Completed net connections for power, USB, camera, and inputs with pull-ups R10–R13
Ran ERC review and added missing capacitor C5
Set PCB outline to 23.0 mm × 17.5 mm (XIAO footprint)
Added two M2 mounting holes (Hole1, Hole2)
Tasks not done (require manual review or user decision):
Verifying all component footprints and choosing a 4-layer stackup
Assigning power planes and configuring ground fill
Creating and saving the system architecture diagram (mermaid) and messaging it to you
Success criteria status:
✅ Board fits within the XIAO footprint (23.0 mm × 17.5 mm)
✅ Schematic includes ESP32-S3 camera module, LiPo charger, USB-C, and compact input interface
✅ All critical nets (power, USB, camera, inputs) are connected and passed ERC
Next step:
Proceed to verify footprints and configure the PCB stackup (4-layer) so we can assign power planes and ground fill before auto-placement and routing.
Use an adjustable buck module footprint rated 5A+ (prefer XL4015 module or equivalent) with IN+ IN- OUT+ OUT-. If not available, use a generic 4-pin through-hole “Buck Module” placeholder with clearly labeled pins. Create 8V net (OUT+) and connect IN to 12V/GND, OUT to 8V/GND. Keep GND common with ESP32 for the servo signal. Add output bulk capacitor near the servo connector (470–1000uF, ≥16V) plus 100nF. Then run ERC/DRC.
Wirelessly connects nets on schematic. Used to organize schematics and separate functional blocks. To wirelessly connect net portals, give them same designator. #portal
General Purpose Thick Film Standard Power
and High-Power Chip Resistor
47 kOhms ±5% 0.125W, 1/8W Chip Resistor 0805 (2012 Metric) Automotive AEC-Q200 Thick Film
Features:
- RMCF – standard power ratings
- RMCP – high power ratings
- Nickel barrier terminations standard
- Power derating from 100% at 70ºC to zero at +155ºC
- RoHS compliant, REACH compliant, and halogen free
- AEC-Q200 compliant