Part Audit Review

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Part Audit — TE Connectivity 2118900-1

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Manufacturer: TE Connectivity MPN: 2118900-1
Audit complete. I added the official TE Connectivity datasheet URL and documented the specifications and discrepancies in Part Audit — TE Connectivity 2118900-1.
Key flags: pin 2 is incorrectly typed as Power In instead of ground, pin descriptions/package metadata are missing, and the footprint lacks the manufacturer’s RF keepout and matching-network guidance; its exact symmetric pad coordinates also need drawing-based verification before production.
Add pins for the mounts, S1 and S2
I’ll add two schematic terminals mapped to footprint pads S1 and S2, classify them as mechanical/passive mounts, and verify all four pad mappings.
Added and verified mount pins S1 and S2. Both are passive, grouped under Mounts, described as mechanical mounting solder pads, and map directly to the existing S1/S2 footprint pads.
Fix metadata and pins
Fix pin 2
Verify footprint geometry
Add RF keepout
S1
Pin Number
S1
2
Pin Number
2
S2
Pin Number
S2
1
Pin Number
1

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Part Audit — TE Connectivity 2118900-1
Audit result
Manufacturer: TE Connectivity
MPN: 2118900-1
Official function: Passive SMT GNSS/GPS antenna
Status: Active
Datasheet property: Updated to the official TE Connectivity 2118900-DS PDF.
Official references:
Current part information found

Table


FieldCurrent valueAudit
Manufacturer NameTE ConnectivityCorrect
Manufacturer Part Number2118900-1Correct
Designator PrefixEAcceptable for an antenna, though AE is also commonly used
Description2118900-1 A Manufacturer Recommendations 1.0 mm TE ConnectivityIncomplete/unclear; does not identify the part as a GNSS antenna
Datasheet URLInitially missing; now official TE URLCorrected
Package metadataNot setMissing; should describe 10 × 10 × 1 mm SMT antenna
Explicit pin-count metadataNot setMissing; part has 2 electrical terminals plus 2 fixed/mechanical solder pads
3D model2118900-1.stepPresent
Footprint assetXDCR_2118900-1.kicad_modPresent
Key manufacturer specifications

Table


ParameterManufacturer value
Frequency range1560–1602 MHz
Antenna operationPassive
Nominal impedance50 Ω
VSWR< 2.0:1
Maximum gain3.5 dB
PolarizationLinear
Radiation patternOmnidirectional in azimuth
Power handling3 W CW
Operating temperature−40 °C to +85 °C
Storage temperature−40 °C to +85 °C
Body dimensions10.0 × 10.0 × 1.0 mm
Weight< 0.5 g
MountingSMT, tape and reel
Reflow qualification250 °C peak
ConstructionFR4 antenna element, ENIG/Au over Ni contact finish
Manufacturer performance is dependent on PCB ground-plane size and placement. TE characterizes the antenna using a 100 mm ground size and requires the mounting guide, top-layer ground arrangement, RF matching area, and no-copper region to be followed.
Schematic-symbol cross-check
The current symbol exposes two electrical terminals:

Table


Symbol pinCurrent typeDatasheet functionResult
1PassiveRF feed / signalFunctionally plausible, but missing a pin name/description such as FEED — 50 Ω RF input/output
2Power InGroundMismatch: Power In is not appropriate for a passive antenna ground terminal; it should be identified as Ground, with a clear pin description
Additional symbol findings:
  • Both terminals are displayed as generic Terminal symbols with undefined pin names.
  • No Pin Description values are present.
  • The symbol does not communicate that this is a two-terminal passive RF antenna.
  • A stale semantic index referenced a third terminal, but the current structured schematic contains only two terminals. The current structured data is the source of truth.
Footprint cross-check
Current footprint source geometry:

Table


FeatureCurrent footprint
Body/fabrication outline10.0 × 10.0 mm
Courtyard10.5 × 10.5 mm
Electrical pad 11.0 × 1.0 mm at (+4.2, +4.2)
Electrical pad 21.0 × 1.0 mm at (−4.2, +4.2)
Fixed pad S11.5 × 1.5 mm at (−3.95, −3.95)
Fixed pad S21.5 × 1.5 mm at (+3.95, −3.95)
Pin-1 markerPresent near pad 1
Paste/maskCopper, mask, and paste on all four pads
Footprint assessment
  • Correct: Four physical solder lands are represented: two electrical terminals and two fixed/mechanical pads.
  • Correct: Nominal 10 × 10 mm body and 1.0/1.5 mm land classes agree broadly with the TE package/mounting information.
  • Correct: Electrical pads are mapped only to pins 1 and 2; the two S pads are treated as mechanical mounts rather than schematic terminals.
  • Needs source-level confirmation: The imported footprint uses symmetric pad centers. TE’s mounting guide must be treated as authoritative for exact asymmetric offsets and orientation. The footprint should be dimensionally rechecked directly against the drawing before production release.
  • Mismatch / missing layout guidance: The footprint does not encode the datasheet’s antenna keepout/no-copper region, top-layer ground boundary, no-soldermask RF matching area, or recommended series/shunt matching-component region. These omissions can materially reduce antenna performance if the user treats the footprint alone as sufficient placement guidance.
  • Orientation risk: The pin-1 marker and feed/ground mapping must be checked against the TE top/bottom-view convention when the footprint is placed. The datasheet identifies one terminal as feed and the other as ground; the current generic pin metadata does not make that mapping obvious.
Pin-description assessment
No pin descriptions are currently set. Recommended descriptions:

Table


PinRecommended nameRecommended descriptionRecommended type
1FEED50 Ω RF feed/signal terminal; connect through the application-specific matching networkPassive
2GNDAntenna ground terminal; connect to the recommended top-layer PCB ground geometryGround
The two fixed pads should remain non-electrical mechanical footprint pads and should not be added as schematic pins unless TE explicitly defines an electrical role for them.
Mismatches and risks requiring attention
  1. Pin 2 electrical type is wrong: currently Power In; datasheet function is antenna ground.
  2. Pin descriptions are absent: feed and ground are not identified in the symbol.
  3. Part description is incomplete: it should identify a passive 1560–1602 MHz GNSS SMT antenna.
  4. Package metadata is missing: 10 × 10 × 1 mm SMT antenna package is not recorded as a property.
  5. Pin-count metadata is missing: two electrical terminals plus two fixed/mechanical solder pads.
  6. RF layout constraints are not embedded in the footprint: no-copper keepout, top-layer ground arrangement, matching network, and soldermask guidance must be added at board level or included in an improved footprint.
  7. Exact land coordinates need a final drawing-based dimensional check: the current imported footprint is symmetric, while the manufacturer mounting guide should control production geometry.
  1. Correct pin 2 from Power In to Ground and add FEED/GND pin descriptions.
  2. Replace the description with a clear GNSS antenna description and add package metadata.
  3. Perform a direct dimensional footprint verification against the official mounting-guide drawing.
  4. Add or document the required RF keepout, ground boundary, and matching-network placement constraints before using the part in a PCB design.
  • Audit result

  • Current part information found

  • Key manufacturer specifications

  • Schematic-symbol cross-check

  • Footprint cross-check

  • Footprint assessment

  • Pin-description assessment

  • Mismatches and risks requiring attention

  • Recommended correction priority

Assets

svg

2118900-1

2118900-1 Symbol.svgDefault
2118900-1-thumb.png

2118900-1-thumb.png

2118900-1-thumbThumbnail
kicad_mod

XDCR_2118900-1.kicad_mod

XDCR_2118900-1Footprint
2118900-1

2118900-1

2118900-1.step3D Model

2118900-1

2118900-1 thumbnail
GNSS Multi-Constellation Embedded Chip Antenna – Surface-mount passive GNSS chip antenna optimized for GPS, GLONASS, Galileo, BeiDou, asset tracking, navigation systems, drones, IoT devices, telematics, and embedded positioning applications. Covers the 1560 MHz to 1602 MHz GNSS frequency band with a 1.575 GHz center frequency, 50 Ω impedance, 3 W maximum input power, and VSWR ≤ 2:1 for efficient satellite signal reception. Features a compact 10 × 10 × 1 mm ceramic SMD package, linear polarization, embedded PCB mounting, and peak gain up to 3.5 dBi, making it suitable for space-constrained wireless designs. Designed for operation over a −40°C to +85°C temperature range and compatible with GPS, GLONASS, Galileo, and BeiDou satellite navigation systems.

Properties

2118900-1

TE Connectivity

Connector

E

parametric-v1

Pricing & Availability

DPN

Stock

Qty 1

5

0–2K

$0.3193–$1.023

1

723

$1.18

3

585–12K

$0.32–$0.5655

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