

Review all available part information (MPN, package, pin count, description, properties). If no datasheet URL is already set, search the web for the official datasheet and update the part's Datasheet property with the URL. Then cross-check the schematic symbol, footprint, and pin descriptions against the datasheet. Summarize key specs and flag any mismatches.

flux

I’ll audit the part metadata, locate the official datasheet if needed, update the Datasheet property, then verify the symbol, footprint, and pin definitions against it.

flux

Audit complete. The official Mini-Circuits datasheet URL was already set, and the six-pin electrical mapping and copper footprint match the BFTC-500+ datasheet.
Flagged gaps include missing FR933-1 package metadata, unspecified pin types/descriptions, centered silkscreen reference text, and courtyard/3D geometry verification concerns. Full findings: Part Audit Report.
Fix metadata and pins
Clean footprint markings
Validate 3D alignment
Complete part cleanup
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Files

Pins

Symbol

Layout

Preview

GROUND_3
Pin Number
4
RF_IN
Pin Number
2
RF_OUT
Pin Number
5
GROUND_1
Pin Number
1
GROUND_4
Pin Number
6
GROUND_2
Pin Number
3
Part Audit Report
Scope
Audit of the Mini-Circuits BFTC-500+ part metadata, six-terminal schematic symbol, imported PCB footprint, and 3D model against the official manufacturer datasheet.
Authoritative sources
Available part information

Table

FieldCurrent valueAudit result
ManufacturerMini-CircuitsMatches official source
MPNBFTC-500+Matches official source
Datasheet URLhttps://www.minicircuits.com/pdfs/BFTC-500+.pdfAlready present and official; no update required
Part typeEMI / RFI ComponentsBroad but not incorrect; “LTCC band-pass filter” would be more specific
Designator prefixFLAppropriate for a filter
Symbol styleparametric-v1Informational
LicenseCC BY 4.0 URLInformational
Project descriptionCeramic Bandpass Filter, 400–600 MHzConsistent with datasheet
Package/case metadataNo explicit part-level case property foundMissing metadata; official case style is FR933-1
Pin count6Matches package and datasheet
3D assetBFTC-500+.stpPresent
Footprint assetBFTC500.kicad_modPresent
Key datasheet specifications

Table

ParameterSpecification
FunctionLTCC ceramic band-pass filter
Passband400–600 MHz
Center frequency500 MHz
System impedance50 Ω
Passband insertion loss4.0 dB typical, 5.5 dB maximum
Passband VSWR1.5:1 typical
Lower stopband1–290 MHz, 25 dB minimum / 38 dB typical rejection
Upper stopband800–2000 MHz, 25 dB minimum / 33 dB typical rejection
Maximum RF input power4 W at +25 °C, linearly derated to 2 W at +85 °C
Operating temperature−40 to +85 °C
Storage temperature−55 to +100 °C
Case styleFR933-1
Body size3.81 × 3.81 × 1.50 mm
Package marking355
Compliance“+” suffix indicates RoHS compliance
Pin cross-check

Table

PinDatasheet functionCurrent terminal nameCurrent pin typeResult
1GroundGROUND_1UnspecifiedFunctional name and number match; type/description incomplete
2RF INRF_INUnspecifiedFunctional name and number match; type/description incomplete
3GroundGROUND_2UnspecifiedFunctional name and number match; type/description incomplete
4GroundGROUND_3UnspecifiedFunctional name and number match; type/description incomplete
5RF OUTRF_OUTUnspecifiedFunctional name and number match; type/description incomplete
6GroundGROUND_4UnspecifiedFunctional name and number match; type/description incomplete
The symbol places pins 1/2/3 on one side and 6/5/4 on the opposite side. This preserves the physical ordering around the package and clearly presents the RF path from pin 2 to pin 5. No duplicated or hidden terminals were found.
Footprint cross-check
Geometry that matches
  • Six SMD pads are present with numbering 1 through 6.
  • Pad pitch along each side is 1.27 mm.
  • Row spacing is 3.15 mm center-to-center.
  • Imported pad size is 0.76 × 1.52 mm.
  • Pad sequence matches the datasheet: top row 1–2–3 and opposite row 6–5–4 after coordinate-system orientation is accounted for.
  • Fabrication body outline is 3.81 × 3.81 mm, matching the package body.
  • A pin-1/index marker is present.
  • The 3D STEP asset is present and uses the correct part name.
Issues and ambiguities
  1. Missing explicit package metadata: no part-level Package/Case property was found. The correct value is FR933-1; the official suggested PCB layout is identified as 98-PL-112 / PL-112.
  2. Pin electrical types are all “Unspecified”: ground terminals should be typed Ground/Power as supported, while RF input/output should be Passive or the closest RF/passive terminal classification. All six pins also lack useful Pin Description text.
  3. Silkscreen reference placement: the imported FL** reference text is centered on the component. This can overlap the body and pads and is not production-friendly.
  4. Courtyard/render classification ambiguity: the imported KiCad payload correctly defines a 5.81 × 6.67 mm F.CrtYd rectangle, but the parsed layout inspection groups those paths under “Silk Shapes.” Verify in the visual footprint editor that the courtyard is not actually printed on F.SilkS.
  5. Displayed geometry unit ambiguity: detailed layout inspection reports pad/body coordinates scaled by 0.001 while labeling the unit as mm, although the embedded KiCad footprint payload contains the correct millimeter values. This appears likely to be internal unit representation, but the visual footprint should be dimension-checked before release.
  6. 3D validation incomplete: the STEP model is attached, but the inspection output reports a zero computed package bounding size. Visually confirm body size, seating plane, pin-1 orientation, and pad alignment.
Overall assessment
The critical electrical pin mapping is correct: pins 2 and 5 are RF input/output and pins 1, 3, 4, and 6 are ground. The copper land pattern encoded in the imported KiCad footprint is dimensionally consistent with the datasheet. The main gaps are metadata completeness, unspecified pin types/descriptions, and footprint presentation/validation concerns involving centered silkscreen text, courtyard layer classification, and 3D/unit readback ambiguity.
  1. Add Package or Case Code = FR933-1 and, if supported, reference 98-PL-112 in package/footprint metadata.
  2. Add concise pin descriptions and appropriate electrical types for all six terminals.
  3. Move the reference designator outside the component courtyard or hide it on silkscreen.
  4. Visually verify courtyard layer, actual pad dimensions, and 3D alignment before publishing or using the part in production.

  • Scope

  • Authoritative sources

  • Available part information

  • Key datasheet specifications

  • Pin cross-check

  • Footprint cross-check

  • Geometry that matches

  • Issues and ambiguities

  • Overall assessment

  • Recommended corrections