AP1302 Part Review
Worked for 9 mins
Created a project doc
AP1302CSSL00SMGA0-DR Part Review
Date: 2026-07-09 Reviewed available Flux part information for AP1302CSSL00SMGA0-DR: MPN, manufacturer, package/footprint, 120 schematic term...
Completed the AP1302 part review and created AP1302CSSL00SMGA0-DR Part Review with the detailed findings.
Open items:
- No pin-to-ball mismatches found.
- Main issues flagged: all terminal Pin Types are still
Unspecified, Pin Description metadata is missing, and the footprint pad size is plausible but not confirmed against an onsemi land-pattern table. - Datasheet URL was already set, so I did not change it.
Suggested next steps:
- Update terminal Pin Type properties from the datasheet.
- Add Pin Description properties from Table 12.
- Verify exported footprint dimensions/Gerbers before publishing.
Fix metadata and verify
Update pin metadata
Verify footprint dimensions
Run review checks
Use official datasheet
Refine this doc
Ask about this doc
AP1302CSSL00SMGA0-DR Part Review
Date: 2026-07-09
Scope
Reviewed available Flux part information for
AP1302CSSL00SMGA0-DR: MPN, manufacturer, package/footprint, 120 schematic terminals, pin numbers, pin type/description properties, 3D/model/footprint data, and datasheet-derived specifications.Current Flux part metadata
Table
| Field | Current value | Datasheet / source check |
|---|---|---|
| Manufacturer Part Number | AP1302CSSL00SMGA0-DR | Matches orderable product / available part number. |
| Manufacturer Name | ON Semiconductor | Matches onsemi / ON Semiconductor. |
| Part Type | Integrated Circuits | Reasonable; more specific description is Image Signal Processor, 13 MP. |
| Designator Prefix | IC | Reasonable. |
| Mount | Standard | Reasonable for VFBGA SMD part. |
| Datasheet URL | Flux storage PDF URL already set | No Datasheet property update was required by the request because a URL was already set. Web search also found onsemi overview and distributor-hosted onsemi AP1302/D Rev. 13 PDFs. |
| BOM items | 0 | Expected for a standalone published part project. |
| Schematic terminals | 120 | Matches VFBGA-120 ball count. |
| Nets | 0 | Expected for a standalone part symbol. |
Datasheet source notes
- Existing Datasheet URL property points to an uploaded PDF copy:
https://storage.googleapis.com/graviton-electric-symbols/document_assets/user-uploaded/3deb23f190dd089b06165d23d7d780b0e22326714fad29f9072153b9ef7b675f.pdf. - Datasheet content identifies onsemi AP1302/D, Rev. 13, September 2023, “6.5 mm x 6.5 mm Package Data Sheet.”
- Web search found an official onsemi product overview PDF and onsemi support/evaluation-board documents. Search-exposed full AP1302/D PDF copies were available through distributor mirrors such as Mouser and Digi-Key.
Key datasheet specifications
Table
| Specification | Value |
|---|---|
| Device function | AP1302 image signal processor / camera co-processor, 13 MP |
| Package | VFBGA-120, case outline 138AK |
| Body size | 6.5 mm x 6.5 mm |
| Max package thickness | 0.8 mm |
| Ball count | 120 |
| Ball pitch | 0.50 mm |
| Ball diameter | 0.30 mm nominal class; datasheet/package data shows about 0.30/0.31 mm ±0.05 mm depending section/source extraction |
| Max resolution | 4224 x 3156, 13 MP |
| Max frame rate | 13 MP at 30 fps; 1080p at 120 fps; 720p at 240 fps noted in feature text |
| Primary camera interface | Up to 4-lane MIPI / sub-LVDS, up to 1.2 Gbps per lane |
| Secondary camera interface | Up to 3-lane MIPI / sub-LVDS, up to 1.2 Gbps per lane |
| Output interface | Up to 4-lane MIPI CSI-2, up to 1.2 Gbps per lane |
| Output formats | YUV422 8-bit, YUV420 8-bit, RGB888, RGB565, RGB555, JPEG, RAW8/10/12, MJPEG |
| MIPI output clock | Up to 600 MHz / 1200 Mbps DDR |
| Color processing | 450 Mpixels/s |
| Core / PLL / MIPI supply | 1.14 V min, 1.2 V typ, 1.26 V max |
| I/O supply | 1.62 V min, 1.8 V typ, 1.98 V max |
| 1.2 V rail sizing note | Supply capable of 1 A or more recommended for peak consumption |
| Typical power | Standby about 5-6 mW; 13 MP @ 30 fps JPEG about 690 mW; 1080p @ 60 fps about 330 mW |
| Master clock input | 10 MHz to 54 MHz |
| I2C support | Standard, Fast, FM+, HS modes noted; timing tables include 100-400 kHz / FM+ rise/fall values |
| SPI slave | Datasheet text includes up to 25 Mbps in feature list and up to 48 Mbps in functional overview; treat as datasheet ambiguity to verify for final design limits |
| Operating temperature | -30 C to +70 C ambient; -30 C to +85 C junction |
| ESD | 2000 V HBM |
| Absolute max: 1.2 V domain | 1.6 V |
| Absolute max: 1.8 V domain | 3.6 V |
Symbol / pinout cross-check
Result: no signal-to-ball assignment mismatches were found across the 120 terminals.
Interface and control pins
Table
| Signal group | Datasheet expectation | Flux symbol result |
|---|---|---|
| Control / clock | CLK M2, RST L1, TESTMODE B1, STANDBY K1 | Matches. |
| Primary sensor lanes | S0_CLK A4/B4, S0_D0 A2/B2, S0_D1 A3/B3, S0_D2 A5/B5, S01_D32 A6/B6 | Matches. |
| Secondary sensor lanes | S1_CLK A7/B7, S1_D0 A8/B8, S1_D1 A9/B9 | Matches. |
| GPIO | GPIO[11:0] = A11, J12, K12, L12, B12, L4, M4, M6, M5, A10, C10, B10 | Matches. |
| Host MIPI output | H_CLK L7/M7; H_D0 L11/M11; H_D1 L10/M10; H_D2 L9/M9; H_D3 L8/M8 | Matches. |
| I2C | SIPS_SCL C12, SIPS_SDA D12, SIPM_SCL B11, SIPM_SDA C11, I2C_VSS D11, IOVDD_SIPS D10 | Matches. |
| Power / ground | VSS, HMIPI_VSS, SMIPI_VSS, PLLx_VSS, CORE_VDD, PLLx_VDD, IOVDD*, SMIPI_VDD, HMIPI_VDD | All listed balls match datasheet. |
Naming note
S01_D32_DP and S01_D32_DN look unusual compared with the other S0 lane names, but the extracted datasheet signal table uses the same naming for the lane-3 primary sensor pair at A6/B6. I do not recommend renaming without manual confirmation from the original PDF artwork.Footprint cross-check
Table
| Footprint feature | Datasheet expectation | Flux footprint result |
|---|---|---|
| Pad / ball count | 120 balls | 120 pad nodes present. |
| Ball grid rows | A, B, C, D, E, F, G, H, J, K, L, M | Matches. |
| Columns | 1 through 12 | Matches. |
| Pitch | 0.50 mm | Pad centers follow a 0.50 mm grid. |
| Ball-array span | 5.5 mm, ±2.75 mm from center | Flux pad grid spans -2.75 mm to +2.75 mm when interpreted in normal BGA units. |
| Pad shape | Circular BGA lands expected | Circular pads present. |
| Pad size | Datasheet gives ball diameter, not a PCB land-pattern recommendation | Current pad size is about 0.29 mm; plausible for a 0.30/0.31 mm nominal BGA ball, but not explicitly confirmed by a manufacturer land-pattern table. |
| Body outline | 6.5 mm x 6.5 mm body | Footprint has disabled fab/silk line overrides; 3D model exists. Recommend checking exported fab/silk/body outline before release if mechanical outline matters. |
| 3D model | VFBGA package expected | 3D model asset is attached, but reported packageSize is 0 in the inspected layout metadata; visual/export verification recommended. |
Important unit note: the layout inspector reported pad coordinates such as
0.00275 and pad size 0.00029 while also displaying unit: mm. These values are consistent with internal-meter values corresponding to 2.75 mm and 0.29 mm. Verify exported Gerbers or footprint measurement before release to rule out a display/unit-reporting issue.Flagged mismatches / concerns
Table
| Severity | Item | Details | Recommended action |
|---|---|---|---|
| Medium | Pin Type is Unspecified on all 120 terminals | Datasheet provides directions: Inputs, Outputs, Bidirectional, and Power. Leaving all terminals unspecified weakens ERC and published-part quality. | Update terminal Pin Type properties from the datasheet: sensor/control inputs = Input; host MIPI = Output; GPIO/I2C = Bidirectional; supplies/grounds = Power. |
| Medium | Pin Description properties are absent | The terminals are named correctly, but the detailed datasheet descriptions are not encoded as Pin Description properties. | Add Pin Description text from datasheet Table 12 for user clarity and searchability. |
| Low | Datasheet URL is an uploaded storage URL rather than a direct onsemi URL | Existing URL is present and usable, so no update was required by the request. Search found onsemi overview and distributor-hosted onsemi full datasheets. | Optional: replace or add a reference URL to a stable manufacturer/distributor datasheet link if project policy prefers external source URLs. |
| Low | Footprint land size is not explicitly verified against an onsemi land pattern | Datasheet confirms ball geometry, not recommended PCB land diameter. 0.29 mm circular pads are plausible for 0.30/0.31 mm balls on 0.5 mm pitch. | Keep 0.29 mm unless a manufacturer land-pattern document specifies another land diameter. |
| Low | Fab/silk outline overrides are disabled | Disabled fab/silk shapes may reduce footprint documentation clarity. | If desired, enable or recreate package outline/courtyard/silkscreen features for clearer manufacturing review. |
| Low | SPI maximum rate appears inconsistent in datasheet text | Feature list says SPI slave up to 25 Mbps; functional overview mentions up to 48 Mbps. | For designs using SPI, verify the exact limit in the original datasheet section and with onsemi guidance. |
Recommended next actions
- Update all terminal Pin Type properties according to datasheet directions.
- Add Pin Description properties from datasheet Table 12.
- Verify exported footprint measurements: 0.50 mm pitch, 5.50 mm outer ball-center span, 0.29 mm pad diameter, and 6.5 mm body outline.
- Optionally update or supplement the Datasheet URL with a stable external source link if desired.
Final conclusion
The core part identity, package class, 120-ball count, signal-to-ball assignments, and BGA grid geometry match the datasheet. The main quality gaps are metadata completeness: terminal Pin Type and Pin Description properties are currently missing/unspecified, and the footprint land diameter should be treated as a plausible but not manufacturer-land-pattern-confirmed choice.
Scope
Current Flux part metadata
Datasheet source notes
Key datasheet specifications
Symbol / pinout cross-check
Interface and control pins
Naming note
Footprint cross-check
Flagged mismatches / concerns
Recommended next actions
Final conclusion
