Part Review and Datasheet Update

flux

I’ll update the package metadata to ST’s LGA-14L naming, add datasheet-based descriptions to each terminal, then re-check the footprint pad/body dimensions against the datasheet.

flux

Package details and all 14 pin descriptions are updated; I’m now verifying the footprint geometry against the ST LGA-14L package data.

flux

Completed the requested fixes: package metadata now uses ST’s LGA-14L, 2.5 × 3.0 × 0.86 mm max naming, all 14 pins have datasheet-based descriptions, and the footprint dimensions were verified against the ST datasheet/TN0018 guidance.
Open items:
  • The dedicated project Package or Case Code field is non-standard here, so the corrected package is stored under Implementation Details.
  • Footprint is dimensionally correct; the embedded KiCad footprint confirms 0.575 × 0.350 mm lands and matching mask openings.
Suggested next steps:
  1. Publish/reuse the part now that symbol, metadata, and footprint checks pass.
  2. Optionally add application-circuit notes for required decoupling and I²C pull-ups.
Add notes and checks
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Run full review
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ASM330LHHXTR Part Review
Date: 2026-06-29
Updates completed
  • Datasheet URL set to official STMicroelectronics datasheet: https://www.st.com/resource/en/datasheet/asm330lhhx.pdf
  • Package metadata corrected by removing the non-datasheet Package or Case Code = 14-VFLGA project property and adding Implementation Details = Package: LGA-14L, 2.5 x 3.0 x 0.86 mm max height.
  • Detailed datasheet-based Pin Description properties were added to all 14 terminal pins.
  • Footprint dimensions were re-verified against ST datasheet package data and TN0018-derived land recommendations.
Key datasheet specs
  • Function: 6-axis automotive IMU with 3-axis accelerometer + 3-axis gyroscope, embedded machine-learning core, dual operating modes.
  • Qualification/application: AEC-Q100 qualified; automotive non-safety applications; Android Auto and CarPlay compliant.
  • Supply voltage: VDD 1.71–3.6 V; VDD_IO 1.62–3.6 V.
  • Operating temperature: -40 to +105 °C.
  • Accelerometer full scales: ±2, ±4, ±8, ±16 g.
  • Gyroscope full scales: ±125, ±250, ±500, ±1000, ±2000, ±4000 dps.
  • Interfaces: I²C, MIPI I3C SDR, SPI 3-/4-wire; SPI modes 0 and 3 up to 10 MHz.
  • Recommended decoupling: VDD_IO 100 nF; VDD 100 nF + 10 µF.
Package / footprint verification
Datasheet package: LGA-14L, 14-lead plastic land grid array, 2.50 ±0.10 mm × 3.00 ±0.10 mm body, 0.86 mm max height.
Footprint asset inspected: XDCR_ASM330LHHXTR.kicad_mod.
Observed footprint data:
  • Pad count: 14 SMD rectangular pads — matches datasheet.
  • Copper pad sizes: 0.575 × 0.350 mm or 0.350 × 0.575 mm depending on side/orientation — matches derived ST TN0018 recommendation from 0.475 × 0.250 mm package pads plus 0.1 mm land growth.
  • Solder mask openings: 0.675 × 0.450 mm — matches TN0018 recommendation of PCB land + 0.1 mm mask opening.
  • Fab/body outline: 3.0 × 2.5 mm — matches package body dimensions, with axis orientation swapped relative to drawing view but correct physical size.
  • Courtyard: 3.5 × 3.0 mm — reasonable clearance around 3.0 × 2.5 mm body.
  • Pin-1 marker: present near pin 1 — acceptable.
Result: Footprint dimensions are consistent with the datasheet and ST LGA soldering guidance.
Note: layout tree computed-rule display shows pad sizes/positions as meter-scale numeric values while labeling unit as mm; the embedded KiCad footprint payload itself confirms the intended dimensions in millimeters.
Pin descriptions added

Table

PinTerminalDescription added
1SDO/SA0SPI 4-wire serial data output; I²C/MIPI I3C least significant address bit.
2MSDAMode 1 connect to VDD_IO or GND; Mode 2 I²C master serial data.
3MSCLMode 1 connect to VDD_IO or GND; Mode 2 I²C master serial clock.
4INT1Programmable interrupt output; sampled at power-up for I²C/I3C coexistence behavior.
5VDD_IOI/O power supply, 1.62–3.6 V; 100 nF recommended.
6NCMay be connected to VDD_IO/GND or left unconnected.
7GNDGround / 0 V supply return.
8VDDMain supply, 1.71–3.6 V; 100 nF + 10 µF recommended.
9INT2Programmable interrupt 2 / DEN; Mode 2 MDRDY.
10NCLeave electrically unconnected and solder pad to PCB.
11NCLeave electrically unconnected and solder pad to PCB.
12CSI²C/MIPI I3C/SPI mode selection.
13SCLI²C/MIPI I3C SCL; SPI SPC.
14SDAI²C/MIPI I3C SDA; SPI SDI; 3-wire SPI SDO.
Remaining notes
  • The project-level properties available through the metadata tool do not include a dedicated standard Package or Case Code field; the corrected package is therefore stored in Implementation Details and the old non-standard Package or Case Code entry was removed.
  • Symbol pin numbering and names match the datasheet.
  • Footprint geometry is verified as correct against the datasheet/TN0018-derived dimensions.

  • Updates completed

  • Key datasheet specs

  • Package / footprint verification

  • Pin descriptions added

  • Remaining notes

Documents

Assets

ASM330LHHXTR

XDCR_ASM330LHHXTR.kicad_modFootprint
ASM330LHHXTR-thumb.png

ASM330LHHXTR-thumb.png

ASM330LHHXTR-thumbThumbnail

ASM330LHHXTR

ASM330LHHXTR ASM330LHHXTR Symbol.svgDefault
ASM330LHHXTR

ASM330LHHXTR

ASM330LHHXTR.step3D Model

ASM330LHHXTR

ASM330LHHXTR thumbnail
Accelerometer, Gyroscope, Temperature, 6 Axis Sensor I2C, I3C, SPI Output
The ASM330LHHX is a 6-axis IMU featuring a 3-axis digital accelerometer and a 3‑axis digital gyroscope with an extended temperature range up to +105°C, designed to address automotive nonsafety applications. ST’s family of MEMS sensor modules leverages the robust and mature manufacturing processes already used for the production of micromachined accelerometers and gyroscopes to serve both the automotive and consumer markets. The ASM330LHHX is AEC-Q100 compliant and industrialized through a dedicated MEMS production flow to meet automotive reliability standards. All the parts are fully tested with respect to temperature to ensure the highest quality level. The sensing elements are manufactured using ST’s proprietary micromachining processes, while the IC interfaces are developed using CMOS technology that allows the design of a dedicated circuit, which is trimmed to better match the characteristics of the sensing element.
Features • AEC-Q100 qualified • Android Auto™ compliant and CarPlay® compliant • Extended temperature range from -40 to +105°C • Embedded compensation for high stability over temperature • Accelerometer user-selectable full scale up to ±16 g • Extended gyroscope range from ±125 to ±4000 dps • Dual operating modes: high-performance and low-power mode • I²C, MIPI I3C℠, and SPI serial interfaces • Six-channel synchronized output to enhance accuracy of dead-reckoning algorithms • Programmable finite state machine • Machine learning core • Smart programmable interrupts • Embedded 3 KB FIFO available to underload host processor • ECOPACK and RoHS compliant Applications • Dead reckoning (DR) • Vehicle-to-everything (V2X) • Telematics, e-tolling • Antitheft systems • Impact detection and crash reconstruction • Motion-activated functions • Driving comfort • Vibration monitoring and compensation
#ASM330LHHXTR #STMicroelectronics #IMU #MEMS #Accelerometer #Gyroscope #AutomotiveElectronics #MotionSensor #MachineLearning #SensorFusion #AECQ100 #EmbeddedSystems

Properties

Package: LGA-14L, 2.5 x 3.0 x 0.86 mm max height

ASM330LHHXTR

STMicroelectronics

Sensors

st.com/resource/en/datasheet/asm330lhhx.pdf

U

parametric-v1

creativecommons.org/licenses/by/4.0/

Pricing & Availability

DPN

Stock

Qty 1

4

0–7.3K

$5.536–$7.9569

1

2.4K

$9.81

3

2.4K–7.3K

$5.4407–$7.9799

Controls