Part Audit Review
Part Audit Report
01 and 02. The footprint is PHOENIX_1923869.kicad_mod, with ...J versus P prefix metadata, and a datasheet extraction ambiguity between 5.00 mm pin spacing and the clearly specified 5.08 mm product pitch.01 and 02. The footprint is PHOENIX_1923869.kicad_mod, with a matching Phoenix Contact STEP model.Table
| Parameter | Official value |
|---|---|
| Positions / connections / potentials | 2 / 2 / 2 |
| Rows | 1 |
| Pitch | 5.08 mm |
| Nominal current | 16 A, subject to derating curve |
| Nominal voltage | 320 V |
| Rated voltage, II/2 | 630 V |
| Rated surge voltage | 4 kV |
| Contact resistance | 0.9 mΩ |
| Operating temperature | -40 °C to +105 °C, dependent on derating |
| Housing material / rating | PA, UL 94 V-0 |
| Contact material | Tin-plated copper alloy |
| Width | 12.16 mm |
| Length | 12 mm |
| Height | 11.8 mm |
| Installed height | 8.57 mm |
| Solder pin length | 3.23 mm |
| Pin cross-section | 1 mm × 1 mm |
| Recommended PCB hole diameter | 1.4 mm |
01 and 02, matching the two positions and footprint pads.Contact 1 — male PCB header pin and Contact 2 — male PCB header pin.J, while terminal-level Designator Prefix properties show P. This does not change the electrical pin mapping, but it is inconsistent metadata and may confuse future maintenance.Table
| Feature | Footprint | Datasheet | Result |
|---|---|---|---|
| Pad count | 2 | 2 | Match |
| Pad numbering | 01, 02 | positions 1, 2 | Match |
| Hole diameter | 1.4 mm | 1.4 mm | Match |
| Pad size | 2.1 mm × 2.1 mm | Not explicitly specified as a land diameter | Plausible; no mismatch established |
| Body outline width | 12.16 mm | 12.16 mm | Match |
| Body outline depth | 12.0 mm | 12.0 mm | Match |
| Pad center spacing | 5.08 mm | Product pitch 5.08 mm; OCR PCB-design field reports 5.00 mm | Needs drawing-level confirmation |
| Pin-1 marking | Rectangular pad and marker | Position identification expected | Appropriate |
J versus terminal-level P metadata.Identification
Existing part information reviewed
Key datasheet specifications
Symbol cross-check
Footprint cross-check
Dimensional ambiguity
Flagged mismatches and quality issues
Overall assessment