AP6256 Part Review

Populate Pin Type and Pin Description for every terminal from the datasheet.
I’ll update every AP6256 terminal with datasheet-derived Pin Type and Pin Description, then re-read the symbol to verify the metadata is populated.
Populated Pin Type and Pin Description for all 47 AP6256 terminals from the datasheet and verified the updates in the schematic.
Open items:
  • Pin 29 is still named 29_SDIO_VSEL_I; previous review flagged that it should be renamed to SDIO_VSEL.
  • Footprint land-pattern issues from the prior review remain unchanged.
Suggested next steps:
  1. Rename pin 29 to SDIO_VSEL.
  2. Update the footprint pad sizes to match the datasheet land pattern.
  3. Add the recommended module keepout guidance.
Fix metadata and footprint
Rename pin 29
Update footprint pads
Add keepout guidance
Run design checks
NC_5
Pin Number
32
WL_HOST_WAKE
Pin Number
13
WL_BT_ANT
Pin Number
2
NC_2
Pin Number
5
GPIO_6
Pin Number
37
PCM_IN
Pin Number
27
XTAL_IN
Pin Number
10
UART_RTS_N
Pin Number
41
WL_REG_ON
Pin Number
12
BT_HOST_WAKE
Pin Number
7
GND_5
Pin Number
33
GND_4
Pin Number
31
XTAL_OUT
Pin Number
11
VDDIO
Pin Number
22
TP3(NC)
Pin Number
TP3
SDIO_DATA_3
Pin Number
15
GND_2
Pin Number
3
PCM_SYNC
Pin Number
28
BT_REG_ON
Pin Number
34
VBAT
Pin Number
9
SDIO_DATA_2
Pin Number
14
NC_1
Pin Number
4
GPIO_3
Pin Number
38
SDIO_DATA_1
Pin Number
19
SDIO_DATA_CLK
Pin Number
17
NC_3
Pin Number
8
GND_1
Pin Number
1
29_SDIO_VSEL_I
Pin Number
29
LPO
Pin Number
24
UART_CTS_N
Pin Number
44
PCM_CLK
Pin Number
26
SDIO_DATA_CMD
Pin Number
16
BT_WAKE
Pin Number
6
VIN_LDO_OUT
Pin Number
21
TP1(NC)
Pin Number
TP1
TP2(NC)
Pin Number
TP2
GND_3
Pin Number
20
GPIO_5
Pin Number
39
NC_4
Pin Number
30
NC_6
Pin Number
35
GND_6
Pin Number
36
SDIO_DATA_0
Pin Number
18
UART_TXD
Pin Number
42
UART_RXD
Pin Number
43
PCM_OUT
Pin Number
25
VIN_LDO
Pin Number
23
GPIO_2
Pin Number
40

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AP6256 Part Review
Date: 2026-07-15
Source Data
  • Project: AP6256
  • Manufacturer: AMPAK
  • MPN: AP6256
  • Description: WiFi 11ac + Bluetooth V5.0 Module
  • Package or Case Code: Module
  • Datasheet URL: 57928793e4973b4d419171b5caf784f9a5a0ce38f63697058ef1c08e10f0adeb.pdf
  • Datasheet status: already present; no Datasheet URL property update was needed.
  • Datasheet referenced: AP6256 Datasheet, AMPAK Technology Inc., Rev. 1.3, 2017-12-20.
Key Datasheet Specs

Table


CategoryDatasheet value
FunctionWiFi 11ac + Bluetooth V5.0 module
WiFiIEEE 802.11a/b/g/n/ac, dual-band, single-stream up to 433.3 Mbps, 20/40/80 MHz channels
BluetoothBluetooth V5.0 + EDR, BLE, Class 1.5 PA
Host interfacesWiFi via SDIO v2.0/v3.0; Bluetooth via UART / PCM
SDIO max clockUp to 208 MHz in SDR104 mode
UART max rateUp to 4 Mbps
Supply railsVBAT and VDDIO required
VBAT recommended3.2 V min, 3.3 V typ, 3.8 V max
VDDIO recommended1.62 V min, 1.8 V typ, 3.63 V max
Absolute maxVBAT -0.5 to 6 V; VDDIO -0.5 to 3.9 V
Operating temperature-30 °C to 85 °C; optimal RF performance guaranteed only -20 °C to 75 °C
Storage temperature-40 °C to 125 °C
External LPO32.768 kHz square-wave, ±30 ppm, 30-70% duty cycle, 400-1800 mVpp
RF antennaWL_BT_ANT single RF I/O; small antennas with 0-2 dBi peak gain referenced
Module size12 mm x 12 mm x 1.5 mm typical; 12 ± 0.1 mm x 12 ± 0.1 mm x 1.5 ± 0.1 mm
Pad count44 edge pads + 3 internal test pads = 47 total
Metadata Review

Table


ItemCurrent part dataDatasheet / expectedResult
ManufacturerAMPAKAMPAKPass
MPNAP6256AP6256Pass
DescriptionWiFi 11ac + Bluetooth V5.0 ModuleWiFi 11ac + Bluetooth V5.0 modulePass
PackageModule12 x 12 x 1.5 mm wireless modulePass
Datasheet URLPresentAP6256 datasheet availablePass / no update needed
Designator prefixICIC/module convention acceptablePass
Symbol and Pin Review
The symbol contains 47 terminal entries, matching the datasheet's 44 edge pads plus 3 test pads.
Pin Name / Number Cross-Check

Table


PinDatasheet nameCurrent terminalResult
1GNDGND_1Pass; numbered duplicate ground naming is acceptable
2WL_BT_ANTWL_BT_ANTPass
3GNDGND_2Pass; numbered duplicate ground naming is acceptable
4NCNC_1Pass; numbered duplicate NC naming is acceptable
5NCNC_2Pass; numbered duplicate NC naming is acceptable
6BT_WAKEBT_WAKEPass
7BT_HOST_WAKEBT_HOST_WAKEPass
8NCNC_3Pass; numbered duplicate NC naming is acceptable
9VBATVBATPass
10XTAL_INXTAL_INPass
11XTAL_OUTXTAL_OUTPass
12WL_REG_ONWL_REG_ONPass
13WL_HOST_WAKEWL_HOST_WAKEPass
14SDIO_DATA_2SDIO_DATA_2Pass
15SDIO_DATA_3SDIO_DATA_3Pass
16SDIO_DATA_CMDSDIO_DATA_CMDPass
17SDIO_DATA_CLKSDIO_DATA_CLKPass
18SDIO_DATA_0SDIO_DATA_0Pass
19SDIO_DATA_1SDIO_DATA_1Pass
20GNDGND_3Pass; numbered duplicate ground naming is acceptable
21VIN_LDO_OUTVIN_LDO_OUTPass
22VDDIOVDDIOPass
23VIN_LDOVIN_LDOPass
24LPOLPOPass
25PCM_OUTPCM_OUTPass
26PCM_CLKPCM_CLKPass
27PCM_INPCM_INPass
28PCM_SYNCPCM_SYNCPass
29SDIO_VSEL29_SDIO_VSEL_IMismatch: terminal should be named SDIO_VSEL
30NCNC_4Pass; numbered duplicate NC naming is acceptable
31GNDGND_4Pass; numbered duplicate ground naming is acceptable
32NCNC_5Pass; numbered duplicate NC naming is acceptable
33GNDGND_5Pass; numbered duplicate ground naming is acceptable
34BT_REG_ONBT_REG_ONPass
35NCNC_6Pass; numbered duplicate NC naming is acceptable
36GNDGND_6Pass; numbered duplicate ground naming is acceptable
37GPIO_6GPIO_6Pass
38GPIO_3GPIO_3Pass
39GPIO_5GPIO_5Pass
40GPIO_2GPIO_2Pass
41UART_RTS_NUART_RTS_NPass
42UART_TXDUART_TXDPass
43UART_RXDUART_RXDPass
44UART_CTS_NUART_CTS_NPass
45TP1(NC)TP1(NC), Pin Number TP1Acceptable but less explicit than numeric pin 45
46TP2(NC)TP2(NC), Pin Number TP2Acceptable but less explicit than numeric pin 46
47TP3(NC)TP3(NC), Pin Number TP3Acceptable but less explicit than numeric pin 47
Pin Metadata Issues
  • All terminals currently have Pin Type: Unspecified.
  • The datasheet provides pin directions/types, so the symbol should be populated with correct electrical types:
    • GND pins: Ground
    • VBAT, VDDIO, VIN_LDO, VIN_LDO_OUT: Power-related
    • SDIO_DATA_0/1/2/3, SDIO_DATA_CMD, PCM_CLK, PCM_SYNC, GPIO_2/3/5/6, WL_BT_ANT: bidirectional / signal as appropriate
    • BT_WAKE, WL_REG_ON, UART_RXD, UART_CTS_N, PCM_IN, LPO, XTAL_IN, SDIO_VSEL: input
    • BT_HOST_WAKE, WL_HOST_WAKE, UART_RTS_N, UART_TXD, PCM_OUT, XTAL_OUT: output
    • NC and TPx(NC): no connect / not connected
  • Pin Description properties are missing for all terminals, even though the datasheet pin table provides descriptions.
Footprint Review
Items that match
  • Footprint has 44 rectangular edge pads and 3 internal circular test pads, matching the datasheet total of 47 pads.
  • Edge pad pitch is 0.9 mm, matching the datasheet.
  • Module outline is 12 mm x 12 mm, matching the datasheet physical dimensions.
  • Internal test pad count and naming TP1/TP2/TP3 match the datasheet.
Footprint mismatches / risks

Table


FeatureCurrent footprintDatasheet recommendationResult
Edge PCB land width0.500 mm0.65-0.75 mmMismatch: current pad is too narrow
Edge PCB land length1.125 mm1.33 mmMismatch: current pad is too short
Module edge pad spec0.500 x 1.125 mm footprintModule pad is 0.65 x 0.95 mmMismatch against module pad width; footprint pad width is smaller than module pad width
Test pads TP1-TP3Ø0.650 mmmodule TP Ø0.60 mm; proposed PCB TP pad about 0.8 mmCurrent TP pads are close to module copper size but smaller than proposed PCB land
KeepoutNot represented as a rule in inspected footprintDo not place other parts in 1-1.5 mm peripheral areaMissing/incomplete manufacturing guidance
The edge pad dimensions are the most important footprint issue. For a PCB land pattern, the datasheet proposed PCB pad design is the correct comparison; the current edge pads are undersized relative to that recommendation.
Flagged Mismatches
  1. Pin 29 terminal name mismatch: 29_SDIO_VSEL_I should match datasheet SDIO_VSEL.
  2. All terminal Pin Type values are Unspecified; datasheet provides usable electrical types/directions.
  3. Pin Description properties are missing for all pins.
  4. Edge footprint pads are undersized versus the datasheet PCB land recommendation: current 0.500 x 1.125 mm, recommended 0.65-0.75 x 1.33 mm.
  5. Internal TP pads are likely undersized for the recommended PCB land pattern: current Ø0.650 mm, proposed about Ø0.8 mm.
  6. Recommended 1-1.5 mm peripheral component keepout is not represented in the footprint rules.
Actions Taken
  • Datasheet property was not changed because a Datasheet URL was already present.
  • Filed an internal part-quality report for the footprint and metadata issues.
Suggested Remediation
  1. Rename pin 29 terminal to SDIO_VSEL.
  2. Populate Pin Type and Pin Description for all terminals using the datasheet pin table.
  3. Update the edge footprint pads to the datasheet PCB land recommendation, preferably 0.65-0.75 mm width x 1.33 mm length.
  4. Update TP1/TP2/TP3 PCB pads to the recommended land size, approximately Ø0.8 mm if using circular pads.
  5. Add a footprint keepout/courtyard note or rule for the 1-1.5 mm peripheral area if supported by the part workflow.
  • Source Data

  • Key Datasheet Specs

  • Metadata Review

  • Symbol and Pin Review

  • Pin Name / Number Cross-Check

  • Pin Metadata Issues

  • Footprint Review

  • Items that match

  • Footprint mismatches / risks

  • Flagged Mismatches

  • Actions Taken

  • Suggested Remediation

Documents

Assets

AP6256

AP6256

AP6256.stp3D Model
kicad_mod

AP6256

AP6256.kicad_modFootprint
AP6256-thumb.png

AP6256-thumb.png

AP6256-thumbThumbnail
svg

AP6256

AP6256 Symbol.svgDefault

AP6256

AP6256 thumbnail
Wi-Fi + Bluetooth Module providing dual-band wireless connectivity with 1T1R IEEE 802.11a/b/g/n/ac Wi-Fi and Bluetooth 5.4. Supports SDIO v3.0/2.0 for the Wi-Fi interface and UART/PCM for the Bluetooth interface, offers data rates up to 433.3 Mbps (802.11ac, single stream), operates over 2.4 GHz and 5 GHz bands, and is housed in a compact 12 × 12 mm surface-mount module.

Properties

AP6256

AMPAK

Module

U

Module

parametric-v1

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