copilot Entiendo que deseas diseñar un oscilador utilizando el chip 555. Aquí están algunos pasos que puedes seguir para hacer esto. Conecta el pin 1 (GND) del IC 555 a la terminal negativa de tu fuente de alimentación (0V). Conecta el pin 8 (VCC) del IC 555 a la terminal positiva de tu fuente de alimentación (11V). Conecta la resistencia de 10kΩ (R1) entre el pin 8 (VCC) y el pin 7 (DISCHARGE) del 555. Conecta tu potenciómetro de 100kΩ (R2) entre el pin 7 (DISCHARGE) y el pin 6 (THRESHOLD) del 555. Junta los pines 2 (TRIGGER) y 6 (THRESHOLD) juntos y conecta los pines unidos al lado negativo de tu condensador de 10nF (C). Conecta el lado positivo del condensador de 10nF (C) a VCC (el pin 8). Conecta el pin 4 (RESET) al VCC si no quieres usar la función de reset. De lo contrario, puedes conectar una señal de reset aquí. Conecta el pin 3 (OUTPUT) del 555 al terminal positivo de tu resistencia de 470Ω. Conecta el otro terminal de la resistencia a tierra. El condensador de 10uF debe estar conectado en paralelo a la alimentación (entre VCC y GND) para suavizar cualquier ruido en la fuente de alimentación de 11V. Te sugiero que experimentes con el valor del potenciómetro (R2) hasta que consigas el Duty Cycle deseado. Por lo general, es posible cambiar la frecuencia del pulso y ajustar el Duty Cycle utilizando este control. Si, después de realizar estas conexiones y ajustes, aún no puedes obtener el Duty Cycle deseado, podría ser indicativo de que los valores de resistencia y condensador que tienes no son adecuados para tu rango de frecuencia y Duty Cycle objetivo. Para que obtengamos un Duty Cycle del 75%, necesitamos usar el chip 555 en modo astable y debemos calcular los valores de R1 y R2 (resistencia total de carga y descarga respectivamente) que nos ayude a conseguir esto. El tiempo de alta (T_high) y el tiempo de baja del ciclo (T_low) de la oscilación salen determinados por R1, R2, y C (el condensador). Se pueden usar las siguientes fórmulas para calcularlos: T_high = 0.693 * (R1 + R2) * C T_low = 0.693 * R2 * C Duty cycle = ( T_high ) / ( T_high + T_low ) Para un Duty Cycle de 0.75: Estableceremos R1 como la resistencia de 10 kilohmios que se proporcionó. Con el potenciómetro de 100 kilohmios como R2, podemos variarlo para ajustar el Duty Cycle según necesitemos hasta que se llegue a la relación deseada. Considerando que el condensador C es el condensador de 10 nF que se proporcionó, anteriores declaraciones son bajo supuesto que el tiempo de operación (T = T_high + T_low) caiga en un rango aceptable. Para el esquemático: Conecta VCC de tu 555 al terminal positivo de tu fuente de voltaje de 11V y GND a tierra. Conecta los pines 2 (TRIGGER) y 6 (THRESHOLD) juntos y al lado negativo de tu condensador de 10nF. Conecta el lado positivo del condensador a VCC. Conecta el pin 3 (OUTPUT) al terminal positivo de tu resistencia de 470 ohmios. Conecta el otro terminal de la resistencia a tierra. Conecta tu resistencia de 10 kilohmios entre VCC y los pines 2 y 6 del 555. Finalmente, conecta tu potenciómetro entre los pines 2 y 6 y el pin 7 (DISCHARGE) del 555. El condensador de 10uF debería estar conectado en paralelo a la alimentación para suavizar cualquier ruido en la alimentación de 11V. Estas son mis suposiciones y pasos sugeridos pero recuerda variar el potenciómetro hasta conseguir el Duty Cycle deseado en caso de no conseguirlo de forma inmediata. Si por alguna razón no puedes conseguir el Duty Cycle de 75%, es posible que las resistencias y condensadores proporcionados no sean los adecuados para el rango de frecuencia y Duty Cycle deseados. En tal caso, puede que tengas que utilizar otros valores de componentes.

copilot Entiendo que deseas diseñar un oscilador utilizando el chip 555. Aquí están algunos pasos que puedes seguir para hacer esto. Conecta el pin 1 (GND) del IC 555 a la terminal negativa de tu fuente de alimentación (0V). Conecta el pin 8 (VCC) del IC 555 a la terminal positiva de tu fuente de alimentación (11V). Conecta la resistencia de 10kΩ (R1) entre el pin 8 (VCC) y el pin 7 (DISCHARGE) del 555. Conecta tu potenciómetro de 100kΩ (R2) entre el pin 7 (DISCHARGE) y el pin 6 (THRESHOLD) del 555. Junta los pines 2 (TRIGGER) y 6 (THRESHOLD) juntos y conecta los pines unidos al lado negativo de tu condensador de 10nF (C). Conecta el lado positivo del condensador de 10nF (C) a VCC (el pin 8). Conecta el pin 4 (RESET) al VCC si no quieres usar la función de reset. De lo contrario, puedes conectar una señal de reset aquí. Conecta el pin 3 (OUTPUT) del 555 al terminal positivo de tu resistencia de 470Ω. Conecta el otro terminal de la resistencia a tierra. El condensador de 10uF debe estar conectado en paralelo a la alimentación (entre VCC y GND) para suavizar cualquier ruido en la fuente de alimentación de 11V. Te sugiero que experimentes con el valor del potenciómetro (R2) hasta que consigas el Duty Cycle deseado. Por lo general, es posible cambiar la frecuencia del pulso y ajustar el Duty Cycle utilizando este control. Si, después de realizar estas conexiones y ajustes, aún no puedes obtener el Duty Cycle deseado, podría ser indicativo de que los valores de resistencia y condensador que tienes no son adecuados para tu rango de frecuencia y Duty Cycle objetivo. Para que obtengamos un Duty Cycle del 75%, necesitamos usar el chip 555 en modo astable y debemos calcular los valores de R1 y R2 (resistencia total de carga y descarga respectivamente) que nos ayude a conseguir esto. El tiempo de alta (T_high) y el tiempo de baja del ciclo (T_low) de la oscilación salen determinados por R1, R2, y C (el condensador). Se pueden usar las siguientes fórmulas para calcularlos: T_high = 0.693 * (R1 + R2) * C T_low = 0.693 * R2 * C Duty cycle = ( T_high ) / ( T_high + T_low ) Para un Duty Cycle de 0.75: Estableceremos R1 como la resistencia de 10 kilohmios que se proporcionó. Con el potenciómetro de 100 kilohmios como R2, podemos variarlo para ajustar el Duty Cycle según necesitemos hasta que se llegue a la relación deseada. Considerando que el condensador C es el condensador de 10 nF que se proporcionó, anteriores declaraciones son bajo supuesto que el tiempo de operación (T = T_high + T_low) caiga en un rango aceptable. Para el esquemático: Conecta VCC de tu 555 al terminal positivo de tu fuente de voltaje de 11V y GND a tierra. Conecta los pines 2 (TRIGGER) y 6 (THRESHOLD) juntos y al lado negativo de tu condensador de 10nF. Conecta el lado positivo del condensador a VCC. Conecta el pin 3 (OUTPUT) al terminal positivo de tu resistencia de 470 ohmios. Conecta el otro terminal de la resistencia a tierra. Conecta tu resistencia de 10 kilohmios entre VCC y los pines 2 y 6 del 555. Finalmente, conecta tu potenciómetro entre los pines 2 y 6 y el pin 7 (DISCHARGE) del 555. El condensador de 10uF debería estar conectado en paralelo a la alimentación para suavizar cualquier ruido en la alimentación de 11V. Estas son mis suposiciones y pasos sugeridos pero recuerda variar el potenciómetro hasta conseguir el Duty Cycle deseado en caso de no conseguirlo de forma inmediata. Si por alguna razón no puedes conseguir el Duty Cycle de 75%, es posible que las resistencias y condensadores proporcionados no sean los adecuados para el rango de frecuencia y Duty Cycle deseados. En tal caso, puede que tengas que utilizar otros valores de componentes.

Nice — you can do a clean pulse + latch using a single quad Schmitt-NAND chip: 74HC132 (or 74LVC132 for 3.3 V systems). The HC132 contains four 2-input NAND gates with Schmitt inputs so you can both clean a noisy SYN480R DATA line and build an SR latch (NAND SR is active-LOW) inside one package. Only a few passives and a driver transistor are needed. Below is a ready-to-build recipe (parts, wiring, explanation, tuning tips, and an ASCII schematic) — no extra logic ICs required. Parts (per latch) 1 × 74HC132 (quad 2-input NAND with Schmitt inputs). If your system is 3.3 V use 74LVC132 / 74HC132 rated for 3.3 V. Rin = 47 kΩ (input series) Cfilter = 10 nF (input RC to ground) — tweak for debounce/clean time Rpulldown = 100 kΩ (pull-down at input node, optional) Rpullup = 100 kΩ (pull-up for active-LOW R input so reset is idle HIGH) Rbase = 10 kΩ, Q = 2N2222 (NPN) or small N-MOSFET (2N7002) to drive your load Diode for relay flyback (1N4001) if you drive a coil Optional small cap 0.1 µF decoupling at VCC of IC Concept / how it works (short) Use Gate1 (G1) of 74HC132 as a Schmitt inverter by tying its two inputs together and feeding a small RC filter from SYN480R.DATA. This removes HF noise and provides a clean logic transition. Because it's a NAND with tied inputs its function becomes an inverter with Schmitt behavior. Use G2 & G3 as the cross-coupled NAND pair forming an SR latch (active-LOW inputs S̄ and R̄). A low on S̄ sets Q = HIGH. A low on R̄ resets Q = LOW. Wire the cleaned/inverted output of G1 to S̄. A valid received pulse (DATA high) produces a clean LOW on S̄ (because G1 inverts), setting the latch reliably even if the pulse is brief. R̄ is your reset input (pushbutton, HT12D VT, MCU line, etc.) — idle pulled HIGH. Q drives an NPN/MOSFET to switch your load (relay, LED, etc.). Recommended wiring (pin mapping, assume one chip; use datasheet pin numbers) I’ll refer to the 4 gates as G1, G2, G3, G4. Use G4 optionally for additional conditioning or to build a toggler later. SYN480R.DATA --- Rin (47k) ---+--- Node A ---||--- Cfilter (10nF) --- GND | Rpulldown (100k) --- GND (optional, keeps node low) Node A -> both inputs of G1 (tie inputs A and B of Gate1 together) G1 output -> S̄ (S_bar) (input1 of Gate2) Gate2 (G2): inputs = S̄ and Q̄ -> output = Q Gate3 (G3): inputs = R̄ and Q -> output = Q̄ R̄ --- Rpullup (100k) --- VCC (reset is idle HIGH; pull low to reset) (optional) R̄ can be wired to a reset pushbutton to GND or to an MCU pin Q -> Rbase (10k) -> base of 2N2222 (emitter GND; collector to one side of relay coil) Other side of relay coil -> +V (appropriate coil voltage) Diode across coil If you prefer MOSFET low side switching: Q -> gate resistor 100Ω -> gate of 2N7002 2N7002 source -> GND ; drain -> relay coil low side

1. Empieza con el objetivo Ejemplo: “Estoy creando un módulo de control para una bomba de aire de 24 V en una máquina CNC láser. El circuito debe encender y apagar la bomba según la señal FAN que viene de la tarjeta de control (3.3 V o 5 V).” 2. Explica los requerimientos La bomba trabaja a 24 V y hasta 2 A. El control debe ser con un MOSFET N–channel en conmutación. Debe incluir protección contra picos y ruidos eléctricos. Se deben mostrar indicadores LED (encendido, funcionamiento, error). 3. Lista de funciones que quieres en el diseño Protección: fusible, diodo flyback, TVS, snubber RC. Control: MOSFET con resistencia de gate y pull-down. Filtrado: capacitores cerca de la bomba. Indicadores LED: Azul: energía 24 V presente. Verde: bomba activa. Rojo: error o apagado. 4. Explica la lógica de funcionamiento (qué debe pasar) Cuando la fuente 24 V se conecta → LED azul enciende. Cuando la señal FAN activa el MOSFET → bomba enciende + LED verde enciende. Cuando la bomba está apagada → LED rojo puede encender (opcional). Si ocurre sobrecorriente → el fusible abre el circuito. 5. Diagrama de bloques sencillo (texto) [FUENTE 24V] -- [FUSIBLE] --+--> [BOMBA] --> [MOSFET] --> GND | +--> [LED Azul] --> GND [SALIDA FAN] --> [Res 100Ω] --> [Gate MOSFET] [Gate MOSFET] --> [Pull-down 100kΩ a GND] [Protecciones: Diodo, TVS, RC, Capacitores en paralelo con la bomba]

Objetivo: leer coordenadas X/Y en un panel resistivo casero con Arduino Nano. Componentes: Arduino Nano, 16 MHz, 5 V (1x) MCP23017, expansor I/O I²C de 16 pines (1x) ADS1115, ADC I²C 16 bits (1x) Panel táctil casero, 2 láminas aluminio (1x) Resistencias serie 4.7 kΩ – 10 kΩ (4x) Fuente 5 V (USB/external) Funcionamiento: MCP23017 controla X+/X-/Y+/Y- → aplica 5 V y GND al eje activo. Ejemplo: para leer X → MCP energiza X+/X-, deja Y flotante. ADS1115 mide voltaje en el eje sin energía (ej: Y+/Y-) en modo diferencial. Arduino Nano recibe lecturas por I²C, procesa coordenadas X/Y. Coordenadas enviadas por USB serial al PC. Conexiones: Arduino Nano ↔ I²C bus ↔ MCP23017 y ADS1115 (SDA, SCL en común). MCP23017 pines → X+/X-/Y+/Y- (con resistencias serie). ADS1115 entradas analógicas → eje libre (Y+/Y- o X+/X- según ciclo). Alimentación común: 5 V + GND.

make this for me now # Device Summary & Specification Sheet ## 1. Overview A rugged, Arduino-Uno-and-Raspberry-Pi-style single-board micro-PC featuring: - Smartphone-class CPU (Snapdragon 990) - USB-C Power Delivery + 4×AA alkaline backup + ambient-light harvester - On-board Arduino-Uno-compatible ATmega328P - External NVMe SSD via USB3 bridge & optional Thunderbolt 3 eGPU support - 5× USB 3.0 ports, HDMI in/out, Gigabit Ethernet & SFP fiber, Wi-Fi, Bluetooth, LoRa - 0.96″ OLED status display, 3.5 mm audio jack with codec --- ## 2. Key Specifications | Category | Specification | |--------------------|-------------------------------------------------------------------------------| | CPU | Snapdragon 990, octa-core up to 2.84 GHz | | Memory | 6 GB LPDDR4x DRAM | | Storage Interface | PCIe Gen3 ×4 → M.2 NVMe + USB 3.1 Gen1 bridge | | MCU | ATmega328P (Arduino-Uno-compatible) | | Power Input | USB-C PD up to 20 V/5 A; 4×AA alkaline backup; ambient-light photodiode boost | | Power Rails | 12 V, 5 V, 3.3 V, 1.8 V, 1.2 V via buck/buck-boost regulators | | USB Hub | 5× USB 3.0 downstream ports | | Display | 0.96″ 128×64 OLED via I²C/SPI | | Networking | 1 × Gigabit RJ45; 1 × SFP fiber; Wi-Fi 802.11ac + Bluetooth; LoRa SX1276 | | Video I/O | HDMI 2.0 input (RX) & output (TX) | | Audio | 3.5 mm jack + TLV320AIC3101 codec; Bluetooth audio | | Form Factor | Raspberry Pi–style header + Arduino-Uno shield headers; 4× standoff mounts | --- ## 3. Complete Parts List | Part | Function | Qty | |------------------------------------------------------------------------------------------------|-----------------------------------------------|-----| | [Snapdragon 990](https://www.flux.ai/search?type=components&q=Snapdragon%20990) | Main application CPU | 1 | | [LPDDR4x DRAM](https://www.flux.ai/search?type=components&q=LPDDR4x%20DRAM) | System memory | 1 | | [eMMC 64GB](https://www.flux.ai/search?type=components&q=eMMC%2064GB) | On-board storage | 1 | | [M.2 NVMe Connector](https://www.flux.ai/search?type=components&q=M.2%20NVMe%20Connector) | External SSD interface | 1 | | [JMS583](https://www.flux.ai/search?type=components&q=JMS583) | PCIe→USB 3.1 bridge for NVMe | 1 | | [Titan Ridge](https://www.flux.ai/search?type=components&q=Titan%20Ridge) | Thunderbolt 3/eGPU controller | 1 | | [STUSB4500](https://www.flux.ai/search?type=components&q=STUSB4500) | USB-C Power-Delivery controller | 1 | | [LTC4412](https://www.flux.ai/search?type=components&q=LTC4412) | Ideal-diode OR-ing | 1 | | [LTC3108](https://www.flux.ai/search?type=components&q=LTC3108) | Ambient-light (solar) energy harvester | 1 | | [Battery Holder 4×AA](https://www.flux.ai/search?type=components&q=Battery%20Holder%204xAA) | Alkaline backup power | 1 | | [TPS53318](https://www.flux.ai/search?type=components&q=TPS53318) | 6 V→5 V synchronous buck regulator | 1 | | [MCP1700-3302E/TO](https://www.flux.ai/search?type=components&q=MCP1700-3302E/TO) | 6 V→3.3 V LDO | 1 | | [TPS63060](https://www.flux.ai/search?type=components&q=TPS63060) | Buck-boost for 12 V rail (eGPU power) | 1 | | [ATmega328P](https://www.flux.ai/search?type=components&q=ATmega328P) | Arduino-Uno microcontroller | 1 | | [ESP32-WROOM-32](https://www.flux.ai/search?type=components&q=ESP32-WROOM-32) | Wi-Fi + Bluetooth co-processor | 1 | | [SX1276](https://www.flux.ai/search?type=components&q=SX1276) | LoRa transceiver | 1 | | [TUSB8041](https://www.flux.ai/search?type=components&q=TUSB8041) | 5-port USB 3.0 hub IC | 1 | | [Ethernet PHY](https://www.flux.ai/search?type=components&q=Ethernet%20PHY) | Gigabit Ethernet physical transceiver | 1 | | [SFP Cage](https://www.flux.ai/search?type=components&q=SFP%20Cage) | Fiber-optic SFP module connector | 1 | | [TDA19978](https://www.flux.ai/search?type=components&q=TDA19978) | HDMI 2.0 receiver (input) | 1 | | [TFP410](https://www.flux.ai/search?type=components&q=TFP410) | HDMI 2.0 transmitter (output) | 1 | | [TLV320AIC3101](https://www.flux.ai/search?type=components&q=TLV320AIC3101) | Audio codec for 3.5 mm jack & Bluetooth audio | 1 | | [Audio Jack 3.5mm](https://www.flux.ai/search?type=components&q=Audio%20Jack%203.5mm) | Headphone/mic port | 1 | | [SSD1306 OLED](https://www.flux.ai/search?type=components&q=SSD1306%20OLED) | Status display | 1 | --- ## 4. High-Level Design & Implementation Steps 1. **Schematic Creation** - Section off blocks: CPU + memory, power-supply, NVMe/USB bridge, MCU, wireless, USB hub, video, audio, I/O headers. - Place all parts from the list and wire per respective datasheet reference circuits. 2. **Power System** - Implement USB-C PD with STUSB4500 → buck/buck-boost & LDO rails. - Add LTC4412 to OR-ing battery pack into 6 V bus. - Include LTC3108 harvest input to 6 V bus (no recharge to AA). - Add decoupling & bulk caps per regulator datasheets; PTC fuses & ESD diodes on inputs. 3. **SoC & High-Speed Interfaces** - Break out Snapdragon 990 BGA with DDR4 routing (point-to-point). - Route PCIe Gen3 lanes to M.2 slot via JMS583 and to Titan Ridge for TB/eGPU. - Follow high-speed layout guidelines: impedance, length matching, EMI filters. 4. **MCU & Expansion Headers** - Place ATmega328P with UNO-style 2.54 mm headers; add ISP 6-pin, I²C pull-ups, reset circuit. 5. **Connectivity Blocks** - USB hub: TUSB8041 + ESD + chokes → five USB-A 3.0 ports. - Ethernet: RJ45 + magnetics + PHY; SFP cage + PHY/SFP interface. - Wireless: ESP32 module pad + SX1276 + antenna matching; program pads. 6. **Video & Audio** - HDMI RX (TDA19978) & TX (TFP410) blocks with TMDS ESD & termination. - Audio codec + 3.5 mm jack; route differential audio lines; add ESD. 7. **Display & Indicators** - SSD1306 OLED on I²C; add pull-ups & backlight power if needed. - LEDs for power, charge, status. 8. **PCB Layout & Mechanical** - Follow Raspberry Pi 2×20 header footprint & UNO shield hole pattern. - Add reinforcement for rugged use; standoffs at corners. - Define 4-layer stackup: • Top: signal • L2: GND • L3: PWR • Bottom: signal 9. **DRC/ERC Reviews** - Run ERC for decoupling, pull-ups, power nets. - Run DRC for high-speed clearance, differential pairs, via aspect ratios. 10. **Fabrication & Testing** - Export Gerbers, IPC-2581, BOM. - Prototype assembly; verify power sequencing, rails, interfaces. - Functional tests: USB-C PD negotiation, NVMe throughput, eGPU over TB3, wireless comm, audio, OLED. --- This spec sheet and part list should guide your Flux schematic and PCB layout workflow through to fabrication and validation. Let me know if you’d like to deep-dive into any specific block or review datasheet details next!

T-Mech prototyp_v2 - High current fan test fixture (5.0mm power traces, GND_MOC heatsink pour, star ground at 1000uF cap)

Este es el control PID analógico para un motor de CD

Welcome to your new project. Imagine what you can build here.

Welcome to your new project. Imagine what you can build here.

Welcome to your new project. Imagine what you can build here.

Welcome to your new project. Imagine what you can build here.

Welcome to your new project. Imagine what you can build here.

Welcome to your new project. Imagine what you can build here.

This is a board with mods from the v4.11 schematic. Priority issues to solve are areas boxed in by traces that do not have aconnection to gnd plane.

3.3V Li-ion MagTek Stripe Reader Interface with ATtiny85, AT24C256, and MCP1700 (Edge-mount Pads, 25x12.5 mm, GND Pour, ERC/DRC OK)

copilot Entiendo que deseas diseñar un oscilador utilizando el chip 555. Aquí están algunos pasos que puedes seguir para hacer esto. Conecta el pin 1 (GND) del IC 555 a la terminal negativa de tu fuente de alimentación (0V). Conecta el pin 8 (VCC) del IC 555 a la terminal positiva de tu fuente de alimentación (11V). Conecta la resistencia de 10kΩ (R1) entre el pin 8 (VCC) y el pin 7 (DISCHARGE) del 555. Conecta tu potenciómetro de 100kΩ (R2) entre el pin 7 (DISCHARGE) y el pin 6 (THRESHOLD) del 555. Junta los pines 2 (TRIGGER) y 6 (THRESHOLD) juntos y conecta los pines unidos al lado negativo de tu condensador de 10nF (C). Conecta el lado positivo del condensador de 10nF (C) a VCC (el pin 8). Conecta el pin 4 (RESET) al VCC si no quieres usar la función de reset. De lo contrario, puedes conectar una señal de reset aquí. Conecta el pin 3 (OUTPUT) del 555 al terminal positivo de tu resistencia de 470Ω. Conecta el otro terminal de la resistencia a tierra. El condensador de 10uF debe estar conectado en paralelo a la alimentación (entre VCC y GND) para suavizar cualquier ruido en la fuente de alimentación de 11V. Te sugiero que experimentes con el valor del potenciómetro (R2) hasta que consigas el Duty Cycle deseado. Por lo general, es posible cambiar la frecuencia del pulso y ajustar el Duty Cycle utilizando este control. Si, después de realizar estas conexiones y ajustes, aún no puedes obtener el Duty Cycle deseado, podría ser indicativo de que los valores de resistencia y condensador que tienes no son adecuados para tu rango de frecuencia y Duty Cycle objetivo. Para que obtengamos un Duty Cycle del 75%, necesitamos usar el chip 555 en modo astable y debemos calcular los valores de R1 y R2 (resistencia total de carga y descarga respectivamente) que nos ayude a conseguir esto. El tiempo de alta (T_high) y el tiempo de baja del ciclo (T_low) de la oscilación salen determinados por R1, R2, y C (el condensador). Se pueden usar las siguientes fórmulas para calcularlos: T_high = 0.693 * (R1 + R2) * C T_low = 0.693 * R2 * C Duty cycle = ( T_high ) / ( T_high + T_low ) Para un Duty Cycle de 0.75: Estableceremos R1 como la resistencia de 10 kilohmios que se proporcionó. Con el potenciómetro de 100 kilohmios como R2, podemos variarlo para ajustar el Duty Cycle según necesitemos hasta que se llegue a la relación deseada. Considerando que el condensador C es el condensador de 10 nF que se proporcionó, anteriores declaraciones son bajo supuesto que el tiempo de operación (T = T_high + T_low) caiga en un rango aceptable. Para el esquemático: Conecta VCC de tu 555 al terminal positivo de tu fuente de voltaje de 11V y GND a tierra. Conecta los pines 2 (TRIGGER) y 6 (THRESHOLD) juntos y al lado negativo de tu condensador de 10nF. Conecta el lado positivo del condensador a VCC. Conecta el pin 3 (OUTPUT) al terminal positivo de tu resistencia de 470 ohmios. Conecta el otro terminal de la resistencia a tierra. Conecta tu resistencia de 10 kilohmios entre VCC y los pines 2 y 6 del 555. Finalmente, conecta tu potenciómetro entre los pines 2 y 6 y el pin 7 (DISCHARGE) del 555. El condensador de 10uF debería estar conectado en paralelo a la alimentación para suavizar cualquier ruido en la alimentación de 11V. Estas son mis suposiciones y pasos sugeridos pero recuerda variar el potenciómetro hasta conseguir el Duty Cycle deseado en caso de no conseguirlo de forma inmediata. Si por alguna razón no puedes conseguir el Duty Cycle de 75%, es posible que las resistencias y condensadores proporcionados no sean los adecuados para el rango de frecuencia y Duty Cycle deseados. En tal caso, puede que tengas que utilizar otros valores de componentes.

Two-PCB low-noise EEG system: Digital board (ESP32-S3-MINI-1U + ADS1299 + CP2102N + USB-C + 1S Li-ion charger/power-path + DF40 mezzanine) and Analog board (3x ADS1299 + REF/BIAS/DRL + driven-shield electrode interfaces + local low-noise regulation + test points). DF40 mezzanine carries only power + digital SPI/control with shared SPI, shared START/RESET, and separate CS/DRDY per AFE. 4-layer stacks with strong analog/digital partitioning and interleaved GND pins on DF40.

ESP32-S3 CAM Audio-Visual Controller with I2S MEMS Microphone, Class-D Amplifier, SPI Display, Servos, Capacitive Touch and Integrated USB-C Power-Only Sink (VBUS via J6 -> 5V_IN -> SW1:P1 -> 5V_SW, CC1/CC2 5.1 kOhm to GND, VBUS TVS Surge Protection) + Added optional bulk electrolytic caps on 5V_SW near servo headers

SmartDeskPet v1.0 Shield Stage 1 status: - Goal: 5V input -> dual AMS1117-3.3 rails (+3V3_MCU and +3V3_WIFI) with common GND. - Note: Keep power nets explicitly named (avoid unnamed nets) to keep ERC happy. Stage 1 completion checklist: - Mark J1 Pin_1 (+5V) as a Power Output pin to satisfy ERC power-driver checks. - Verify all GND symbols/returns are on the same GND net. - Keep +5V_SERVO isolated from the main +5V net (only share GND). Stage 2 preparation notes (MPN/LCSC + layout constraints): - MPN/LCSC targets to define before Stage 2 exit: - AMS1117-3.3 (SOT-223): set exact MPN and (optionally) LCSC PN for both U1 and U2. - 100nF capacitor (0603): set MPN/LCSC for all 0603 100nF decouplers. - 4.7k resistor (0603): set MPN/LCSC for I2C pull-ups R1 and R2. - 1000uF bulk capacitor (radial): set MPN/LCSC for C7 (CP_Radial_D10.0mm_P5.00mm). - DC005 power jack/regulator input: select exact DC005 footprint + MPN/LCSC (if used). - 2.54mm headers/sockets: set MPN/LCSC for H1, H2, J1, J3, J4, J5, P3, P4, P5, and J2. - ESP-01S antenna keepout: - Reserve a copper keepout under and in front of the ESP-01S onboard antenna. - No copper pours/traces/components in the antenna region (top and bottom) per module guidelines. - H1/H2 header spacing: - Maintain 1000 mil spacing between H1 and H2 header centerlines (shield mechanical requirement). - Silkscreen placeholders: - Add silkscreen labels for: 5V IN, GND, +3V3_MCU, +3V3_WIFI, SERVO1, SERVO2, I2C SDA/SCL, DHT11, ASRPRO UART2, ESP-01S UART3. - Add placeholder text for: MPN, LCSC, board revision, and date code. Stage 3 layout constraints (placement and routing guidance): - Connector placement strategy: - Place H1 and H2 first to lock the shield mechanical interface; enforce 1000 mil spacing. - Place J1 and any DC005 input at the board edge for easy access. - Designated power area planning: - Group U1, U2, and C7 near the 5V entry point; keep high-current 5V and regulator loops short. - Use wide copper for +5V and any servo supply; stitch GND around power section. - Antenna keepout boundaries: - Place J2 (ESP-01S socket) at a board edge with the antenna facing outward. - Enforce a top-and-bottom copper keepout in the antenna region; keep noisy power traces away.

Architectural Lavender Translation Collar – ESP32‑S3 Wi‑Fi + LoRa, USB‑C, Li‑ion, low‑power design Overview Experience a cutting-edge IoT solution with this low‑power board built around the ESP32‑S3‑MINI‑1‑N8. Designed for seamless Wi‑Fi (2.4 GHz), BLE, and LoRa (868 MHz) connectivity, this board integrates ENS161 and ENS210 sensors over I2C alongside an RFM95W‑868 LoRa radio on SPI. It is powered via a 3.7 V Li‑ion cell with USB‑C charging up to 500 mA, complete with full battery protection, a robust 3.3 V rail tailored for Wi‑Fi burst currents, and per‑peripheral power gating to enhance energy efficiency. Core Features • MCU: ESP32‑S3‑MINI‑1‑N8 equipped with an onboard PCB antenna for 2.4 GHz Wi‑Fi/BLE, ensuring optimal wireless performance. • Sensors: Integrated ENS161 and ENS210 sensors utilize a shared I2C bus with controllable 4.7 kΩ pull‑ups for streamlined communication. • LoRa Radio: The RFM95W‑868 module, connected via SPI, enables long‑range communication at 868 MHz. Power & USB‑C Connectivity • Battery: A reliable 3.7 V 1200 mAh Li‑ion battery connected via a right‑angle JST‑PH 2‑pin connector features built‑in battery protection. • Charging: The USB‑C receptacle, with CC resistors and TVS protection on D+/D− along with series resistors, supports fast, safe charging with a current limit of 500 mA. • Regulation: A dedicated 3.3 V regulator capable of handling Wi‑Fi burst currents coupled with bulk and high‑frequency decoupling ensures stable operation, supported by status LEDs indicating power and charge states. Low‑Power Control • Peripheral Management: Load switches allow selective power‑gating of the ENS161, ENS210, and RFM95W modules, controlled directly by ESP32‑S3 GPIOs. • Energy Efficiency: Controllable I2C pull‑ups minimize idle current, vital for prolonged battery life in IoT applications. RF and Antenna Integration • 2.4 GHz: Utilizes the integrated PCB antenna on the ESP32‑S3 with proper ground/metal keep‑out zones for optimal signal integrity. • 868 MHz: Features a controlled‑impedance feed from the RFM95W to a PI matching network (C‑L‑C pads) with flexible antenna options—selectable via SMA connector, chip antenna, or PCB trace—and includes RF ESD protection. Connectivity & Debug Features • USB‑C Interface: Provides secure data connectivity with integrated safeguards and proper terminations. • Debugging: A comprehensive programming/debug header exposes EN, BOOT, and UART lines, with test points on key rails and buses (3V3, VBAT, SCK, MOSI, MISO, SDA, SCL, RESET/EN, GND) to simplify development and troubleshooting. Design Verification • Rigorous ERC/DRC and decoupling checks ensure adherence to component ratings and optimal signal routing. • Maintain RF keep‑outs and impedance‑controlled traces for both 2.4 GHz and 868 MHz paths, securing reliable performance even during high‑intensity operations. #IoT #ESP32S3 #LoRa #LowPowerDesign #USB-C #WirelessConnectivity #BatteryPowered #RFDesign

ESP32-S3 CAM Audio-Visual Controller with I2S MEMS Microphone, Class-D Amplifier, SPI Display, Servos, Capacitive Touch and Integrated USB-C Power-Only Sink (VBUS via J6 → 5V_IN → SW1:P1 → 5V_SW, CC1/CC2 5.1 kΩ to GND, VBUS TVS Surge Protection) #USB_C #PowerManagement #5V

TECHNICAL ASSIGNMENT AND DESIGN GUIDE Active Three-Way Crossover on NE5532 Powered by AM4T-4815DZ and Amplifiers TPA3255 (Updated Version) 1. GENERAL PURPOSE OF THE DEVICE The goal of the development is to create an active three-way audio crossover for one channel of a loudspeaker system, working with the following drivers: LF: VISATON W250 MF: VISATON MR130 HF: Morel MDT-12 Each frequency range is amplified by a separate power amplifier: LF: TPA3255 in PBTL mode (mono) MF + HF: second TPA3255 in stereo mode (one channel for MF, the other for HF) The crossover accepts a single linear audio signal (mono) and divides it into three frequency bands: Range Frequency Range LF 0 – 650 Hz MF 650 – 2500 Hz HF 2500 Hz and above Filter type: Linkwitz–Riley 4th order (24 dB/oct) at each crossover point (650 Hz and 2500 Hz). The crossover must provide: minimal self-noise; no audible distortion in the audible range; stable operation with NE5532 at ±15 V power supply; easy adjustment of the level for each band, as well as the overall level (via the input buffer). 2. FILTER TYPES AND BASIC OPERATING PRINCIPLES Each filter is implemented as two cascaded Sallen–Key 2nd order (Butterworth) stages, resulting in a final 4th order LR4 filter. Topology: non-inverting Sallen–Key, optimal for NE5532. For all stages: Cascade gain: K ≈ 1.586 This provides a Q factor of 0.707 (Butterworth), which in combination gives a Linkwitz–Riley 4th order. 3. COMPONENT VALUES FOR FILTERS 3.1 Universal Parameters RC chain capacitors: 10 nF, film capacitors, tolerance ≤ 5% Resistors: metal-film, tolerance ≤ 1% The gain of each stage is set by feedback resistors: Rf = 5.9 kΩ Rg = 10 kΩ K ≈ 1 + (Rf / Rg) ≈ 1.59 The circuit should allow for the installation of a small capacitor (10–47 pF) in parallel with Rf (footprint provided) for possible stability correction (not mandatory to install in the first revision). 3.2 650 Hz Filters (Low-frequency boundary for MF) These are used for the division between W250 and MR130. LP650 — Low-frequency Filter 2nd Order R1 = 24.9 kΩ R2 = 24.9 kΩ C1 = 10 nF C2 = 10 nF Two stages: LP650 #1 and LP650 #2. HP650 — MF High-frequency Filter 2nd Order Same values: R1 = 24.9 kΩ R2 = 24.9 kΩ C1 = 10 nF C2 = 10 nF Two stages: HP650 #1 and HP650 #2. 3.3 2500 Hz Filters (Upper boundary for MF) These are used for the division between MR130 → MDT-12. LP2500 — High-pass MF Filter R1 = 6.34 kΩ R2 = 6.34 kΩ C1 = 10 nF C2 = 10 nF Two stages: LP2500 #1 and LP2500 #2. HP2500 — High-frequency Filter Same values: R1 = 6.34 kΩ R2 = 6.34 kΩ C1 = 10 nF C2 = 10 nF Two stages: HP2500 #1 and HP2500 #2. 4. OPERATIONAL AMPLIFIERS The NE5532 (dual op-amp, DIP-8 or SOIC-8) is used. A minimum of 4 packages (8 channels) for filters: NE5532 Function U1A, U1B LP650 #1, LP650 #2 (LF) U2A, U2B HP650 #1, HP650 #2 (Lower MF cut-off) U3A, U3B LP2500 #1, LP2500 #2 (Upper MF cut-off) U4A, U4B HP2500 #1, HP2500 #2 (HF) Additionally: U5 — input buffer / preamplifier (both channels) If necessary, an additional NE5532 (U6) for the balanced input (see section 6.2). All NE5532 should have local decoupling for power supply (see section 5.1). 5. CROSSOVER POWER SUPPLY AM4T-4815DZ DC/DC module is used: Input: 36–72 V, connected to the 48 V power supply for TPA3255 amplifiers. Output: +15 V / –15 V, up to 0.133 A per side. Maximum output capacitance: ≤ 47 µF per side (according to the datasheet). 5.1 Power Filtering Input (48 V): RC variant (simpler, acceptable for the first revision): R = 1–2 Ω / 1–2 W C = 47–100 µF (for 63 V or higher) LC variant (preferred for improved noise immunity): L = 10–22 µH C = 47–100 µF The developer may implement LC if confident in choosing the inductance and its parameters. Output +15 V and –15 V (general filtering): Electrolytic capacitor 10–22 µF per side 100 nF (X7R) per side to GND Local decoupling for NE5532 (REQUIRED): For each NE5532 package: 100 nF between +15 V and GND 100 nF between –15 V and GND Place as close as possible to the op-amp power pins (short traces). Additional local filtering for power lines: For each NE5532, decouple from the ±15 V main rails: Either 4.7–10 Ω resistor in series with +15 V and –15 V, Or ferrite bead in each rail. After this component, place local capacitors (100 nF + 1–4.7 µF) to ground. 6. INPUT TRACT: INPUTS, BUFFER, ADJUSTMENT 6.1 Unbalanced Input (RCA / Jack / Linear) The main mode is the unbalanced linear input, for example, RCA. Input tract structure: RF-filter and protection: Signal → series resistor Rin_series = 100–220 Ω After resistor — capacitor Cin_RF = 470–1000 pF to GND This forms a low-level RF filter and reduces high-frequency noise. DC-block (low-pass HP-filter): Capacitor Cin_DC = 2.2–4.7 µF film in series Resistor to ground Rin_to_GND = 47–100 kΩ Cut-off frequency — negligible in the audio range but removes DC. Input buffer / preamplifier (NE5532, U5): Non-inverting configuration. Input — after DC-block. Gain: adjustable, e.g., Rg_fixed = 10 kΩ (to GND through trimmer) Rf = 10–20 kΩ + footprint for trimmer (e.g., 20 kΩ) The gain should be in the range of 0 dB to +10…+12 dB. Possible configuration: Rg = 10 kΩ fixed Rf = 10 kΩ + 10 kΩ trimmer in series. This allows adjusting the overall level of the crossover according to the source and amplifier levels. Buffer output: A low-impedance output (after NE5532) This signal is simultaneously fed to the inputs of all filters: LP650 (LF) HP650 → LP2500 (MF) HP2500 (HF) 6.2 Balanced Input (XLR / TRS) — Optional, but laid out on the board The board should allow for a balanced input, even if it’s not used in the first revision. Implementation requirements: XLR/TRS connector (L, R, GND) or separate 3-pin header. Simple differential receiver on NE5532 (extra U6 package or use one channel of U5 if sufficient). Circuit: classic instrumentation amplifier or differential amplifier: Inputs: IN+ and IN– Output — single-ended signal of the same level (or slightly amplified), fed to DC-block and buffer (or directly to the buffer if integrated). Switching between balanced/unbalanced mode: Implement using jumpers / bridges or adapters: Either switch before the buffer, Or use two separate pads, one of which is unused. All balanced input grounds must be connected to the same AGND point as the unbalanced input to avoid ground loops. 7. LEVEL ADJUSTMENT OF BANDS (BEST METHOD) The level adjustment of each band (LOW, MID, HIGH) is required to match the sensitivity of the speakers and amplifiers. Recommended method: After each full filter (after LP650×2, MID-chain HP650×2 → LP2500×2, HP2500×2), install: A passive attenuator: Series: Rseries (0–10 kΩ, adjustable) Shunt: Rshunt to GND (10–22 kΩ, fixed or adjustable) For simplicity and reliability: Implementation on the board: For each band (LOW, MID, HIGH) provide: Pad for multi-turn trimmer 10–20 kΩ as a divider (between signal and ground) in the "level adjustment" configuration. If adjustment is not needed — install a fixed divider (two resistors) or simply use a jumper. It is preferable to use: For setup: multi-turn trimmers 10–20 kΩ, available on the top side of the board. Nominals for the initial configuration can be selected through measurements, but the PCB should have flexibility. This provides: Accurate balancing of band volumes without interfering with the filters; Flexibility for fine-tuning to the specific characteristics of the speakers. 8. INPUTS AND OUTPUTS OF THE CROSSOVER (FINAL) 8.1 Inputs 1× Unbalanced linear input (RCA or 3-pin header) 1× Balanced input (XLR/TRS or 3-pin header) — optional, but space must be provided on the board. Input impedance (unbalanced after RF-filter): 22–50 kΩ. The input tract must be implemented using shielded cables. 8.2 Outputs Outputs to amplifiers: Output Signal LOW OUT After LP650×2 (LF) MID OUT After HP650×2 → LP2500×2 (MF) HIGH OUT After HP2500×2 (HF) Each output: Series resistor 100–220 Ω (prevents possible oscillations and simplifies cable management). A nearby own AGND pad (ground output), so the signal pair SIG+GND runs together. Outputs should be compactly placed on 2-pin connectors (SIG+GND) or 3-pin (SIG+GND+reserve). 9. PCB DESIGN REQUIREMENTS 9.1 Board Number of layers: 2 layers Bottom layer: solid analog ground (AGND). 9.2 Component Placement Key principles: RC chains of each filter (R1, R2, C1, C2, Rf, Rg) should form a compact "island" around the corresponding op-amp. If elements are placed too far apart, the filter will not work correctly (calculated frequency and Q will shift). Feedback tracks (Rf and Rg) should be as short and direct as possible. The AM4T-4815DZ module should be placed: Far from the input buffer, Far from the first filter stages, If necessary, make a "cutout" in the ground under it to limit noise propagation. Place the input connector, RF-filter, and buffer on one side of the board, and the output connectors on the opposite side. 9.3 Ground The entire audio circuit uses one analog ground: AGND. Connect AGND to the power ground (48 V and amplifiers) at one point ("star"). The star should be implemented as: One point/pad where: The ground of the input, The ground of the filters, The ground of the outputs, The ground of the DC/DC. Avoid long narrow "ground" jumpers — use wide polygons with a single connection point. 9.4 Placement of Output Connectors Group LOW/MID/HIGH compactly. Each should have its own GND pad nearby. Route the SIG+GND pairs as signal pairs, avoiding large loops. 10. ADDITIONAL ELEMENTS: PROTECTION, TEST POINTS 10.1 Test Points (TP) Be sure to provide test points (pads): TP_IN — crossover input (after buffer) TP_LOW — LF filter output TP_MID — MF filter output TP_HIGH — HF filter output TP_+15, TP_–15, TP_GND — power control This greatly simplifies debugging with an oscilloscope. 10.2 Power Protection On the 48 V input — it is advisable to provide: Diode/scheme for reverse polarity protection (if possible), TVS diode or varistor for voltage spikes (optional). 10.3 Possible Stability Correction Pads for small capacitors (10–47 pF) in parallel with Rf in buffers and, if necessary, in some stages — in case of stability issues (this can be not installed in the first revision, but footprints should be provided). 11. BILL OF MATERIALS (BOM) Operational Amplifiers: NE5532 — 4 pcs (filters) NE5532 — 1–2 pcs (input buffer and balanced input) Total: 5–6 NE5532 packages. Resistors (1%, metal-film): 24.9 kΩ — 8 pcs 6.34 kΩ — 8 pcs 10 kΩ — ≥ 12 pcs (feedback, buffers, etc.) 5.9 kΩ — 8 pcs 22 kΩ — 1–2 pcs (input, auxiliary chains) 47–100 kΩ — several pcs (DC-block, input) 100 kΩ — 1 pc (if needed) 100–220 Ω — 4–6 pcs (outputs, RF, protection) 4.7–10 Ω — 2 pcs for each op-amp or group of op-amps (power filtering) — quantity to be clarified during routing. Trimmer Resistors: 10–20 kΩ multi-turn — one for each band (LOW, MID, HIGH) 10–20 kΩ — 1–2 pcs for the input buffer (overall gain adjustment). Capacitors: 10 nF film — 16 pcs (RC filters) 2.2–4.7 µF film — 1–2 pcs (input DC-block) 10–22 µF electrolytic — 2–4 pcs (DC/DC outputs) 1–4.7 µF (X7R / tantalum) — 1 pc for local power filtering (optional). 100 nF ceramic X7R — 10–20 pcs (local decoupling for each op-amp) 470–1000 pF — 1–2 pcs (RF filter on the input) 10–47 pF — optional for stability correction (Rf). Power Supply: AM4T-4815DZ — 1 pc Inductor 10–22 µH (if LC filter) — 1 pc R 1–2 Ω / 1–2 W — 1 pc (if RC filter). Connectors: Input (RCA + 3-pin for internal input) Balanced (XLR/TRS or 3-pin header) Outputs LOW/MID/HIGH — 2-pin/3-pin connectors. 12. TESTING RECOMMENDATIONS 12.1 First Power-up Apply ±15 V without installed op-amps. Check with a multimeter: +15 V –15 V No short circuits in the power supply. Install the op-amps (NE5532). Apply a sine wave of 100–200 mV RMS (signal generator). Check with an oscilloscope at TP: LP650 — should pass LF and roll off everything above 650 Hz. HP650 — should roll off LF, pass everything above 650 Hz. LP2500 — should roll off above 2500 Hz. **HP250 0** — should pass everything above 2500 Hz. 12.2 Phase Check The Linkwitz–Riley 4th order should give a flat frequency response when summed at the crossover points. This can be verified with REW/Arta. 12.3 Noise Check If there is noticeable "shshsh" or whistling: Check: Grounding layout (star) Placement and filtering of AM4T-4815DZ Presence and proper installation of all 100 nF and local filters. 13. FINAL RECOMMENDATIONS FOR BEGINNERS Do not rush, build the circuit step by step: input → buffer → one filter → test, then continue. Check component values at least twice before soldering. Filters should be routed as compact "islands" around the op-amp, do not stretch R and C across the board. Always remember the rule: "The feedback trace should be as short as physically possible." Before ordering the PCB, make a "paper prototype": print at 1:1, cut it out, place real components to check everything fits.

VikingBoard: Multi-Wireless Expansion Board with WT32-SC01 Wi-Fi/BT, LoRa CC1101, NRF24L01+, GPS, Haptic Drivers, and Multi-Rail Power Management (+3V3_IO, +3V3_RF, +3V3_KBD, +5V_SYS, GND) #multi-wireless #expansion #power-management

Entrada de Corriente y Fusible Qué hace: Es el punto de partida. La electricidad de 120V entra a tu prototipo. El fusible es el guardián de seguridad principal. Dónde se conecta: El Cable de Alimentación se conecta al enchufe de la pared. Dentro de la caja, el cable VIVO (el que lleva la potencia, usualmente negro o rojo) se conecta a una patita del Portafusible. Dónde termina: La otra patita del Portafusible es ahora la salida segura del cable VIVO. 2. Fuente de Poder (HLK-PM01) Qué hace: Es el "transformador" que alimenta al cerebro. Convierte los peligrosos 120V en 5V seguros. Dónde se conecta: Sus dos pines de entrada (AC) se conectan a los cables VIVO (justo después del fusible) y NEUTRO de la entrada de corriente. Dónde termina: Sus dos pines de salida (DC) entregan 5V. El pin +5V se conecta al pin VIN del ESP32. El pin GND (tierra) se conecta a un pin GND del ESP32. 3. Sensor de Voltaje (ZMPT101B) Qué hace: "Observa" el voltaje de la línea de 120V de forma segura. Dónde se conecta: Sus dos pines de entrada (AC) se conectan igual que la fuente de poder: al VIVO (después del fusible) y al NEUTRO. Dónde termina: Su pin de salida de señal (Aout o Signal) se conecta a un pin analógico del ESP32 (por ejemplo, GPIO35). También necesita alimentación, así que sus pines VCC y GND se conectan a los pines 3.3V y GND del ESP32. 4. Sensor de Corriente (WCS1600) Qué hace: "Siente" cuánta corriente (amperios) está pasando hacia la licuadora. Dónde se conecta: El cable VIVO de 120V (el que viene del fusible) pasa a través del agujero blanco del sensor. No se conecta eléctricamente, solo pasa por en medio. Dónde termina: La placa del sensor tiene 3 pines de control: VCC se conecta al pin 3.3V del ESP32. GND se conecta a un pin GND del ESP32. Aout (salida analógica) se conecta a otro pin analógico del ESP32 (por ejemplo, GPIO34). 5. Relé de Estado Sólido (SSR-25 DA) Qué hace: Es el interruptor inteligente. Actúa como una compuerta que abre o cierra el paso de la electricidad a la licuadora. Dónde se conecta: Lado de Potencia (AC): El cable VIVO (que ya pasó por el sensor de corriente) se conecta a uno de los terminales de alta potencia del SSR. Lado de Control (DC): El pin de control DC+ del SSR se conecta a un pin digital del ESP32 (por ejemplo, GPIO23). El pin DC- se conecta a un pin GND del ESP32. Dónde termina: El otro terminal de alta potencia del SSR se conecta al terminal "vivo" del tomacorriente final. 6. Tomacorriente de Salida (a la Licuadora) Qué hace: Es el enchufe final donde conectas tu aparato. Dónde se conecta: Su terminal VIVO recibe el cable que viene de la salida del SSR. Su terminal NEUTRO recibe el cable NEUTRO directamente desde la entrada de corriente principal. Dónde termina: ¡Aquí termina el viaje! La licuadora recibe la electricidad controlada y medida por tu prototipo.