MicroSD card breakout board+ | Adafruit Industries 254 #commonpartslibrary #microsdcard #breakout #prototyping #breakoutboard

Connector Header Through Hole 5 position 0.100" (2.54mm) SWD header 1x5 2.54mm PinHeader 1x05 2.54mm horizontal The TSW-105-07-G-S is a high-reliability, through-hole, single-row pin header from Samtec’s TSW series. It is designed for board-to-board or wire-to-board interconnections in a wide range of electronic applications. Featuring a standard 2.54 mm pitch and gold-plated contacts, this connector ensures reliable electrical performance, durability, and compatibility with industry-standard mating components. Mechanical Characteristics Connector Type: Pin Header Mounting Type: Through-Hole Number of Positions: 5 Number of Rows: Single Row Pitch: 2.54 mm Orientation: Vertical Termination Style: Solder Contact Shape: Square Post Material and Plating Contact Material: Phosphor Bronze Contact Plating: Gold over Nickel Housing Material: Black Thermoplastic (UL94 V-0 rated) Electrical Characteristics Current Rating: Typically up to 3 A per contact Voltage Rating: Typically up to 500 VAC Contact Resistance: Low contact resistance for reliable signal transmission Insulation Resistance: High insulation resistance Environmental Characteristics Operating Temperature Range: -55°C to +125°C Flammability Rating: UL94 V-0 Applications Board-to-board connections Wire-to-board interfaces Prototyping and development systems Industrial and consumer electronics Compliance and Standards RoHS Compliant Lead-Free #CommonPartsLibrary #Connector #Header #TSW

Connector Header Through Hole 40 position 0.100" (2.54mm) Raspberry Pi 40 pin header The TSW-120-07-G-D is a through-hole, double-row vertical header manufactured by Samtec. It features 40 total positions (2 rows of 20 pins) with a standard 2.54 mm pitch. This connector is widely used for board-to-board connections, prototyping, and general-purpose signal routing in embedded and electronic systems. It is designed for reliable mechanical and electrical performance with gold-plated contacts for enhanced conductivity and corrosion resistance. Manufacturer Samtec Inc. Manufacturer Part Number TSW-120-07-G-D Product Type Through-Hole Pin Header Number of Positions 40 (2 × 20) Number of Rows 2 Pitch 2.54 mm (0.100") Row Spacing 2.54 mm (0.100") Mounting Type Through Hole Orientation Vertical Contact Material Phosphor Bronze Contact Plating Gold (Au) over Nickel Plating Thickness Typically 10 µin (0.25 µm) Gold Insulator Material Black Liquid Crystal Polymer (LCP) Current Rating Typically 3.0 A per contact (depending on application conditions) Voltage Rating Typically 250 VAC Operating Temperature Range -55°C to +125°C Termination Type Solder Contact Style Square Post Post Length Standard Samtec “-07” tail length (approx. 2.92 mm tail, varies slightly per datasheet) Applications Embedded systems (e.g., Raspberry Pi GPIO headers) Development boards and expansion modules Board-to-board interconnects Prototyping and test setups Compliance RoHS Compliant Lead-Free Notes Compatible with standard 2.54 mm female headers and sockets Commonly used in stacking or mezzanine configurations Available in various plating options and pin lengths under the TSW series #commonpartslibrary #connector

Connector Header Through Hole 4 position 0.100" (2.54mm) UART header 1x4 2.54mm Single-row, through-hole male pin header with 4 positions and 2.54 mm pitch. Designed for board-to-wire or board-to-board interconnect applications such as UART interfaces. Mechanical Specifications Number of Positions: 4 Number of Rows: 1 Pitch: 2.54 mm (0.100") Mounting Style: Through Hole Mounting Angle: Straight (Vertical) Contact Gender: Male (Pin) Termination Type: Solder Pin Housing Material: Polybutylene Terephthalate (PBT) Housing Color: Black Electrical Specifications Current Rating: 4.3 A – 6.3 A (per pin, depending on conditions) Voltage Rating: 450 VAC – 550 VAC Contact Resistance: (Typical for series, not specified exact) Insulation Resistance: (Not specified) Material & Plating Contact Material: Phosphor Bronze Contact Plating: Gold Flammability Rating: UL94 V-0 Environmental & Compliance RoHS Compliance: Yes Country of Origin: USA Packaging Packaging Type: Bulk Factory Pack Quantity: 1 Series Information Series: TSW (Samtec Pin Strip Header Series) Product Type: Headers & Wire Housings Typical Applications UART / Serial communication headers Microcontroller programming interfaces General-purpose 2.54 mm interconnects Prototyping and development boards #commonpartslibrary #connector

555 Type, Timer/Oscillator (Single) IC 100kHz 8-PDIP NE555 DIP-8 through hole The NE555P is a classic and widely used precision timer IC manufactured by companies like Texas Instruments and others. It belongs to the popular 555 timer family and is designed for generating accurate time delays, oscillations, and pulse signals. The “P” variant refers to the PDIP (Plastic Dual In-line Package), making it ideal for through-hole mounting, breadboarding, and prototyping. NE555P PDIP-8 timer Internally, the NE555P consists of: Two comparators A flip-flop A discharge transistor A voltage divider network These blocks allow flexible configuration for timing and waveform generation. Key Features Timing & Operation Modes Monostable mode (one-shot pulse generation) Astable mode (continuous oscillator) Bistable mode (flip-flop operation) Electrical Characteristics Supply voltage range: 4.5V to 16V Output can source or sink up to 200 mA Adjustable duty cycle Performance High timing accuracy and stability Timing range from microseconds to hours (depends on external R and C) Temperature-stable operation Package & Usability 8-pin DIP (through-hole) package Easy to use for: Breadboards DIY electronics Educational projects Common Applications LED flashers and blinkers Pulse generation Time delay circuits PWM control (e.g., dimming LEDs, motor speed control) Tone/sound generation #Timer #commonpartslibrary

Connector Header Through Hole 12 position 0.100" (2.54mm) pin header 1x12 2.54mm The TSW-112-07-G-S is a single-row, 12-position, 2.54 mm pitch through-hole male pin header from Samtec’s TSW series. It is designed for reliable board-to-board or wire-to-board connections in prototyping and production environments. Featuring gold-plated phosphor bronze contacts and a durable PBT housing, this connector ensures excellent electrical performance, corrosion resistance, and mechanical durability. It is commonly used in embedded systems, development boards, and general-purpose PCB interconnections. Product Type Pin Header / Pin Strip Number of Positions 12 Number of Rows 1 Pitch 2.54 mm (0.1 in) Mounting Style Through Hole Mounting Angle Straight Termination Style Solder Pin Contact Type Male Pin Contact Material Phosphor Bronze Contact Plating Gold Housing Material Polybutylene Terephthalate (PBT) Housing Color Black Flammability Rating UL 94 V-0 Current Rating 4.3 A to 6.3 A (application dependent) Voltage Rating Up to 550 VAC Packaging Bulk Country of Origin Vietnam RoHS Compliance Compliant #commonpartslibrary #connector #header

20 Position Receptacle Connector 0.100" (2.54mm) Through Hole Tin The SSW-120-01-T-S is a single-row, 20-position female (receptacle) socket strip with a 2.54 mm (0.1") pitch, intended for through-hole PCB mounting. It uses Samtec’s Tiger Buy™ contact system, providing reliable electrical performance and durability for repeated mating cycles. It is commonly used in embedded systems, development boards, and general PCB interconnections, especially where standard 0.1" headers are required. Female header 1x20 2.54mm Key Features Standard 2.54 mm Pitch Industry-standard spacing compatible with most pin headers and prototyping systems 20 Positions, Single Row Ideal for compact signal connections and header interfaces Tiger Buy™ Contact System Provides low insertion force and reliable electrical contact Available in standard or low insertion force variants Through-Hole Mounting Ensures strong mechanical retention and durability on PCBs Tin-Plated Contacts (T option) Cost-effective plating suitable for general-purpose applications High-Speed Capability Supports signals up to ~8 Gbps, depending on application and layout Wide Operating Temperature Range Typically −55 °C to +105 °C, suitable for industrial environments Material Construction Contacts: Phosphor bronze Insulator: High-temperature plastic (e.g., LCP) Versatile Mating Compatibility Mates with common Samtec header series (TSW, MTSW, etc.) and standard 0.025" square posts #CommonPartsLibrary #Connector #SSW-120

Connector Header Through Hole 6 position 0.100" (2.54mm) The 640456-6 is a 6-position, single-row wire-to-board header connector from TE Connectivity (AMP series), designed for reliable power and signal connections in a wide range of electronic applications. It features a 2.54 mm pitch and through-hole mounting for strong mechanical retention and ease of assembly. The connector is commonly used with matching crimp housings and terminals, providing a secure and serviceable interconnect solution for PCB-based systems. Key Features 6-position (1x6) header connector 2.54 mm pitch spacing Through-hole mounting (THT) Vertical (top-entry) orientation Friction-lock compatible with mating housings Tin-plated contacts for good conductivity and corrosion resistance Durable thermoplastic housing Mechanical Characteristics Mounting Type: Through Hole Orientation: Vertical (Top Entry) Pitch: 2.54 mm Number of Positions: 6 Row Configuration: Single row Mating Type: Friction fit with compatible housing Termination Type: Solder tails Electrical Characteristics Rated Current: Up to 3 A per contact (depending on wire gauge) Rated Voltage: 250 V AC/DC Contact Resistance: ≤ 20 mΩ (initial) Insulation Resistance: ≥ 1,000 MΩ Dielectric Withstanding Voltage: 1,000 VAC Material Specifications Housing: Thermoplastic, UL94V-0 rated Contacts: Copper alloy Contact Plating: Tin over nickel Environmental Specifications Operating Temperature Range: -40°C to +105°C Storage Temperature: -40°C to +105°C Packaging Information Packaging Type: Bulk or tray (varies by supplier) RoHS Compliant: Yes Lead-Free: Yes Compatible Components Mating Housing: TE Connectivity compatible crimp housings (e.g., AMP series) Crimp Terminals: соответствующие crimp contacts for 2.54 mm systems Typical Applications PCB interconnects Consumer electronics Industrial control systems Power and signal distribution Prototyping and development boards #CommonPartsLibrary #Connector #Header #Male-pins #MTA-100

Connector Header Through Hole 10 position 0.100" (2.54mm) The TSW-105-07-G-D is part of the Samtec TSW series, which consists of 0.100″ (2.54 mm) pitch PCB header strips. It is a dual-row, 10-position (2×5) male pin header intended for through-hole mounting on printed circuit boards. This connector provides a simple and reliable way to connect PCBs or interface with cables and other connectors (e.g., female sockets or IDC connectors). Key Features Connector Type: Rectangular header (male pin) Mounting Type: Through-hole (THT) Pitch: 2.54 mm (0.100″ standard spacing) Number of Positions: 10 pins Rows: Dual-row (2×5 configuration) Contact Style: 0.025″ (0.635 mm) square posts Orientation: Vertical (straight header) Plating: Gold (indicated by “G”) for reliable contact Electrical & Mechanical Highlights Current Rating: up to ~6.3 A per contact (series typical) Voltage Rating: up to ~400–550 VAC Operating Temperature: approx. -55 °C to +125 °C High durability: supports multiple mating cycles (extended-life design) Typical Applications Microcontroller and development boards Board-to-board connections Prototyping systems (breadboard-compatible headers) Industrial and embedded electronics Cable-to-board interfaces #CommonPartsLibrary #Connector #Header #TSW

Connector Header Through Hole 12 position 0.100" (2.54mm) The TSW-106-07-F-D is a double-row, through-hole vertical header from Samtec’s TSW series, designed for board-to-board or wire-to-board interconnections. It features a standard 2.54 mm pitch with 12 total contacts arranged in two rows of six positions. This connector is commonly used in prototyping, embedded systems, and general-purpose PCB applications where reliable and cost-effective interconnect solutions are required. Applications PCB prototyping Embedded systems Mezzanine board connections Development boards General-purpose interconnects Mating Compatibility Compatible with standard 2.54 mm pitch female headers and sockets Works with IDC connectors and jumper wires #commonpartslibrary #connector #header

Connector Header Through Hole 18 position 0.100" (2.54mm) # TSW-118-07-G-S ## General Description The TSW-118-07-G-S is a through-hole board-to-board and wire-to-board interconnect header manufactured by Samtec. It belongs to the TSW series of standard terminal strip headers designed for reliable signal transmission in electronic assemblies, embedded systems, industrial controls, telecommunications equipment, instrumentation, and general-purpose printed circuit board applications. The component features precision-machined contacts, robust mechanical construction, and compatibility with a wide range of mating connectors. Its design supports secure electrical connections while maintaining excellent durability during repeated mating cycles and long-term operation in demanding environments. ## Key Features ### Mechanical Characteristics * Through-hole mounting configuration * Single-row terminal strip header design * Straight vertical orientation * Precision-machined contact system * High-reliability board-level interconnection ### Contact System * Gold-plated contact surface * Enhanced conductivity and signal integrity * Corrosion-resistant contact finish * Suitable for repeated insertion and removal cycles ### Electrical Characteristics * Low contact resistance * Reliable signal transmission * Suitable for low-power and signal-level applications * Stable electrical performance across operating conditions ### Material Construction * High-temperature thermoplastic insulator * Durable metallic contact structure * RoHS-compliant materials * Lead-free manufacturing compatibility ### Environmental Characteristics * Industrial-grade operating capability * Resistant to mechanical wear during mating cycles * Suitable for automated and manual assembly processes ### Application Areas * Embedded Systems * Microcontroller Development Boards * Industrial Automation Equipment * Telecommunications Hardware * Test and Measurement Instruments * Medical Electronics * Data Acquisition Systems * Prototyping Platforms * Consumer Electronic Devices * PCB Interconnection Applications ### Compliance * RoHS Compliant * Lead-Free Compatible * Industry-standard connector footprint ## Manufacturer Samtec Inc. ## Product Family TSW Series Terminal Strip Headers #Samtec #TSW11807GS #TerminalStripHeader #PCBConnector #BoardToBoardConnector #WireToBoardConnector #ElectronicsComponents #EmbeddedSystems #IndustrialElectronics #InterconnectSolutions #ThroughHoleConnector #ElectronicDesign #HardwareEngineering #PCBAssembly #CommonPartsLibrary #Connector #Header #TSW pin header 1x18 2.54mm

Connector Header Through Hole 6 position 0.100" Pin Header 1x06 2.54mm PinHeader 1x6 2.54mm The TSW-106-07-G-S is a through-hole vertical header designed for board-to-board and board-to-wire interconnection in electronic systems. It is part of a precision connector series known for high reliability, consistent mechanical alignment, and excellent electrical performance. The component is commonly used in applications requiring modular connectivity, prototyping flexibility, and secure signal routing between printed circuit boards or peripheral interfaces. Its design supports repeated mating cycles while maintaining stable contact integrity, making it suitable for both development and production environments. Functional Description This component functions as a single-row header that provides a direct electrical interface between a printed circuit board and a mating connector or cable assembly. It enables straightforward signal or power routing through plated pins that are soldered into the PCB. The vertical orientation allows perpendicular mating, supporting compact and efficient board layouts. The connector is designed to ensure proper alignment and retention during mating, reducing the risk of intermittent connections. Electrical Characteristics The header supports low-voltage signal transmission and moderate current levels typical of board-level interconnects. It offers low contact resistance to maintain signal integrity and efficient current flow. The contact system is designed to provide consistent electrical performance across repeated insertions, ensuring reliability in both signal and power applications. Mechanical Characteristics The component features a robust insulating housing that maintains pin alignment and structural integrity during handling and operation. The contact pins are fabricated from conductive material and plated to enhance durability, conductivity, and مقاومت to corrosion. The through-hole mounting style provides strong mechanical anchoring to the printed circuit board, improving resistance to mechanical stress and vibration. The design supports reliable mating with compatible connectors and ensures long service life. Environmental Characteristics The TSW-106-07-G-S is constructed using materials that provide stable performance under typical environmental conditions encountered in electronic assemblies. It is designed to withstand standard temperature ranges and environmental stresses such as humidity and mechanical handling, maintaining electrical and mechanical reliability over time. Applications This header is widely used in embedded systems, industrial electronics, development platforms, communication equipment, and general-purpose PCB interconnect applications. It is especially suited for designs requiring modular connectivity, easy assembly, and dependable signal transfer. Summary The TSW-106-07-G-S from Samtec is a reliable through-hole header solution that combines mechanical durability with stable electrical performance. Its straightforward design, compatibility with standard interconnect systems, and suitability for a wide range of applications make it a common choice for board-level connectivity in modern electronic designs. #CommonPartsLibrary #Connector #Header #TSW

High-Side Gate Driver IC Non-Inverting 19-VSSOP The TPS48100QDGXRQ1 is an automotive-grade dual high-side gate driver integrated circuit manufactured by Texas Instruments. It is designed to drive external N-channel power MOSFETs configured as high-side switches, providing the gate-drive voltage and current needed to turn the switches fully on and off with controlled timing. The device targets automotive and other harsh-environment power switching applications where a robust, low quiescent current solution is needed to control loads such as motors, relays, solenoids, lighting, and other inductive or resistive loads powered from a vehicle battery rail. As a member of TI's automotive low-IQ high-side driver portfolio, the device is built to tolerate the wide voltage swings and transient conditions characteristic of automotive electrical systems, including load dump events and cold-crank voltage sags, while maintaining very low standby current draw when the driven loads are not active. This low quiescent current characteristic is particularly valuable in always-on automotive modules, where minimizing parasitic battery drain during vehicle-off states is a key design requirement. The device's two independent driver channels operate synchronously, allowing coordinated control of dual high-side switches from a shared set of control and protection circuitry, which is useful in applications such as dual-channel load switching, H-bridge-adjacent driver stages, or redundant power path control. The non-inverting input structure means that the gate driver outputs follow the logic state of the input control signals directly, simplifying integration with microcontroller-based control logic without requiring additional inverting stages. Internally, the device manages the charge pump or bootstrap circuitry needed to generate a gate voltage above the battery rail, which is necessary to fully enhance an N-channel MOSFET configured in the high-side position. This internal voltage generation simplifies the external bill of materials compared to discrete charge-pump driver implementations. The device is qualified to automotive electronics reliability standards, reflecting the rigorous stress testing and quality requirements expected of components used in vehicle electrical and powertrain-adjacent systems. It is housed in a small-outline surface-mount package suited to space-constrained automotive control module designs, and it is supplied in tape-and-reel or cut-tape packaging formats to support both high-volume automated assembly and lower-volume prototyping needs. Spec Sheet Identification Part Number: TPS48100QDGXRQ1 Device Family: TPS48100-Q1 Manufacturer: Texas Instruments Functional Classification Device Type: Dual high-side gate driver IC Driven Configuration: High-side Channel Type: Synchronous, dual independent drive channels Gate Type Driven: N-channel power MOSFET Input Logic: Non-inverting Electrical Characteristics Supply Voltage Range: Wide automotive-class supply range Quiescent Current: Low-IQ class, optimized for always-on automotive modules Output Drive Current: Symmetric source and sink peak output current Internal Gate Drive Generation: Integrated charge pump/bootstrap-style high-side gate drive generation Protection & Diagnostics Application Context: Suited for protected high-side switching designs typical of the automotive driver family Robustness: Designed to tolerate automotive transient and load-dump conditions Environmental & Qualification Temperature Grade: Extended automotive operating temperature range Automotive Qualification: AEC-Q100 qualified RoHS Compliance: Yes Package Package Type: Small-outline surface-mount package, VSSOP style Mounting: Surface mount technology (SMT) Packaging Format Supply Format: Tape-and-reel, cut-tape, or reel-on-demand packaging options #TPS48100 #TexasInstruments #GateDriver #HighSideDriver #AutomotiveIC #AECQ100 #PowerManagement #MOSFETDriver #LowIQ #VSSOP #SurfaceMount #AutomotiveElectronics #PowerSwitching #SemiconductorIC #EngineeringSpec #ComponentLibrary #CommonPartsLibrary #RoHSCompliant #VehicleElectronics #PCBDesign

2 Position Wire to Board Terminal Block Horizontal with Board 0.200" speaker terminal block 2 pin 5.08mm AK300/3 KF301-2P 5.08mm The 277-1247-ND connector is an electronic interconnect component intended for establishing reliable electrical connections between conductors or between a conductor and a printed circuit assembly. It is designed for ease of installation, secure retention, and consistent electrical performance in low- to moderate-power applications. The connector supports efficient wiring configurations while maintaining mechanical stability and minimizing contact resistance. It is suitable for use in prototyping, industrial assemblies, and general-purpose electronic systems where dependable connectivity and repeatable termination are required. Engineering Specification The connector shall provide a stable electrical interface capable of maintaining low contact resistance under specified operating conditions. It shall be constructed from materials that ensure adequate conductivity, corrosion resistance, and mechanical durability over its intended service life. The housing shall be fabricated from an insulating material with sufficient ताप resistance and dielectric strength to prevent electrical leakage or shorting during normal operation. The contact mechanism shall support secure wire or terminal engagement, preventing accidental disconnection due to vibration or handling. The connector shall accommodate compatible wire gauges within its rated range and ensure proper clamping or retention without causing conductor damage. Electrical ratings shall align with standard low-voltage applications, including defined limits for current and voltage handling. Mechanical dimensions shall conform to manufacturer-defined tolerances to ensure compatibility with mating components or mounting interfaces. The connector shall be designed for straightforward installation using common tools or manual insertion methods, depending on its termination style. Environmental performance shall include resistance to typical ambient conditions such as humidity and moderate temperature variation, without degradation of electrical or mechanical properties. The connector shall meet applicable industry standards for safety and performance where relevant. #CommonPartsLibrary #Connector #COMBICON MKDSN

Connector Header Through Hole 6 position 0.100" (2.54mm) The TSW-103-07-G-D is a through-hole, dual-row (2×3) male pin header from the TSW series of Samtec. It is designed for board-to-board or cable-to-board interconnections, using a standard 2.54 mm (0.1″) pitch, making it widely compatible with common PCB layouts and prototyping systems. This connector features gold-plated square posts for reliable electrical contact and durability, and is commonly used in embedded systems, development boards, and general electronics applications. Key Features Connector Type: Male pin header (unshrouded) Number of Positions: 6 pins (2 rows × 3 pins) Pitch: 2.54 mm (0.100″) standard spacing Mounting Type: Through-hole soldering Contact System: 0.025″ (0.635 mm) square post Contact Material: Phosphor bronze with gold plating Orientation: Vertical (straight) Row Spacing: 2.54 mm Operating Temperature: −55 °C to +125 °C Insulator Material: PBT (UL94 V-0 rated) Typical Use: Board-to-board or cable interface AVR ISP 2x3 2.54mm header #commonpartslibrary #connector #header