Part Datasheet Audit
Part Datasheet Audit — JST 17FDZ-BT(S)(LF)(SN)
Mount = Vertical instead of through-hole, drills at the upper tolerance limit, and courtyard geometry that may not support automated checking. Full results: Part Datasheet Audit.Table
| Item | Datasheet / official source | Project state | Result |
|---|---|---|---|
| Manufacturer | JST | JST | Match |
| MPN | 17FDZ-BT(S), with (LF)(SN) label suffix | 17FDZ-BT(S)(LF)(SN) | Acceptable match |
| Series | FDZ | Reflected in MPN | Match |
| Connector class | FFC/FPC connector for FPC and membrane leads | FPC connector | Match |
| Entry style | Top-entry version (BT) | Described as straight/vertical contact | Functionally consistent; terminology differs |
| Actuation | ZIF slider | ZIF | Match |
| Circuits | 17 | 17 terminals/pads | Match |
| Pitch | 2.54 mm | 2.54 mm | Match |
| PCB mounting | Through-hole, 1.6 mm PCB | Footprint uses plated through holes | Match; metadata Mount = Vertical is misleading |
| A dimension | 40.64 mm for 17 circuits | Pin 1-to-17 span 40.64 mm | Match |
| B dimension | 54.04 mm | Footprint body width 54.04 mm | Match |
| Body depth | 7.70 mm | Fab outline depth 7.70 mm | Match |
| Contact hole | Ø0.9 ±0.05 mm | 0.95 mm drill | Within spec, at upper limit |
| Polarization/boss hole | Ø1.8 ±0.05 mm | 1.85 mm NPTH | Within spec, at upper limit |
| Current rating | 50 mA AC/DC | Not populated | Metadata missing |
| Voltage rating | 250 V AC/DC | Not populated | Metadata missing |
| Temperature | -40°C to +85°C | Not populated | Metadata missing |
| Contact resistance | 10 Ω max initial; 15 Ω max after test | Not populated | Metadata missing |
| Insulation resistance | 1,000 MΩ min | Not populated | Metadata missing |
| Dielectric withstand | 1,200 VAC for 1 minute | Not populated | Metadata missing |
| Materials | Copper-alloy tin-plated contacts; black PBT housing/slider | Not fully populated | Metadata missing |
Contact 1 through Contact 17, because the connector does not assign signal functions.Vertical describes entry/orientation, not assembly technology. The package is through-hole PCB mounted.Sources
Identification and key specifications
Datasheet property
Schematic symbol and terminals
Footprint review
Mismatches and cautions
Verdict