Review all available part information (MPN, package, pin count, description, properties). If no datasheet URL is already set, search the web for the official datasheet and update the part's Datasheet property with the URL. Then cross-check the schematic symbol, footprint, and pin descriptions against the datasheet. Summarize key specs and flag any mismatches.
I’ll audit the part metadata, locate the official datasheet if needed, update the Datasheet property, then verify the symbol, footprint, and pin descriptions against the manufacturer documentation.
I’m reading the current symbol, terminal metadata, BOM fields, and footprint geometry first so the datasheet comparison is based on the actual part state.
Audit complete. The 8-pin symbol mapping and SOIC-8 footprint match the official THAT Corporation datasheet; the existing Datasheet URL was already populated, so it was not changed.
Key issues: package metadata incorrectly says 20-SOIC, classification incorrectly says Logic / AND, manufacturer facet says Other, and all pin descriptions/types are missing or unspecified. Full findings and specifications are in 2181AS08-U Part Audit.
The part is identifiable as THAT Corporation 2181AS08-U, an 8-pin plastic SO (SOIC-8) THAT 2181A-grade trimmable Blackmer voltage-controlled amplifier. The pin-to-pad mapping and footprint geometry are consistent with the official datasheet. Several metadata and symbol-documentation fields are incorrect or incomplete.
The Datasheet URL property was already populated, so it was not changed. The existing Mouser-hosted PDF appears to be the same THAT Corporation datasheet, but the manufacturer URL is preferable for provenance.
Correct for the 2181A maximum THD test condition, though terse
Package library field
20-SOIC
Incorrect; must be 8-pin SO/SOIC-8
Footprint asset
SOIC127P600X173-8N
Consistent with 8-pin, 1.27 mm pitch SO package
Part subtype
Logic
Incorrect
IC type / logic function
Logic / AND
Incorrect and unrelated to this analog VCA
Part Type property
Integrated Circuit
Correct but broad
Official pinout cross-check
Table
Pin
Datasheet name
Current symbol/pad
Result
Recommended electrical type / description
1
Input
INPUT
Correct
Analog input; signal-current input, maintained near virtual ground in normal application
2
Ec+
EC+
Correct
Analog control input; positive-polarity exponential gain-control port
3
Ec-
EC-
Correct
Analog control input; negative-polarity exponential gain-control port
4
Sym
SYM
Correct
Analog trim input; symmetry/distortion trim node
5
V-
V-
Correct
Negative supply / bias-current-setting connection
6
Gnd
GND
Correct
Ground/reference
7
V+
V+
Correct
Positive supply
8
Output
OUTPUT
Correct
Analog signal-current output, normally connected to a virtual-ground transimpedance stage
All eight symbol terminals map to the correct physical pad numbers. However, every current terminal has Pin Type = Unspecified, and all Pin Description, Pin Group, Section, Pin Orientation, and Terminal Order metadata fields are empty. This does not change the pin mapping, but it reduces symbol clarity and ERC usefulness.
Symbol review
Pin numbers and names match the official Table 1 pin assignments exactly.
The symbol places INPUT, EC+, EC-, and SYM on the left and OUTPUT, V+, GND, and V- on the right. This is electrically valid, though power pins are not arranged using conventional top/bottom power orientation.
The rendered symbol preview shows pin labels as empty rectangular glyphs. The underlying pin names are present, so this may be a symbol-font/rendering issue rather than missing names; it should be visually checked in the editor.
No functional grouping or pin descriptions are defined.
Footprint review
The footprint contains eight numbered SMD pads with the correct counter-clockwise SOIC mapping and a pin-1 marker.
Pitch: 1.27 mm, matching datasheet dimension E.
Modeled body: approximately 3.90 mm × 4.89 mm, within the datasheet body limits of 3.81–3.99 mm and 4.80–4.98 mm.
Footprint name indicates 6.00 mm nominal lead span and 1.73 mm maximum height, consistent with datasheet limits of 5.80–6.20 mm span and 1.35–1.73 mm height.
Pads: 0.65 mm × 1.525 mm with standard paste and mask apertures; reasonable for this gull-wing SOIC package.
A 3D model is attached as 2181AS08-U.stp; alignment was not dimensionally validated from the available structured data.
No footprint pin-number or package-geometry mismatch was found.