Review all available part information (MPN, package, pin count, description, properties). If no datasheet URL is already set, search the web for the official datasheet and update the part's Datasheet property with the URL. Then cross-check the schematic symbol, footprint, and pin descriptions against the datasheet. Summarize key specs and flag any mismatches.
I’ll audit the part metadata, locate the official Molex documentation if needed, update the Datasheet property, then verify the symbol, footprint, and pin descriptions against the manufacturer drawing.
Audit complete. The official Molex Datasheet URL was already set; identity and core specs match, but the computed footprint appears 1000× undersized, and all pin descriptions/types are incomplete—especially mechanical hold-down pads 16–17. I filed a part-quality report; full findings are in Part Audit Report.
The Datasheet URL property was already populated, so no property update was required.
Key specifications
Table
Parameter
Official value
Circuits
15
Pitch
1.00 mm
Orientation
Right angle
Contact position
Bottom
Actuator
Slider / ZIF
PCB mounting
Surface mount
Mated height
3.00 mm
Current rating
0.5 A maximum per contact
Voltage rating
50 V maximum
Operating temperature
-40 to +85 °C on the current Molex part page
Mating durability
30 cycles maximum
FFC/FPC thickness
0.30 mm (52271 family documentation)
Contact material
Phosphor bronze
Housing material
Nylon, UL 94V-0
Packaging
Embossed tape on reel
Family documentation additionally states 20 mΩ maximum contact resistance, 100 MΩ minimum insulation resistance, and 500 VAC for 1 minute dielectric withstand. Older family literature lists -20 to +85 °C; the current part-specific Molex page lists -40 to +85 °C and should take precedence for this MPN.
Metadata review
Matches
MPN identifies the correct 15-circuit Molex 52271 variant.
Manufacturer is correctly set to Molex.
Mount is correctly set to Surface Mount.
Designator prefix J is appropriate for a connector.
The project description correctly identifies 1.00 mm pitch, right-angle SMT ZIF, 15-way female FFC/FPC connector with tin-bismuth contacts.
Missing or weak metadata
No explicit Package or Case Code property is set.
Connector Type, Connector Gender, Connector Pitch, Connector Positions, and Connector Rows are not explicitly set.
Product Info URL is not set separately.
The project has 17 terminals/pads, but the marketed connector circuit count is 15. This is explainable only if terminals 16 and 17 represent the two metal solder hold-down tabs; that role is not documented in terminal metadata.
Schematic symbol review
Structure
Pins 1 through 15 correspond to the 15 electrical FFC/FPC contacts.
Pins 16 and 17 appear intended to correspond to the two large SMT solder tabs shown in the footprint.
Contact numbering 1 through 15 is sequential and maps one-to-one to the 15 signal pads.
Mismatches / deficiencies
All 17 terminals have Pin Type = Unspecified.
No terminal has a Pin Description.
No Pin Group, Section, or explicit Terminal Order is set.
Pins 16 and 17 are indistinguishable from signal contacts in the symbol metadata. They should be clearly described as mechanical solder tabs / hold-downs and should not be presented as connector circuits.
The symbol therefore overstates the apparent electrical pin count unless the user inspects the footprint.
Recommended terminal descriptions:
Pins 1–15: FFC/FPC Contact 1 through FFC/FPC Contact 15, Pin Type Passive, Pin Group/Section Contacts.
Pins 16–17: Mechanical Solder Tab / Hold-Down, Pin Type Passive or mechanical-equivalent supported by Flux, Pin Group/Section Mounting.
Footprint review
Source footprint geometry
The embedded KiCad footprint source specifies:
Signal pads 1–15 at 1.00 mm pitch from X = -7.00 mm to +7.00 mm.
Signal pad size: 0.60 mm × 1.90 mm.
Signal pad centerline: Y = -4.25 mm in the source footprint coordinate system.
Hold-down pads 16 and 17 at X = ±10.15 mm, Y = -1.90 mm.
Hold-down pad size: 2.10 mm × 2.80 mm.
Fabrication body outline: 20.00 mm wide, from Y = -2.90 mm to +4.25 mm.
Courtyard: 24.40 mm wide × 11.45 mm deep.
These source values are internally consistent with a 15-position, 1.00 mm-pitch Molex 52271 connector and with the family drawing proportions.
Critical mismatch: computed footprint scale
The computed Flux footprint geometry reports the source millimeter values divided by 1000:
0.60 mm × 1.90 mm signal pads are computed as 0.0006 mm × 0.0019 mm.
±7.00 mm signal-pad positions are computed as ±0.007 mm.
±10.15 mm hold-down positions are computed as ±0.01015 mm.
The 20 mm body outline is computed as approximately 0.020 mm wide.
The PCB image also renders no visible footprint at normal scale. This indicates a critical 1000× footprint scaling/import problem in the computed package, even though the embedded .kicad_mod source text contains correct-looking millimeter dimensions. The part is not safe to use for PCB fabrication until the computed pad geometry is corrected and re-verified.
3D model review
A STEP model named 52271-1579.stp is present.
The model has explicit rotation and placement settings.
Because the computed footprint is 1000× undersized and the package size reports zero, reliable pad-to-model alignment cannot be confirmed from the current layout state.
Overall result
Part identity and high-level description are correct. The existing Datasheet URL points to the official Molex part page and did not need updating. The main issues are incomplete terminal metadata and a critical computed footprint scale mismatch. The 17-pad count is valid only when pads 16 and 17 are explicitly identified as mechanical solder hold-downs rather than connector circuits.
Recommended corrective actions
Correct/re-import the footprint so the computed geometry uses the source dimensions in millimeters, not values divided by 1000.
Verify the corrected footprint against official Molex sales drawing 522711579_sd.pdf, especially pad centers, pad sizes, body datum, and pin-1 orientation.
Add Pin Descriptions and set Pins 1–15 as passive contacts.
Mark Pins 16–17 as mechanical solder tabs / hold-downs in their descriptions and groups.
Add explicit connector metadata: 1.00 mm pitch, 15 positions, 1 row, receptacle/female, right-angle, bottom contact, 0.30 mm FFC/FPC.
Recheck the STEP model alignment after footprint scaling is fixed.