• MLX90640ESF-BAB-000-TU

    MLX90640ESF-BAB-000-TU

    Thermal Image Sensor 32H x 24V TO-39 # MLX90640ESF-BAB-000-TU Engineering Specifications **General Description** The MLX90640ESF-BAB-000-TU is a contactless infrared thermal imaging sensor manufactured by Melexis. It incorporates a microbolometer array that detects infrared radiation emitted by objects and converts the captured thermal energy into temperature data, enabling the creation of thermal images without physical contact. The device is designed for compact and cost-effective thermal imaging applications, offering high thermal sensitivity and accurate temperature measurement capabilities. It integrates a digital signal-processing engine, calibration data memory, and a digital communication interface, allowing direct connection to microcontrollers, embedded systems, and industrial monitoring equipment. The sensor provides real-time thermal mapping across its field of view and is suitable for applications involving human presence detection, predictive maintenance, industrial automation, smart building systems, medical screening, consumer electronics, robotics, and thermal monitoring solutions. Its factory calibration ensures stable performance throughout its operating life while minimizing external calibration requirements. **Engineering Specifications** **Manufacturer:** Melexis **Manufacturer Part Number:** MLX90640ESF-BAB-000-TU **Component Type:** Infrared thermal imaging sensor **Sensor Technology:** Microbolometer thermal sensor array **Measurement Method:** Non-contact infrared temperature sensing **Output Type:** Digital thermal image data **Communication Interface:** I²C-compatible serial interface **Temperature Measurement Capability:** Object temperature monitoring and thermal imaging **Thermal Imaging Function:** Real-time thermal map generation **Integrated Processing:** On-chip signal processing and calibration management **Calibration:** Factory calibrated with stored calibration parameters **Power Supply Configuration:** Single-supply operation **Power Consumption:** Optimized for low-power embedded applications **Refresh Rate:** Programmable thermal frame refresh operation **Thermal Sensitivity:** High-sensitivity infrared detection **Field of View Variant:** Wide-angle thermal imaging configuration **Accuracy Characteristics:** High-precision temperature measurement with integrated compensation algorithms **Memory Features:** Internal EEPROM for calibration coefficients **Operating Mode:** Continuous and programmable thermal acquisition **Data Output Format:** Digital temperature and thermal pixel information **Environmental Stability:** Designed for reliable operation across varying ambient conditions **Electromagnetic Compatibility:** Suitable for embedded and industrial electronic systems **Package Type:** Surface-mount package with infrared-transparent window **Mounting Style:** Surface mount technology **Package Construction:** Reflow-solderable assembly **Lead Finish:** Lead-free finish **Environmental Compliance:** RoHS compliant and halogen-free **Reliability Features:** Factory-tested and production-calibrated thermal imaging device **Typical Applications** Thermal cameras Human presence detection systems Occupancy monitoring Industrial predictive maintenance Electrical equipment inspection Smart building automation HVAC monitoring systems Medical screening devices Consumer electronics Robotics and autonomous systems Fire detection and prevention systems Industrial process monitoring Energy management systems Automotive thermal sensing applications Security and surveillance equipment #MLX90640 #MLX90640ESF #Melexis #ThermalSensor #InfraredSensor #ThermalImaging #Microbolometer #TemperatureSensor #IndustrialAutomation #EmbeddedSystems #IoT #PredictiveMaintenance #SmartBuilding #ThermalCamera #ElectronicComponents #EngineeringSpecifications

    adrian95

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  • SAM-M10Q-00B

    SAM-M10Q-00B

    # SAM-M10Q-00B Engineering Specifications **General Description** The SAM-M10Q-00B is a compact, ultra-low-power Global Navigation Satellite System receiver module manufactured by u-blox. It is designed to provide highly accurate positioning, navigation, and timing information for battery-powered and space-constrained applications. Built on the u-blox M10 positioning platform, the module supports concurrent reception of multiple satellite constellations, enabling improved positioning accuracy, faster acquisition times, and enhanced reliability in challenging environments such as urban canyons and partially obstructed outdoor locations. Its optimized power architecture significantly reduces energy consumption while maintaining continuous navigation performance. The integrated antenna architecture and compact system-in-package design simplify hardware development by reducing external component requirements. The module is suitable for asset tracking, wearable devices, Internet of Things systems, industrial monitoring equipment, smart city infrastructure, agricultural applications, and portable navigation products. Designed for high-volume embedded applications, the SAM-M10Q-00B combines advanced GNSS technology, low power consumption, and robust positioning performance in a miniature surface-mount package. **Engineering Specifications** **Manufacturer:** u-blox **Manufacturer Part Number:** SAM-M10Q-00B **Component Type:** GNSS receiver module **Technology:** Multi-constellation satellite positioning receiver **GNSS Platform:** u-blox M10 positioning technology **Navigation Function:** Global positioning, navigation, and timing **Satellite Reception:** Concurrent multi-constellation GNSS tracking **Supported Systems:** GPS, Galileo, GLONASS, BeiDou and regional augmentation services **Receiver Architecture:** High-sensitivity GNSS receiver **Positioning Capability:** Real-time location tracking and navigation **Acquisition Performance:** Fast satellite acquisition and reacquisition **Tracking Performance:** Continuous satellite tracking under dynamic conditions **Position Accuracy:** High-precision navigation performance **Sensitivity:** Optimized for weak-signal environments **Power Consumption:** Ultra-low-power operation **Power Supply Configuration:** Single-supply operation **Data Interface:** Serial communication interface for host processor integration **Communication Protocols:** Standard GNSS navigation messaging support **Integrated Features:** Embedded antenna solution and RF front-end integration **Startup Modes:** Cold start, warm start and hot start operation **Timing Capability:** Precision timing and synchronization support **Interference Mitigation:** Advanced signal-processing algorithms for improved reception **System Integration:** Designed for compact embedded applications **Environmental Performance:** Reliable operation in outdoor and industrial environments **Operating Temperature Range:** Industrial temperature range **Package Type:** System-in-package GNSS module **Mounting Style:** Surface mount technology **Package Construction:** Compact low-profile module **Environmental Compliance:** RoHS compliant and lead-free **Reliability Features:** Designed for long-term embedded operation and high-volume production **Typical Applications** Asset tracking devices Internet of Things systems Wearable electronics Portable navigation equipment Fleet management systems Smart city infrastructure Industrial monitoring equipment Agricultural positioning systems Environmental data loggers Personal tracking devices Drone navigation systems Geolocation-enabled sensors Telematics systems Logistics and transportation tracking Battery-powered embedded products #SAMM10Q00B #SAMM10Q #uBlox #GNSS #GPSModule #SatelliteNavigation #PositioningSystem #IoT #AssetTracking #WearableTechnology #EmbeddedSystems #NavigationModule #Telematics #LocationTracking #ElectronicComponents #EngineeringSpecifications

    adrian95

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  • TLV320ADC3120IRTER

    TLV320ADC3120IRTER

    ADC, Audio 32 b 7.35k ~ 768k I2C, I2S, TDM 20-WQFN (3x3) The TLV320ADC3120IRTER is a low-power, high-performance stereo audio analog-to-digital converter designed for voice, audio capture, and digital signal processing applications. The device integrates programmable microphone bias generation, low-noise input amplifiers, digital filtering, automatic gain control, and high-resolution audio conversion into a compact package. It supports a wide range of analog microphone and line-level input configurations while delivering excellent audio fidelity and power efficiency. The converter is optimized for portable electronics, smart devices, industrial audio systems, communication equipment, and embedded voice-processing applications requiring high-quality audio digitization. Engineering Specifications Manufacturer: Texas Instruments Part Number: TLV320ADC3120IRTER Device Type: Stereo Audio Analog-to-Digital Converter Audio Channels: Stereo Input Architecture Converter Type: Sigma-Delta Analog-to-Digital Converter Resolution: High-Resolution Audio Conversion Input Configuration: Differential and Single-Ended Inputs Microphone Support: Integrated Microphone Bias Generation Programmable Gain: Integrated Low-Noise Programmable Gain Amplifiers Digital Processing: Integrated Digital Filters Automatic Gain Control: Supported Audio Interface: Digital Audio Serial Interface Power Consumption: Low Power Operation Clocking Support: Flexible Audio Clock Configuration Noise Performance: Low Noise Audio Acquisition Dynamic Range: High Dynamic Range Package Type: WQFN Package Mounting Style: Surface Mount Operating Temperature Range: Industrial Grade RoHS Compliant: Yes Applications: Voice Capture Systems, Smart Speakers, Audio Recording Equipment, Industrial Audio Devices, Communication Systems, Embedded Audio Platforms, Human Machine Interfaces, Portable Electronics Key Features High-performance stereo audio conversion Integrated microphone bias circuitry Low-noise programmable gain amplifiers Automatic gain control functionality Flexible digital audio interface support Optimized for voice and audio capture applications Low power consumption for portable devices Integrated digital signal processing features High audio fidelity and dynamic range Compact surface-mount package for space-constrained designs #TLV320ADC3120IRTER #TexasInstruments #AudioADC #AudioConverter #StereoADC #DigitalAudio #VoiceCapture #AudioProcessing #EmbeddedAudio #MicrophoneInterface #AudioElectronics #DSP #IndustrialElectronics #SmartDevices #PortableElectronics #SignalProcessing #SurfaceMount #ElectronicComponents #PCBDesign #AudioSystemDesign

    adrian95

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  • ES9082Q

    ES9082Q

    Audio D/A Converter ICs SABRE 8 Channel Smart DAC with Line Drivers, ASP2, 7mmx7mm, 48-QFN The ES9082Q is a high-performance stereo digital-to-analog converter (DAC) developed by ESS Technology for premium audio applications requiring exceptional sound quality, low power consumption, and compact integration. It utilizes the patented HyperStream® architecture and Time Domain Jitter Eliminator technology to deliver highly accurate audio reproduction with ultra-low distortion and noise characteristics. The device supports high-resolution PCM and DSD audio formats, making it suitable for portable audio devices, USB DACs, digital media players, automotive infotainment systems, wireless audio products, and professional audio equipment. The ES9082Q integrates advanced digital filtering, low-jitter clock management, and flexible audio interface support while maintaining efficient power operation for battery-powered applications. Designed for compact embedded audio systems, the ES9082Q provides excellent dynamic range and signal fidelity while minimizing external component requirements. Its architecture enables high-quality playback performance across a wide range of consumer and industrial audio applications. Electrical Characteristics Supply voltage supports low-voltage digital and analog power domains optimized for portable and embedded applications. The device operates with low power consumption while maintaining high audio performance. Integrated power management supports efficient system-level implementation. Audio Performance The converter supports high-resolution stereo audio output with advanced oversampling and noise shaping technology. It delivers ultra-low total harmonic distortion plus noise performance and high dynamic range suitable for high-fidelity audio playback systems. PCM audio data rates support standard and high-resolution formats up to 32-bit depth with sampling frequencies extending to high-definition audio ranges. Native DSD playback capability is also supported for audiophile-grade applications. Digital Audio Interface The ES9082Q supports industry-standard serial audio interfaces including I²S, left-justified, and related digital audio communication protocols. Flexible master and slave clocking configurations enable compatibility with a wide variety of host processors and audio controllers. Integrated jitter suppression circuitry improves clock stability and minimizes timing-induced audio artifacts. Integrated Features The device incorporates digital interpolation filters, volume control functions, soft mute capability, and programmable audio processing features. Internal PLL and clock management circuitry reduce external timing component requirements. Built-in low-noise analog output stages simplify audio signal chain design and reduce overall PCB footprint. Package Information The ES9082Q is provided in a compact surface-mount package optimized for space-constrained audio products. The package supports automated assembly and high-density PCB layouts commonly used in portable and embedded systems. Typical Applications Applications include portable audio players, USB DAC modules, wireless speakers, automotive audio systems, headphones, digital amplifiers, embedded multimedia devices, smart home audio equipment, and professional audio playback systems. #commonpartslibrary #integratedcircuit #audioic #dac #stereodac #esstechnology #es9082q #highresolutionaudio #audiophile #digitalaudio #analogaudio #i2s #dsd #pcm #embeddedaudio #consumerelectronics #portableaudio #usbdac #hifi #signalprocessing #lownoise #lowdistortion #electronicsdesign #pcbdesign #hardwareengineering #electroniccomponents #semiconductor #mixedsignal #audioelectronics #soundquality

    adrian95

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  • RFFC5072

    RFFC5072

    The RFFC5072 is a highly integrated wideband RF frequency conversion IC that combines a fractional-N PLL synthesizer, low phase-noise VCO, and a high-linearity RF mixer in a single device. It is designed for wireless infrastructure, software-defined radio (SDR), test equipment, military communications, and broadband frequency conversion applications. The device can generate local oscillator (LO) frequencies from 85 MHz to 4.2 GHz and perform frequency conversion for RF signals up to 6 GHz while maintaining excellent phase noise and spurious performance. Features  85MHz to 4200MHz LO Frequency Range  Fractional-N Synthesizer with Very Low Spurious Levels  Typical Step Size 1.5Hz  Fully Integrated Low Phase Noise VCO and LO Buffers  Integrated Phase Noise • 0.18° rms at 1GHz • 0.50° rms at 3GHz  High Linearity RF Mixer(s)  30MHz to 6000MHz Mixer Frequency Range  Input IP3 +23dBm  Mixer Bias Adjustable for Low Power Operation  Full Duplex Mode (RFFC5071)  2.7V to 3.3V Power Supply  Low Current Consumption  3- or 4-Wire Serial Interface Applications  Wideband Radios  Distributed Antenna Systems  Diversity Receivers  Software Defined Radios  Frequency Band Shifters  Point-to-Point Radios  WiMax/LTE Infrastructure  Satellite Communications  Wideband Jammers #RFFC5072 #Qorvo #RFMixer #FrequencySynthesizer #PLL #VCO #WidebandRF #FrequencyConverter #SDR #WirelessInfrastructure #RFDesign #MicrowaveEngineering #Telecommunications #EmbeddedSystems #ElectronicsDesign #RFIC #SignalProcessing #HardwareEngineering

    adrian95

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  • GW2ANR-LV18QN88C8_I7

    GW2ANR-LV18QN88C8_I7

    GW2AR-LV18QN88C8/I7 GOWIN GW2ANR series FPGA, non-volatile Arora family FPGA with integrated SDRAM and NOR Flash, fabricated on 55nm SRAM technology, 1.0V core voltage, low-power architecture with dynamic clock control, high-performance DSP resources, high-speed LVDS interfaces, abundant block SRAM memory, hot-swap support, configurable I/O standards including LVCMOS, LVTTL, SSTL, HSTL, PCI, LVDS and MLVDS, programmable drive strength and pull-up/pull-down options, designed for high-speed, low-cost embedded, industrial, communication and signal-processing applications. Search Keywords: GW2ANR, GOWIN GW2ANR, Arora FPGA, GOWIN FPGA, non volatile FPGA, FPGA with SDRAM, FPGA with NOR Flash, 55nm FPGA, low power FPGA, LVDS FPGA, DSP FPGA, embedded FPGA, GW2ANR series, GOWIN Arora family, programmable logic device Hashtags: #GW2ANR #GOWINGW2ANR #GOWINFPGA #AroraFPGA #FPGAFPGA - Field Programmable Gate Array GW2ANR-LV18QN88C8/I7

    cherepanyadima

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  • ESP32-S3-WROOM-1-N8

    ESP32-S3-WROOM-1-N8

    ESP32-S3-WROOM-1-N8 is a high-performance Wi-Fi and Bluetooth Low Energy (BLE) module from Espressif Systems. It is built around the ESP32-S3 SoC, featuring a dual-core Xtensa LX7 processor, integrated 2.4 GHz Wi-Fi and Bluetooth 5 LE connectivity, 8 MB SPI flash memory, and a PCB antenna. The module is optimized for AIoT, edge computing, human-machine interfaces, smart devices, and industrial IoT applications. Key Features Dual-core Xtensa® LX7 CPU running up to 240 MHz for high-performance embedded applications. 8 MB onboard SPI Flash (N8 variant) for firmware and data storage. 2.4 GHz Wi-Fi (802.11 b/g/n) with data rates up to 150 Mbps. Bluetooth 5 LE support including: Long Range mode 2 Mbps PHY Bluetooth Mesh Extended Advertising AI acceleration support through ESP32-S3 vector instructions for machine learning and signal-processing workloads. USB 1.1 OTG and USB Serial/JTAG integrated, simplifying debugging and USB device applications. Up to 45 GPIOs with extensive peripheral support: SPI I²C I²S UART PWM ADC Touch Sensors TWAI® (CAN-compatible) Camera Interface LCD Interface SDIO Host MCPWM Integrated 40 MHz crystal oscillator, RF matching circuitry, and PCB antenna for reduced external component count. Operating voltage range: 3.0 V to 3.6 V. Compact surface-mount module suitable for space-constrained designs. Typical Applications Smart home and home automation devices HMI displays and touchscreen products Voice recognition and audio processing Edge AI and machine learning applications Industrial IoT gateways and sensors Video streaming and camera systems USB-connected embedded devices Smart agriculture and healthcare equipment N8 specifically indicates 8 MB Flash and no PSRAM, making it a good choice for applications requiring substantial program storage but not large external RAM. #RF-transceiver #Module #ESP32

    lcsc

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    jharwinbarrozo
    adrian95

    82 Uses

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  • MAX98357AETE+T

    MAX98357AETE+T

    Tiny, Low-Cost, PCM Class D Amplifier with Class AB Performance The MAX98357AETE+T is a highly integrated digital input Class-D audio amplifier designed to convert digital audio streams directly into high-efficiency speaker output signals. It features an integrated digital-to-analog conversion stage and Class-D output driver, eliminating the need for an external DAC and significantly simplifying audio system design. The device accepts digital audio data through a standard I²S interface and delivers high-quality audio output suitable for portable electronics, smart speakers, embedded systems, Internet of Things devices, multimedia products, and consumer audio equipment. Its high-efficiency architecture minimizes power dissipation while maintaining excellent audio performance, making it particularly suitable for battery-powered applications. The MAX98357AETE+T incorporates advanced audio processing capabilities, low electromagnetic interference characteristics, and integrated protection features to ensure reliable operation in compact embedded audio designs. Features Digital input Class-D audio amplifier Integrated digital-to-analog conversion functionality Direct I²S audio interface support High-efficiency power amplification architecture Filterless output design Compact surface-mount package Low electromagnetic interference operation Integrated click-and-pop suppression Low power consumption High audio fidelity performance Simplified external component requirements Integrated thermal protection Short-circuit protection capability Suitable for mono speaker applications Optimized for embedded audio systems Electrical Characteristics Digital audio input architecture Class-D switching amplifier topology High-efficiency power conversion Low distortion audio reproduction Wide operating supply range Low standby power consumption Direct speaker drive capability Integrated audio signal processing functions Applications Smart speakers Embedded audio systems Internet of Things devices Portable electronics Voice-enabled products Multimedia equipment Consumer audio devices Wireless audio products Home automation systems Educational and development platforms Battery-powered audio applications Human-machine interface systems Package Information TQFN surface-mount package Compact footprint for space-constrained designs Suitable for automated PCB assembly Thermally optimized package construction High-density electronic product integration #commonpartslibrary #integratedcircuit #audio #audioamplifier #classd amplifier #digitalaudio #i2s #dac #embeddedaudio #consumerelectronics #iot #multimedia #signalprocessing #powermanagement #maximintegrated #analogdevices #electronicsdesign #audioelectronics #speakerdriver #embeddedsystems

    lcsc

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    jharwinbarrozo
    adrian95

    44 Uses

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  • ESP32-S3FH4R2

    ESP32-S3FH4R2

    2.4GHz Wi-Fi+Bluetooth LE SoC ESP32-S3FH4R2 is a highly integrated low-power Wi-Fi and Bluetooth LE System-on-Chip (SoC) from Espressif Systems. It is based on a dual-core Xtensa® LX7 processor running at up to 240 MHz and is designed for IoT, smart home, industrial control, AIoT, audio processing, and embedded applications. The ESP32-S3FH4R2 variant includes 4 MB of in-package Quad SPI Flash and 2 MB of in-package Quad SPI PSRAM, reducing external component count and simplifying PCB design. Key Features Dual-core Xtensa® LX7 CPU Up to 240 MHz operating frequency 32-bit architecture with floating-point unit (FPU) SIMD instructions for AI and signal-processing workloads Integrated Memory 4 MB in-package Flash 2 MB in-package PSRAM 512 KB on-chip SRAM 384 KB ROM Additional RTC memory for low-power operation Wireless Connectivity IEEE 802.11 b/g/n 2.4 GHz Wi-Fi Bluetooth® 5 Low Energy (LE) Long-range and low-power wireless communication support Rich Peripheral Set Up to 45 programmable GPIOs USB OTG and USB Serial/JTAG SPI, I²C, I²S, UART, SDIO TWAI® (CAN 2.0 compatible) Camera interface LCD interface PWM, pulse counter, RMT, DMA controller Analog Features Two 12-bit SAR ADCs Temperature sensor 14 capacitive touch sensing inputs Security Features Secure Boot Flash Encryption AES, SHA, RSA, HMAC hardware accelerators True Random Number Generator (RNG) Digital Signature peripheral Low-Power Operation Multiple power-saving modes ULP-RISC-V coprocessor ULP-FSM coprocessor Deep-sleep support with RTC memory retention

    lcsc

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    jharwinbarrozo
    adrian95

    22 Uses

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  • SN74LS181N

    SN74LS181N

    Arithmetic Logic Unit IC 24-PDIP The SN74LS181N is a high-speed, 4-bit arithmetic logic unit (ALU) designed for digital computing and logic operations in microprocessor, computer, and embedded system applications. It integrates a full set of arithmetic and logical functions, including addition, subtraction, AND, OR, XOR, and comparison operations, in a single package. The device features fast switching times, TTL-compatible inputs, and outputs suitable for cascading multiple units for extended-bit operations. Its robust design ensures reliable digital processing across a wide operating voltage and temperature range, making it ideal for educational computing systems, programmable logic devices, industrial controllers, and digital signal processing circuits. Engineering Specifications Manufacturer: Texas Instruments Part Number: SN74LS181N Device Type: 4-Bit Arithmetic Logic Unit (ALU) Logic Family: LS-TTL (Low-Power Schottky TTL) Functionality: Arithmetic and Logical Operations (Add, Subtract, AND, OR, XOR, Compare) Data Width: 4 Bits Inputs: TTL-Compatible Logic Inputs Outputs: TTL-Compatible Logic Outputs Carry Handling: Lookahead Carry Support for High-Speed Operation Propagation Delay: Fast Switching for Digital Computation Power Supply: Standard TTL Supply Voltage Package Type: Dual In-Line Package (DIP) Mounting Style: Through-Hole Operating Temperature Range: Commercial/Industrial Grade RoHS Compliant: Yes Applications: Digital Computing, Educational Microprocessor Systems, Industrial Control, Programmable Logic Circuits, Digital Signal Processing, Embedded Computing, Logic Design Learning Kits Key Features 4-bit wide ALU with full arithmetic and logic operations TTL-compatible inputs and outputs for easy integration Fast switching speed for high-performance digital systems Supports cascading for multi-bit operations Lookahead carry capability for efficient addition/subtraction Robust and reliable operation across standard voltage and temperature ranges Compact dual in-line package suitable for through-hole PCB mounting Ideal for embedded systems, educational projects, and industrial logic applications #SN74LS181N #TexasInstruments #ALU #ArithmeticLogicUnit #DigitalElectronics #TTL #LS_TTL #DigitalComputing #EmbeddedSystems #IndustrialElectronics #LogicDesign #MicroprocessorInterface #ProgrammableLogic #SignalProcessing #ThroughHole #ElectronicComponents #PCBDesign #HighSpeedLogic #DigitalCircuit

    adrian95

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