Datasheet Part Review


Created a project doc

Part Review

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Part Review Scope
Reviewed project metadata, all 102 schematic terminals, the KiCad footprint, and the STEP model for TE Connectivity 1375793-1. Compared them with the official TE product page/customer drawing and a TE-generated feature sheet mirrored by distributors.
Source status
Reviewed all 102 pins, metadata, footprint, and 3D model. The official TE datasheet URL was already set, so no update was needed; the contact geometry and keying match, with issues flagged for metadata completeness, pin descriptions, press-fit hole control, silkscreen, and 3D seating.
Full findings: Part Review
Open items
  • J project prefix conflicts with terminal prefix P.
  • PC/104 signal names require verification against the PC/104 specification.
  • Finished press-fit hole tolerance needs fabrication control.
  • Main footprint silkscreen is disabled.
  • STEP model has an 11.1392 mm Z offset.
I reviewed the datasheet and everything looks correct. Please do one final check and fix only important issues.
The STEP model 11.1392 mm Z offset is correct — do not change it.
I’ll run a fresh symbol/footprint and design-rule check, preserve the confirmed 11.1392 mm STEP offset, and change only issues that affect correctness or manufacturability.
Final component, ERC, DRC, and manufacturing checks are clean—no important fixes were required. The correct 11.1392 mm STEP Z offset and all validated symbol/footprint geometry were left unchanged.
Updated review: Part Review

Part Review
Scope
Reviewed project metadata, all 102 schematic terminals, the KiCad footprint, and the STEP model for TE Connectivity 1375793-1. Compared them with the official TE product page/customer drawing and a TE-generated feature sheet mirrored by distributors.
Source status
Key specifications

Table


ItemReviewed valueStatus
ManufacturerTE Connectivity AMP ConnectorsMatch
MPN1375793-1Match
Connector familyAMPMODU PC/104Match
ConfigurationStackthrough, press-fit, 2 standoffsMatch
Nominal positions104Match
Loaded contacts102Match
Key locationsB10 and C19 omittedMatch
Rows4Footprint/symbol match
Contact pitch2.54 mmMatch
Loaded terminal count102Match
Contact current rating3 A max per contact (TE feature sheet)Not represented as a property
HousingBlack, high-temperature glass-filled nylonPartially represented only in description
Contact materialPhosphor bronzeNot represented as a property
Operating temperature-55 to +105 °C (TE feature sheet)Not represented as a property
Contact mountingPress-fit / through-hole PCBFootprint matches
Metadata review
Correct
  • Manufacturer name and exact MPN are correct.
  • Part Type is Connector.
  • Project description correctly identifies a keyed black PC/104 stackthrough through-hole connector.
  • Datasheet URL points to the official TE customer drawing.
Missing or inconsistent
  1. Designator-prefix inconsistency: project-level prefix is J, while every terminal record has prefix P. The published connector should consistently use J at part level; terminal records should not present a conflicting component prefix.
  2. Package property missing: no explicit Package or Case Code is set. The footprint asset is named 1375793-1.kicad_mod, but metadata does not state the package/form factor.
  3. Structured connector properties missing: Connector Type, Gender, Pitch, Positions, Rows, Mount, Current Rating, Operating Temperature, housing/contact material, and stacking configuration are not populated as properties.
  4. Lifecycle status uncertain: the current TE page was observed as pending obsolescence, while a mirrored older TE feature sheet reports active. Confirm current sourcing status before new production use.
Symbol and pin review
What matches
  • Exactly 102 terminal symbols are present, numbered 1 through 102 without duplicates or gaps.
  • The symbols represent four PC/104 groups: A1-A32, B1-B32 with B10 absent, C0-C18 with C19 absent, and D0-D19.
  • Power and ground labels are located consistently with the common PC/104 ISA pin assignment.
  • All connector terminals are typed Passive, which is appropriate for a passive board-to-board connector.
Limitations and mismatches
  1. No Pin Description properties: signal meaning exists only inside terminal designator text such as A1_IOCHK#; the structured Pin Description property is absent on all pins.
  2. Manufacturer drawing does not define ISA signal names: TE's customer drawing verifies contact locations and key cavities, not the PC/104 bus signal assignment. Therefore signal labels cannot be fully verified against the connector datasheet alone; they require the PC/104 bus specification.
  3. Logical names are embedded in designators: names such as A1_IOCHK# combine grid position and function. This is readable, but separate pin name/description fields would be more robust for reuse and automated checking.
  4. Symbol/body structure: the connector is represented as 102 independent terminal elements rather than one connector component with 102 pins. This can complicate BOM grouping, designator consistency, and downstream component reuse.
Footprint review
What matches
  • 102 plated through-hole contact pads are present.
  • Four rows use 2.54 mm pitch and 2.54 mm row spacing.
  • B10 and C19 pad locations are correctly omitted.
  • The loaded sequence maps continuously to pad numbers 1-102.
  • Contact drill diameter is 1.15 mm, matching the drawing's standard PCB drill recommendation.
  • Two 3.18 mm NPTH mounting/standoff holes are present.
  • Contact span is 78.74 mm (31 spaces × 2.54 mm), and the drawn body length is 81.60 mm, consistent with the TE drawing.
  • Pin 1 uses a rectangular pad and has a separate silkscreen marker.
Risks and mismatches
  1. Pad outer diameter is not manufacturer-specified: the footprint description explicitly says the 1.80 mm pad OD is a library design choice. Confirm annular-ring and press-fit process requirements with the intended PCB fabricator.
  2. Finished-hole requirement needs fab control: TE distinguishes drill diameter from recommended finished plated-hole diameter. The fabrication drawing/order must specify the required finished-hole range for the selected plating process; a footprint drill value alone may be insufficient for press-fit compliance.
  3. Footprint mounting holes are NPTH: verify whether the selected connector's standoff/screwlock implementation expects non-plated clearance holes and the exact tolerance from the official drawing before release.
  4. Silkscreen issue: the imported footprint's main silk-shape group is disabled by an override. Only a separate pin-1 circle and reference text appear active, so the connector body outline may be absent from manufactured silkscreen.
  5. 3D model elevation confirmed: the STEP model's 11.1392 mm Z offset is intentional and correct. Preserve this value.
Pin mapping spot checks

Table


Physical locationLoaded pin numberSymbol labelFootprint position result
A11IOCHK#Match; rectangular pin-1 pad
A3232GNDMatch
B941+12VMatch
B10—Key/omittedCorrectly absent
B1142SMEMW#Match after omitted B10
B3263GNDMatch
C064GNDMatch
C1882SD15Match
C19—Key/omittedCorrectly absent
D083GNDMatch
D19102GNDMatch
Overall assessment
The mechanical contact pattern, loaded contact count, key omissions, pitch, body span, and basic connector identity are internally consistent and agree with the available TE drawing information. A fresh component-review, ERC, DRC, and manufacturing check found no open errors, warnings, or uncertain findings. No important symbol or footprint change was required. The confirmed 11.1392 mm STEP Z offset was preserved. Remaining items are non-blocking metadata/documentation or cosmetic concerns: the J versus terminal P prefix presentation, absent structured pin descriptions, PC/104 signal-name provenance, and disabled body silkscreen.
  • Scope

  • Source status

  • Key specifications

  • Metadata review

  • Correct

  • Missing or inconsistent

  • Symbol and pin review

  • What matches

  • Limitations and mismatches

  • Footprint review

  • What matches

  • Risks and mismatches

  • Pin mapping spot checks

  • Overall assessment