3D Camera Module is a scalable SPI enabled 4 camera array pinout for 3D photogrammetry reconstruction which uses I2C to connect between each module to expand camera capacity while keeping capture sequences in sync. It uses ATMega32U4 with its built in USB 2.0 for data transfer and camera array adjustments and capture as well as a micro SD card slot for local image storage. An interrupt logic pinout should be used on the SPI master module as capture command. Each module is powered via USB-C (5V) or barrel jack (12V regulated to 5V).

16V 20A Scalable DC/DC Power Module with PMBus #ultralibrarian

Compute Module 5 is a powerful and scalable system on module with a 64-bit Arm processor @ 2.4GHz, an I/O controller, video and PCIe interfaces, and a range of wireless, SDRAM and eMMC options. raspberry pi5 #rpi #pi

3D Camera Module is a scalable SPI enabled 4 camera array pinout for 3D photogrammetry reconstruction which uses I2C to connect between each module to expand camera capacity while keeping capture sequences in sync. It uses ATMega32U4 with its built in USB 2.0 for data transfer and camera array adjustments and capture as well as a micro SD card slot for local image storage. An interrupt logic pinout should be used on the SPI master module as capture command. Each module is powered via USB-C (5V) or barrel jack (12V regulated to 5V).

3D Camera Module is a scalable SPI enabled 4 camera array pinout for 3D photogrammetry reconstruction which uses I2C to connect between each module to expand camera capacity while keeping capture sequences in sync. It uses ATMega32U4 with its built in USB 2.0 for data transfer and camera array adjustments and capture as well as a micro SD card slot for local image storage. An interrupt logic pinout should be used on the SPI master module as capture command. Each module is powered via USB-C (5V) or barrel jack (12V regulated to 5V).

Introducing our innovative modular, AI-powered DIY laptop carrier board project! This design focuses on a step-by-step approach, starting with a solid architectural scaffold that lays the groundwork for a high-performance system. The project is built around a hierarchical schematic structure including: • A Top Sheet outlining the system overview and power tree • SoM Connectors organized into three 100-pin assemblies (two CM4/5-compatible and one dedicated to high-speed operation) • Dedicated Power/PD management • An M.2 A+E interface for the Coral TPU (PCIe x1 from PORT0) • An M.2 M-key interface for an NVMe SSD (PCIe x2 from PORT1) • Comprehensive USB & Hub configurations • A microSD integration module • Supervisory and Reset controls The design aligns with cost-effective 4-layer board stackup practices (JLCPCB friendly) while following best high-speed design guidelines for USB/PCIe integrity. The integrated silkscreen placeholders feature custom sci-fi fonts for a unique, personal branding touch. Key routing notes include precise PCIe lane mappings based on the Orange Pi CM5 manual, ensuring clean ground return paths, effective decoupling, and proper AC-coupling placement. With paired USB hubs optimized for minimal depth and latency and robust power sequencing strategies, this project is poised to evolve into a high-speed, scalable prototype. #DIYElectronics #ModularDesign #PCBDesign #EmbeddedSystems #PCIe #USBDesign #OrangePiCM5 #TechInnovation #HighSpeedElectronics

ESP32 /eMMC Integration with Bidirectional Level Shifting Project Overview: This project aims to integrate an ESP32 microcontroller with an eMMC (embedded Multi Media Card) storage module to create a robust data processing and storage solution. The system utilizes bidirectional level shifting to ensure seamless communication between the 3.3V logic of the ESP32 and the 1.8V logic of the eMMC, enabling efficient data handling and processing. Objectives: Data Storage and Processing: Leverage the high-speed capabilities of the eMMC for data storage while offloading processing tasks from the ESP32 to enhance overall system performance. Voltage Level Compatibility: Implement a bidirectional level shifting solution to facilitate communication between the ESP32 and eMMC, ensuring signal integrity and compatibility across different voltage levels. Modular Design: Create a modular and scalable design that can be easily adapted for various applications, including IoT devices, data logging systems, and embedded applications. Key Components: ESP32 Microcontroller: A powerful microcontroller with integrated Wi-Fi and Bluetooth capabilities, ideal for IoT applications. eMMC Storage Module: A high-speed storage solution that provides ample memory for data-intensive applications. Bidirectional Level Shifter: A 20-channel level shifter (74LVC4245 and TXB0104D) to convert signals between 1.8V and 3.3V, ensuring reliable communication between the ESP32 and eMMC. Power Management: Utilize a MIC5205 LDO voltage regulator to step down the 3.3V supply to 1.8V for the eMMC, ensuring stable power delivery. Implementation Steps: Circuit Design: Design the circuit schematic, including connections for the ESP32, eMMC, level shifter, and power management components. PCB Layout: Create a PCB layout that optimizes trace lengths for high-speed signals, ensuring proper length matching and minimizing noise. Firmware Development: Develop firmware for the ESP32 to handle data reading, writing, and processing tasks, as well as managing communication with the eMMC. Testing and Validation: Conduct thorough testing to validate the functionality of the system, ensuring reliable data transfer and processing capabilities. Expected Outcomes: A fully functional system that demonstrates the integration of the ESP32 with eMMC storage, showcasing efficient data handling and processing. A modular design that can be adapted for various applications, providing a foundation for future projects in IoT and embedded systems.

This project is focused on designing a highly efficient PCB for a switching power supply using a robust selection of electronic components. Our design leverages a flyback topology featuring a ferrite transformer (options EE25 or EE33), a PWM integrated circuit (TL494, SG3525, or UC3842), and a power MOSFET (IRF840 or a similar alternative) for effective high-voltage switching. Fast and reliable rectification is ensured by using a Schottky diode (MBR20100 or FR107) along with a rectifier bridge built from four 1N4007 diodes or a dedicated 4A bridge. Key stabilization and regulation components include the TL431 reference regulator and a Zener diode for precise voltage control in critical areas. For input and output filtering, the design incorporates electrolytic capacitors (470 µF, 25 V for output and 400 V, 100 µF for input) and ceramic capacitors (ranging from 1 nF to 100 nF) to limit high-frequency noise. Additional safety and operational features are provided by an NTC (soft-start thermistor) to prevent current spikes, various resistors (from 1 Ω to 100kΩ), an optocoupler (PC817) for signal isolation, a switch, and a protection fuse. Before moving forward with a finalized PCB layout and schematic details, we need to clarify a few design choices: 1. Transformer Choice: Would you prefer using the EE25 or the EE33 ferrite transformer variant as the heart of the switching power supply design? This detailed approach ensures that the power supply not only meets rigorous performance and safety standards but also supports a reliable and scalable solution for various electronic applications. #PCBDesign #SwitchingPowerSupply #Electronics #SMPS #PowerElectronics #FlybackConverter #CircuitDesign #ElectronicsComponents

A scalable 4x camera array for 3D photogrammetry reconstruction which uses I2C to connect between each module.

16V 20A Scalable DC/DC Power Module with PMBus #ultralibrarian

3D Camera Module is a scalable SPI enabled 4 camera array pinout for 3D photogrammetry reconstruction which uses I2C to connect between each module to expand camera capacity while keeping capture sequences in sync. It uses ATMega32U4 with its built in USB 2.0 for data transfer and camera array adjustments and capture as well as a micro SD card slot for local image storage. An interrupt logic pinout should be used on the SPI master module as capture command. Each module is powered via USB-C (5V) or barrel jack (12V regulated to 5V).