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Y1
SCK
R9
Resistance
10kΩ
MOSI
microSD_CS
cam1_CS
dn
!RST
microSD_CS
!RST
MOSI
SDA
R5
Resistance
10kΩ
SCL
cam3_CS
cam3_CS
J3
cam4_CS
MOSI
MISO
SCL
SDA
MOSI
cam2_CS
dp
MISO
SCK
MISO
SCK
SCK
R7
Resistance
10kΩ
cam1_CS
trigger
J1
5V_DC1
C4
Capacitance
10uF
D4
5V_DC1
5V_DC1
C18
Capacitance
10uF
C13
Capacitance
10uF
5V_DC1
D5
C23
Capacitance
10nF
5V_DC1
C12
Capacitance
10uF
C19
Capacitance
10uF
5V_DC1
C21
Capacitance
10uF
VUSB
C15
Capacitance
10uF
5V_DC1
C14
Capacitance
10uF
C6
Capacitance
10uF
5V_DC1
C11
Capacitance
10uF
VUSB
H2
H4
J5
D3
R8
Resistance
1.5kΩ
H3
L1
Inductance
10uH
C3
Capacitance
10pF
H1
C1
Capacitance
22uF
RST_BTN
C5
Capacitance
10pF
U3
D2

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Scale Snap 3D

Scale Snap 3D thumbnail
3D Camera Module is a scalable SPI enabled 4 camera array pinout for 3D photogrammetry reconstruction which uses I2C to connect between each module to expand camera capacity while keeping capture sequences in sync. It uses ATMega32U4 with its built in USB 2.0 for data transfer and camera array adjustments and capture as well as a micro SD card slot for local image storage. An interrupt logic pinout should be used on the SPI master module as capture command. Each module is powered via USB-C (5V) or barrel jack (12V regulated to 5V).

Properties

Properties describe core aspects of the project.

Pricing & Availability

Distributor

Qty 1

Digi-Key

$13.14–$16.67

LCSC

$7.97–$7.98

Mouser

$10.76

Controls